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STATSCHIP[STATS ChipPAC, Ltd.]
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| Part No. |
LFBGA-H FBGA
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| OCR Text |
...GA), 0.80mm (WFBGA) and 0.55mm (ufbga) maximum thickness * Laminate substrate based package which enables 2 and 4 layers of routing flexibility
FEATURES
* Thin, lightweight, space saving package * Flexible body sizes range from 4mm x 4m... |
| Description |
Fine Pitch Ball Grid Array
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| File Size |
555.50K /
2 Page |
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ufbga Found Datasheets File :: 46 Search Time::2.781ms Page :: | <1> | 2 | 3 | 4 | 5 | |
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