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  LX550-7624 Datasheet PDF File

For LX550-7624 Found Datasheets File :: 77+       Page :: | <1> | 2 | 3 | 4 | 5 | 6 | 7 | 8 |   

    LX550-7620 LX550-7620-S LX550-7624 LX550-7617 LX550

ARTESYN[Artesyn Technologies]
Part No. LX550-7620 LX550-7620-S LX550-7624 LX550-7617 LX550
Description Flexible single and multiple outputs

File Size 47.82K  /  4 Page

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Amphenol Communications Solutions

Part No. 86093487624755E1LF
Description DIN Straight Header Solder-to-Board Style R/2 48 ways, Class II
Tech specs    

Official Product Page

HUA FENG CIRCUIT





    Microsemi, Corp.
MICROSEMI CORP-ANALOG MIXED SIGNAL GROUP
Part No. LX5503-LQ
Description InGaP HBT 5-6GHz Power Amplifier 5150 MHz - 5850 MHz RF/MICROWAVE NARROW BAND MEDIUM POWER AMPLIFIER

File Size 472.42K  /  13 Page

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Amphenol Communications Solutions

Part No. 86093487624765E1LF
Description DIN Straight Header Solder-to-Board Style R 48 ways, Class I
Tech specs    

Official Product Page

    MICROSEMI[Microsemi Corporation]
Part No. LX5503-LQ LX5503
Description InGaP HBT 5-6GHz Power Amplifier

File Size 469.73K  /  13 Page

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Amphenol Communications Solutions

Part No. 86092327624765E1LF
Description DIN Straight Header Solder-to-Board Style R 32 ways, Class I
Tech specs    

Official Product Page

    MICROSEMI CORP-ANALOG MIXED SIGNAL GROUP
Part No. LX5506-LQ
Description 4500 MHz - 6000 MHz RF/MICROWAVE WIDE BAND MEDIUM POWER AMPLIFIER

File Size 318.47K  /  9 Page

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Amphenol Communications Solutions

Part No. 86093487624H55E1LF
Description DIN Straight Header Solder-to-Board Style R/2 48 ways, Class II, with Harpoon
Tech specs    

Official Product Page

    MICROSEMI[Microsemi Corporation]
Part No. LX5506
Description InGaP HBT 4.5 - 6GHz Power Amplifier

File Size 496.83K  /  10 Page

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Amphenol Communications Solutions

Part No. 10148176-2410J13LF
Description DDR4 Memory Module Sockets,Vertical, Surface Mount, 288 Position, 0.85mm (0.0335in) pitch, 30u\\ Gold on Contact Area, Standard Housing and Latch, Solder tab,Metal tab, Without MYLAR
Tech specs    

Official Product Page

    Microsemi
Part No. LX5506-LQ
Description Wireless LAN Power Amplifier

File Size 273.93K  /  8 Page

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Amphenol Communications Solutions

Part No. 10148176-2401K13LF
Description DDR4 Memory Module Sockets,Vertical, Surface Mount, 288 Position, 0.85mm (0.0335in) pitch, 30u\\ Gold on Contact Area, Standard Housing and Latch, Solder tab,Metal tab, With MYLAR
Tech specs    

Official Product Page

   
Part No. LX5506E
Description From old datasheet system

File Size 320.37K  /  8 Page

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Amphenol Communications Solutions

Part No. 10148176-2420J13LF
Description DDR4 Memory Module Sockets,Vertical, Surface Mount, 288 Position, 0.85mm (0.0335in) pitch, 30u\\ Gold on Contact Area, Standard Housing and Latch, Solder tab,Metal tab, Without MYLAR
Tech specs    

Official Product Page

    SONY[Sony Corporation]
Part No. ILX550K
Description From old datasheet system
10680 pixel X 3 line CCD Linear Sensor (Color)

File Size 148.42K  /  11 Page

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Amphenol Communications Solutions

Part No. 67997-624
Description BergStik®, Board to Board connector, Unshrouded vertical header, Through Hole, Double Row, 24Positions, 2.54 mm (0.100in) Pitch
Tech specs    

Official Product Page

    MICROSEMI[Microsemi Corporation]
Part No. LX5506M
Description InGaP HBT 4.5 - 6GHz Power Amplifier

File Size 62.03K  /  2 Page

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Amphenol Communications Solutions

Part No. 86094327624755E1LF
Description DIN Straight Header Solder-to-Board Style R/2 32 ways, Class II
Tech specs    

Official Product Page

    AVAGO TECHNOLOGIES LIMI...
Part No. ACPF-7624
Description Wi-Fi Bandpass Filter

File Size 313.48K  /  3 Page

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Amphenol Communications Solutions

Part No. 10148176-2421K13LF
Description DDR4 Memory Module Sockets,Vertical, Surface Mount, 288 Position, 0.85mm (0.0335in) pitch, 30u\\ Gold on Contact Area, Standard Housing and Latch, Metal tab, Solder tab,With cap
Tech specs    

Official Product Page

For LX550-7624 Found Datasheets File :: 77+       Page :: | <1> | 2 | 3 | 4 | 5 | 6 | 7 | 8 |   

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