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Motorola, Inc. MOTOROLA[Motorola, Inc]
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| Part No. |
BSP62T1
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| OCR Text |
...perature gradient and result in latent failure due to mechanical stress. * Mechanical stress or shock should not be applied during cooling * Soldering a device without preheating can cause excessive thermal shock and stress which can result... |
| Description |
MEDIUM POWER PNP SILICON DARLINGTON TRANSISTOR SURFACE MOUNT
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| File Size |
178.97K /
6 Page |
View
it Online |
Download Datasheet
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Motorola, Inc. MOTOROLA[Motorola, Inc]
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| Part No. |
BSP16T1
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| OCR Text |
...perature gradient and result in latent failure due to mechanical stress. * Mechanical stress or shock should not be applied during cooling * Soldering a device without preheating can cause excessive thermal shock and stress which can result... |
| Description |
SOT-223 PACKAGE PNP SILICON HIGH VOLTAGE TRANSISTOR SURFACE MOUNT
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| File Size |
109.07K /
6 Page |
View
it Online |
Download Datasheet
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Price and Availability
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