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VISHAY SEMICONDUCTORS
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| Part No. |
BZD27-C30P BZD27-C150P/G1 BZD27-C62P BZD27-C16P BZD27-C6V2P
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| Description |
100 W, UNIDIRECTIONAL, SILICON, TVS DIODE, DO-219AB DIODE 150 W, UNIDIRECTIONAL, SILICON, TVS DIODE, DO-219AB, PLASTIC, SMF, 2 PIN, Transient Suppressor DIODE 6.2 V, 0.8 W, SILICON, UNIDIRECTIONAL VOLTAGE REGULATOR DIODE, DO-219AB, PLASTIC, SMF, 2 PIN, Voltage Regulator Diode
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| File Size |
113.58K /
5 Page |
View
it Online |
Download Datasheet
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Amphenol Communications Solutions |
| Part No. |
L717HDC62P
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| Description |
Dsub, Stamped Signal 3A, High Density, Straight Soldercup, 62 Pin, Flash Gold, 3.05mm (0.120in) Clear Hole, Without Bracket, Without Boardlock
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| Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
| Part No. |
L777HDC62PVF
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| Description |
Dsub, Stamped Signal 3A, High Density, Straight Soldercup, 62 Pin, 0.38m (15 in) Gold, Fixed 4-40 Front Screwlock, Without Bracket, Without Boardlock
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Official Product Page
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Amphenol Communications Solutions |
| Part No. |
L777HRC62PVFM
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| Description |
Dsub, Straight, High Density, Crimp & Poke, Bright Tin Shell+Grounding Dimplesl, 62 Pin, M3 Fixed Front Screwlock
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| Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
| Part No. |
L777HDC62PD1CH4R
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| Description |
Dsub, Stamped Signal 3A, High Density, Right Angle PCB Thru Hole, FP=8.89mm (0.35u\\), 62 Pin, 0.38m (15 in) Gold, 4-40 Rear Threaded Insert, Ground Tab, With Boardlock
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Official Product Page
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Amphenol Communications Solutions |
| Part No. |
L717HDC62PC309
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| Description |
Dsub, Stamped Signal 3A, High Density, Straight Soldercup, 62 Pin, 0.76m (30 in) Gold, 3.05mm (0.120in) Clear Hole, Without Bracket, Without Boardlock
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| Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
| Part No. |
L717HDC62POL2C309
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| Description |
Dsub, Stamped Signal 3A, High Density, Straight PCB Thru Hole, Back Insulator Plus Back Shell Height 6.0mm, 62 Pin, 0.76m (30 in) Gold, 3.05mm (0.120in) Clear Hole, Without Bracket, Without Boardlock
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| Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
| Part No. |
L777HDC62P
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| Description |
Dsub, Stamped Signal 3A, High Density, Straight Soldercup, 62 Pin, 0.38m (15 in) Gold, 3.05mm (0.120in) Clear Hole, Without Bracket, Without Boardlock
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| Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
| Part No. |
L717HDC62PD1CH4R
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| Description |
Dsub, Stamped Signal 3A, High Density, Right Angle PCB Thru Hole, FP=8.89mm (0.35u\\), 62 Pin, Flash Gold, 4-40 Rear Threaded Insert, Ground Tab, With Boardlock
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| Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
| Part No. |
L717HDC62PD1CH3FC309
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| Description |
Dsub, Stamped Signal 3A, High Density, Right Angle PCB Thru Hole, FP=8.89mm (0.35u\\), 62 Pin, 0.76m (30 in) Gold, M3 Front Screwlock, Ground Tab, With Boardlock
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| Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
| Part No. |
L777HRC62P
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| Description |
Dsub, Straight, High Density, Housing only, Crimp & Poke, Bright Tin Shell+Grounding Dimples, Bright Tin Shell, 62 Pin, 3.05mm (0.120in) Clear Hole
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| Tech specs |
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Official Product Page
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Price and Availability
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| Part: BZD27-C62 |
| Maker: |
| Pack: |
| Stock: |
| Unit price
for : |
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50: $0.04 |
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100: $0.04 |
| 1000:
$0.03 |
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