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  bottom-brazed Datasheet PDF File

For bottom-brazed Found Datasheets File :: 77    Search Time::2.625ms    
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    AD630 AD630A AD630AD AD630B AD630BD AD630J AD630JCHIPS AD630JN AD630K AD630KN AD630S AD630SCHIPS AD630SD AD630SE 5962-89

AD[Analog Devices]
Analog Devices, Inc.
Part No. AD630 AD630A AD630AD AD630B AD630BD AD630J AD630JCHIPS AD630JN AD630K AD630KN AD630S AD630SCHIPS AD630SD AD630SE 5962-8980701RA 5962-89807012A AD883B
OCR Text ... 10 0% 20mV TOP TRACE: Vo BOTTOM TRACE: Vi 16 5k 15 2 20 19 18 10k 14 Vi 9 10 CH B CH A 10k 500ns 100mV/DIV (Vo) 100mV 500ns 10V TOP TRACE: Vi MIDDLE TRACE: SETTLING ERROR (B) BOTTOM TRACE: Vo 10k TOP TRACE: Vi MI...
Description    Balanced Modulator/Demodulator
Balanced Modulator/Demodulator SPECIALTY CONSUMER CIRCUIT, CDIP20
Balanced Modulator/Demodulator 平衡调制/解调
Balanced Modulator/Demodulator SPECIALTY CONSUMER CIRCUIT, UUC20
Balanced Modulator/Demodulator SPECIALTY CONSUMER CIRCUIT, CQCC20

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    UT54ACS190PCC UT54ACS190PCX UT54ACS190UCA UT54ACS190PCA UT54ACS190UCX UT54ACS191PCA UT54ACS191PCC UT54ACS191UCA UT54ACS1

Aeroflex Circuit Technology
Part No. UT54ACS190PCC UT54ACS190PCX UT54ACS190UCA UT54ACS190PCA UT54ACS190UCX UT54ACS191PCA UT54ACS191PCC UT54ACS191UCA UT54ACS191PCX UT54ACS191UCX UT54ACS193PCX UT54ACS193UCX UT54ACS193UCC UT54ACS193UCA UT54ACS193PCC UT54ACS193PCA UT54ACS191UCC UT54ACS190UCC UT54ACTS245UCX UT54ACTS245SPCA UT54ACTS245SUCC UT54ACTS245PCC UT54ACTS245SUCX UT54ACTS245PCX UT54ACTS245SUCA UT54ACTS245SPCX UT54ACTS245SPCC UT54ACTS245UCA UT54ACTS245UCC UT54ACTS245PCA UT54ACS245PCA UT54ACS151UCC UT54ACS151UCA UT54ACS151UCX UT54ACTS374PCA UT54ACTS374PCC UT54ACS374UCX UT54ACS374UCC UT54ACS374UCA UT54ACS374PCX UT54ACS374PCC UT54ACS374PCA UT54ACS264PCA UT54ACS264PCC UT54ACS264PCX UT54ACS264UCA UT54ACS264UCC UT54ACS264UCX UT54ACTS264PCC UT54ACTS264PCA UT54ACTS264PCX UT54ACTS264UCC UT54ACTS264UCA UT54ACTS264UCX UT54ACTS374UCX UT54ACTS374UCC UT54ACTS374PCX UT54ACS157UCX UT54ACS157UCC UT54ACTS157UCX UT54ACS169UCA UT54ACS109UCA UT54ACS139UCX UT54ACS169UCX UT54ACS279UCA UT54ACS279UCC UT54ACTS169UCX UT54ACTS279UCX
OCR Text ...razed dip (u) = 14-lead ceramic bottom-brazed dual-in-line flatpack part number: (00) = quadruple 2-input nand (02) = quadruple 2-input nor (04) = hex inverter (08) = quadruple 2-input and (10) = triple 3-input nand (11) = triple 3-in...
Description RadHard MSI. Synchronous 4-bit up/down BCD counter. CMOS compatible I/O level. Lead finish gold.
RadHard MSI. Synchronous 4-bit up/down BCD counter. CMOS compatible I/O level. Lead finish optional.
RadHard MSI. Synchronous 4-bit up/down BCD counter. CMOS compatible I/O level. Lead finish solder.
RadHard MSI. Synchronous 4-bit up/down binary counter. CMOS compatible I/O level. Lead finish solder.
RadHard MSI. Synchronous 4-bit up/down binary counter. CMOS compatible I/O level. Lead finish gold.
RadHard MSI. Synchronous 4-bit up/down binary counter. CMOS compatible I/O level. Lead finish optional.
RadHard MSI. Synchronous 4-bit up/down dual clock counter. CMOS compatible I/O level. Lead finish optional.
RadHard MSI. Synchronous 4-bit up/down dual clock counter. CMOS compatible I/O level. Lead finish gold.
RadHard MSI. Synchronous 4-bit up/down dual clock counter. CMOS compatible I/O level. Lead finish solder.
RadHard MSI. Octal bus transceiver with 3-state outputs. TTL compatible I/O level. Lead finish optional.
RadHard MSI. Schmitt octal bus transceiver with 3-state outputs. TTL compatible I/O level. Lead finish solder.
RadHard MSI. Schmitt octal bus transceiver with 3-state outputs. TTL compatible I/O level. Lead finish gold.
RadHard MSI. Octal bus transceiver with 3-state outputs. TTL compatible I/O level. Lead finish gold.
RadHard MSI. Schmitt octal bus transceiver with 3-state outputs. TTL compatible I/O level. Lead finish optional.
RadHard MSI. Octal bus transceiver with 3-state outputs. TTL compatible I/O level. Lead finish solder.
RadHard MSI. Octal bus transceiver with 3-state outputs. CMOS compatible I/O level. Lead finish solder.
RadHard MSI. 1 of 8 data selector/multiplexer. CMOS compatible I/O level. Lead finish gold.
RadHard MSI. 1 of 8 data selector/multiplexer. CMOS compatible I/O level. Lead finish solder.
RadHard MSI. 1 of 8 data selector/multiplexer. CMOS compatible I/O level. Lead finish optional.
RadHard MSI. Octal DFF with 3-state outputs. TTL compatible I/O level. Lead finish solder.
RadHard MSI. Octal DFF with 3-state outputs. TTL compatible I/O level. Lead finish gold.
RadHard MSI. Octal DFF with 3-state outputs. CMOS compatible I/O level. Lead finish optional.
RadHard MSI. Octal DFF with 3-state outputs. CMOS compatible I/O level. Lead finish gold.
RadHard MSI. Octal DFF with 3-state outputs. CMOS compatible I/O level. Lead finish solder.
RadHard MSI. Look-ahead carry genrator for counter. CMOS compatible I/O level. Lead finish solder.
RadHard MSI. Look-ahead carry genrator for counter. CMOS compatible I/O level. Lead finish gold.
RadHard MSI. Look-ahead carry genrator for counter. CMOS compatible I/O level. Lead finish optional.
RadHard MSI. Look-ahead carry genrator for counter. TTL compatible I/O level. Lead finish gold.
RadHard MSI. Look-ahead carry genrator for counter. TTL compatible I/O level. Lead finish solder.
RadHard MSI. Look-ahead carry genrator for counter. TTL compatible I/O level. Lead finish optional.
RadHard MSI. Octal DFF with 3-state outputs. TTL compatible I/O level. Lead finish optional.
RadHard MSI. Quadruple 2 to 1 multiplexer. CMOS compatible I/O level. Lead finish optional.
RadHard MSI. Quadruple 2 to 1 multiplexer. CMOS compatible I/O level. Lead finish gold.
RadHard MSI. Quadruple 2 to 1 multiplexer. TTL compatible I/O level. Lead finish optional.
RadHard MSI. 4-bit up/down binary counter. CMOS compatible I/O level. Lead finish solder.
RadHard MSI. Dual J-K flip-flop. CMOS compatible I/O level. Lead finish solder.
RadHard MSI. Dual 2-line to 4-line decoder/demultiplexer. CMOS compatible I/O level. Lead finish optional.
RadHard MSI. 4-bit up/down binary counter. CMOS compatible I/O level. Lead finish optional.
RadHard MSI. Quadruple S-R latch. CMOS compatible I/O level. Lead finish solder.
RadHard MSI. Quadruple S-R latch. CMOS compatible I/O level. Lead finish gold.
RadHard MSI. 4-bit up/down binary counter. TTL compatible I/O level. Lead finish optional.
RadHard MSI. Quadruple S-R latch. TTL compatible I/O level. Lead finish optional.

File Size 15.11K  /  4 Page

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    HI-8585 HI-8585CDI HI-8585CDT HI-8585PDT HI-8585PSI HI-8585CDM HI-8585CRI HI-8585CRT HI-8585CRM HI-8585PDI HI-8585PST HI

Holt Integrated Circuit...
HOLTIC[Holt Integrated Circuits]
Part No. HI-8585 HI-8585CDI HI-8585CDT HI-8585PDT HI-8585PSI HI-8585CDM HI-8585CRI HI-8585CRT HI-8585CRM HI-8585PDI HI-8585PST HI-8586PSI HI-8586 HI-8586CRT HI-8586PST HI-8586CDI HI-8586CDM HI-8586CDT HI-8586CRI HI-8586CRM HI-8586PDI HI-8586PDT
OCR Text ...9 .0381) Package Type: 8HNE Bottom View .140 .010 (3.556 .254) .236 .008 (5.994 .203) PIN 1 .1535 .0035 (3.90 .09) .1...BRAZED DIP Package Type: 8C .405 MAX (10.287 MAX) .050 .007 (1.270 .178) .250 .008 (7.366 .2...
Description    ARINC 429 LIN DRIVER
384 MCELL 3 VOLT ZERO POWER ISP CPLD - NOT RECOMMENDED for NEW DESIGN

File Size 131.89K  /  7 Page

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    HI-1567 HI-1567CD HI-1567CDM-03 HI-1568CDM-03

Holt Integrated Circuit...
Holt Integrated Circuits, Inc.
Part No. HI-1567 HI-1567CD HI-1567CDM-03 HI-1568CDM-03
OCR Text ...2667 .0381) Heat sink stud on bottom of package. Package Type: 24HEW .5035 .0075 (12.789 .191) .300 TYP. (7.620) .025 Min.. ...BRAZED DIP PACKAGE TYPE: 20C 1.000 .010 (25.400 .254) .310 .010 (7.874 .254) .050 TYP. (1.27...
Description 5V MONOLITHIC DUAL TRANSCEIVERS DATACOM, MIL-STD-1553 DATA BUS TRANSCEIVER, CDIP20
Power Resistor; Series:200; Resistance:100ohm; Resistance Tolerance: /- 5%; Power Rating:12W; Resistor Element Material:Ceramic; Temperature Coefficient: /-260 ppm; Leaded Process Compatible:No; Packaging:Bulk RoHS Compliant: No

File Size 216.46K  /  7 Page

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    69217 69216 69218 45439 307544-3 307544-1

List of Unclassifed Manufacturers
List of Unclassifed Manufac...
Tyco Electronics
Part No. 69217 69216 69218 45439 307544-3 307544-1
OCR Text ...assistance center number at the bottom of this page. dimensions in this instruction sheet are in millimeters [with inches in brackets]. figu...brazed seam faces moving die ensure that the wire size stamped on the terminal or splice corresponds...
Description SOLISTRAND* Crimping Dies (Used in Crimping Heads69097 and 69099)
SOLISTRAND Crimping Dies

File Size 441.27K  /  8 Page

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    Holt Integrated Circuits, Inc.
Part No. HI-1567PCI HI-1567PSIM HI-1567PSM
OCR Text ... metal heat sink located on the bottom surface of the device. this heat sink should be soldered down to the printed circuit board for optimu...brazed dip -40c to +85c i no gold hi-1567cdt 0 20 pin ceramic side brazed dip -55c to +125c t no gol...
Description 5V MONOLITHIC DUAL TRANSCEIVERS DATACOM, MIL-STD-1553 DATA BUS TRANSCEIVER, PQCC44
5V MONOLITHIC DUAL TRANSCEIVERS 5V的整体式双收发器
5V MONOLITHIC DUAL TRANSCEIVERS DATACOM, MIL-STD-1553 DATA BUS TRANSCEIVER, PDSO20

File Size 80.76K  /  9 Page

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    AD9814S

Analog Devices
Part No. AD9814S
OCR Text ...8535) f cdfp3-f28 28 lead bottom-brazed flatpack figure 1 - functional block diagram ad9814s asd0016515 rev. d | page 2 of 7 pin number name type description 1 cdsclk1 di cds reference level sa...
Description    14-Bit CCD/CIS Signal Processor
Aerospace Low Power 14-Bit, 3-Channel CCD Signal Processor with Progammable Serial Interface and Byte-Wide Data Output Format

File Size 72.78K  /  7 Page

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    5962-0721303QDC 5962-0721301QHC

Intersil Corporation
Part No. 5962-0721303QDC 5962-0721301QHC
OCR Text ... S1 at all four corners. 7. For bottom-brazed lead packages, no organic or polymeric materials shall be molded to the bottom of the package to cover the leads. 8. Dimension Q shall be measured at the point of exit (beyond the meniscus) of t...
Description 500MHz Rail-to-Rail Amplifiers

File Size 128.93K  /  6 Page

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    5962-0721302QXC 5962-0721303QYC

Intersil Corporation
Part No. 5962-0721302QXC 5962-0721303QYC
OCR Text ... S1 at all four corners. 7. For bottom-brazed lead packages, no organic or polymeric materials shall be molded to the bottom of the package to cover the leads. 8. Dimension Q shall be measured at the point of exit (beyond the meniscus) of t...
Description 500MHz Rail-to-Rail Amplifiers

File Size 126.66K  /  5 Page

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