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  A-70568-0201 Datasheet PDF File

For A-70568-0201 Found Datasheets File :: 150+       Page :: | <1> | 2 | 3 | 4 | 5 | 6 | 7 | 8 | 9 | 10 | 11 | 12 | 13 | 14 | 15 |   

    Intersil, Corp.
Part No. HI3-0201HS4 HI3-0201HS5 HI1-0201HS2 HI1-0201HS5 HI1-0222-7 HI1-0222-2 HI1-0201HS4 HI1-0304-2 HI1-0300-5 HI4-0201HS5 HI4-0201/883 HI1-0300-2 HI1-0300-7
Description Box-shaped pin header, Discrete wire crimping connection, Discrete wire connectors; HRS No: 536-0414-4 90; Contact Mating Area Plating: Tin
Interface IC 接口IC

File Size 157.29K  /  1 Page

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Rochester Electronics LLC

Part No. MD28F020-12/B
Description 28F020 - 2048K (256K x 8) CMOS Flash Memory
Tech specs    

Official Product Page

HUA FENG CIRCUIT





    A-70568-0007

Molex Electronics Ltd.
Part No. A-70568-0007
Description 2.54mm Pitch C-Grid? Header, Through Hole, Dual Row, Vertical, High Temperature,

File Size 27.46K  /  2 Page

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Amphenol Communications Solutions

Part No. 10127402-01H2410LF
Description PwrBlade® ULTRA,Vertical,PF,4LP15S4HP
Tech specs    

Official Product Page

    A-70568-0070

Molex Electronics Ltd.
Part No. A-70568-0070
Description 2.54mm (.100) Pitch C-Grid? Header, Through Hole, Dual Row, Vertical, High Temperature, Shrouded, with Peg, 8 Circuits, 0.76μm (30μ) Gold (Au) Selective Plating

File Size 377.32K  /  4 Page

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Amphenol Communications Solutions

Part No. 10127720-201LF
Description Minitek® Pwr 3.0, Dual Row, Right Angle Through Hole Header, 20 Positions, 100u\\ Tin plating, Non GW Compatible LCP, With Pegs, Tray Packing.
Tech specs    

Official Product Page

    A-70568-0100

Molex Electronics Ltd.
Part No. A-70568-0100
Description 2.54mm (.100) Pitch C-Grid? Header, Through Hole, Dual Row, Vertical, High Temperature, Shrouded, with Peg, 68 Circuits, 0.76μm (30μ) Gold (Au) Selective Plating

File Size 377.32K  /  4 Page

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Amphenol Communications Solutions

Part No. G832MB030201024HR
Description Pitch 0.8mm, Height 3.7 mm, 20 Positions, Dual Row, BTB Vertical Receptacle SMT, G/F White
Tech specs    

Official Product Page

    A-70568-0002

Molex Electronics Ltd.
Part No. A-70568-0002
Description 2.54mm Pitch C-Grid? Header, Through Hole, Dual Row, Vertical, High Temperature,

File Size 27.49K  /  2 Page

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Amphenol Communications Solutions

Part No. 74983-502011LF
Description Metral® High Speed 1000 Series, Backplane Connectors, Header, Vertical Signal, 8 Row, Press-Fit, 96 Position, Select Load, Extended
Tech specs    

Official Product Page

    A-70568-0003

Molex Electronics Ltd.
Part No. A-70568-0003
Description 2.54mm Pitch C-Grid? Header, Through Hole, Dual Row, Vertical, High Temperature,

File Size 27.46K  /  2 Page

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Amphenol Communications Solutions

Part No. 68020-162HLF
Description BergStik®, Board to Board connector, Unshrouded Right angled Header, Through Hole, Double Row, 62 Positions, 2.54mm (0.100in) Pitch.
Tech specs    

Official Product Page

    A-70568-0101 15-47-7770

Molex Electronics Ltd.
Part No. A-70568-0101 15-47-7770
Description 2.54mm (.100) Pitch C-Grid? Header, Through Hole, Dual Row, Vertical, High Temperature, Shrouded, with Peg, 70 Circuits, 0.76μm (30μ) Gold (Au) Selective

File Size 377.32K  /  4 Page

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Amphenol Communications Solutions

Part No. 51762-10201200BALF
Description PwrBlade®, Power Connectors, 2P 12S Right Angle Receptacle, Solder To Board
Tech specs    

Official Product Page

    A-70568-0102 15-47-7772

Molex Electronics Ltd.
Part No. A-70568-0102 15-47-7772
Description 2.54mm (.100) Pitch C-Grid? Header, Through Hole, Dual Row, Vertical, High Temperature, Shrouded, with Peg, 72 Circuits, 0.76μm (30μ) Gold (Au) Selective Plating

File Size 377.32K  /  4 Page

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Amphenol Communications Solutions

Part No. 68020-140HLF
Description BergStik®, Board to Board connector, Unshrouded Right angled Header, Through Hole, Double Row, 40 Positions, 2.54mm (0.100in) Pitch.
Tech specs    

Official Product Page

    Intersil, Corp.
Part No. HI4-0201/883
Description Dual/Quad SPST, CMOS Analog Switches; Temperature Range: -55&deg;C to 125&deg;C; Package: 20-LCC QUAD 1-CHANNEL, SGL POLE SGL THROW SWITCH, CQCC20

File Size 270.45K  /  10 Page

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Amphenol Communications Solutions

Part No. 68020-112HLF
Description BergStik®, Board to Board connector, Unshrouded Right angled Header, Through Hole, Double Row, 12 Positions, 2.54mm (0.100in) Pitch.
Tech specs    

Official Product Page

    15-47-7528 0015477528 A-70568-0012

Molex Electronics Ltd.
Part No. 15-47-7528 0015477528 A-70568-0012
Description 2.54mm (.100) Pitch C-Grid? Header, Through Hole, Dual Row, Vertical, High Temperature, Shrouded, with Peg, 28 Circuits, Tin (Sn) Plating
2.54mm (.100) Pitch C-Grid垄莽 Header, Through Hole, Dual Row, Vertical, High Temperature, Shrouded, with Peg, 28 Circuits, Tin (Sn) Plating

File Size 377.50K  /  4 Page

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Amphenol Communications Solutions

Part No. 68020-154HLF
Description BergStik®, Board to Board connector, Unshrouded Right angled Header, Through Hole, Double Row, 54 Positions, 2.54mm (0.100in) Pitch.
Tech specs    

Official Product Page

For A-70568-0201 Found Datasheets File :: 150+       Page :: | <1> | 2 | 3 | 4 | 5 | 6 | 7 | 8 | 9 | 10 | 11 | 12 | 13 | 14 | 15 |   

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