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Amphenol Communications Solutions |
| Part No. |
G832MB030406022HR
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| Description |
0.80mm Board-to-Board 85Ω Connector, Pitch 0.8mm, Height 11.7 mm, 40 Positions, Dual Row, BTB Vertical Receptacle SMT, Gold Flash White.
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Official Product Page
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Amphenol Communications Solutions |
| Part No. |
69190-406HLF
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| Description |
BergStik®, Board to Board connector, Unshrouded vertical header, Through Hole, Single Row, 06 Positions, 2.54 mm (0.100in) Pitch.
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Official Product Page
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Amphenol Communications Solutions |
| Part No. |
77319-804-06LF
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| Description |
BergStik®, Board to Board connector, Unshrouded right angled header, Through Hole, Double Row, 06 Positions, 2.54 mm (0.100) Pitch.
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Official Product Page
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Amphenol Communications Solutions |
| Part No. |
54776-604-06LF
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| Description |
BergStik®, Board to Board connector, Unshrouded Vertical Stacking Header, Through Hole, Double row , Double body, Triplex, 6 Positions, 2.54mm (0.100in) Pitch
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Official Product Page
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Amphenol Communications Solutions |
| Part No. |
59202-S28-04-065LF
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| Description |
Minitek® 2.00mm, Board To Board, Unshrouded Vertical Header, Surface Mount, Double Row, 8 Positions.
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Official Product Page
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Amphenol Communications Solutions |
| Part No. |
77317-804-06
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| Description |
BergStik®, Board to Board connector, Unshrouded Right angle Header, Through Hole, Double Row, 6 Positions ,2.54mm (0.100in) Pitch,
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| Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
| Part No. |
71600-406LF
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| Description |
Quickie IDC Receptacle, Wire to Board connector -Double row - 6Positions - 2.54 mm (0.100in) Pitch
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Official Product Page
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Amphenol Communications Solutions |
| Part No. |
68000-406HLF
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| Description |
BergStik®, Board to Board connector, Unshrouded Header, Through Hole, Single Row, 6 Positions, 2.54 mm Pitch, Vertical, 5.84 mm (0.23 in.) Mating, 2.41 mm (0.095 in.) Tail
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Official Product Page
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Molex Electronics Ltd.
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| Part No. |
A-70567-0364 15-80-1521
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| Description |
2.54mm (.100) Pitch C-Grid庐 Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 52 Circuits, 0.76渭m (30渭) Gold, (Au) Selective Pla
2.54mm (.100) Pitch C-Grid? Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 52 Circuits, 0.76μm (30μ) Gold, (Au) Selective Plating
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| File Size |
1,218.35K /
7 Page |
 View
it Online |
Download Datasheet
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Amphenol Communications Solutions |
| Part No. |
86380-406HLF
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| Description |
86380-406HLF-B/S II HDR DR SELF-RET
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Official Product Page
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Molex Electronics Ltd.
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| Part No. |
A-70567-0014 15-80-0321
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| Description |
2.54mm (.100) Pitch C-Grid? Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 32 Circuits, Tin (Sn) Plating
2.54mm (.100) Pitch C-Grid垄莽 Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 32 Circuits, Tin (Sn) Plating
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| File Size |
1,218.23K /
7 Page |
View
it Online |
Download Datasheet |
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Amphenol Communications Solutions |
| Part No. |
10082201-404-06LF
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| Description |
BergStik®, Board to Board connector, Unshrouded Right Angle Header, Through Hole, Pin In Paste, Single row , 6 Positions, 2.54mm (0.100in) Pitch
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Official Product Page
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Bom2Buy.com
Price and Availability
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