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  A-70567-0152 Datasheet PDF File

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    70567-0152 A-70567-0152 15-80-0365 0015800365

Molex Electronics Ltd.
Part No. 70567-0152 A-70567-0152 15-80-0365 0015800365
Description 2.54mm (.100) Pitch C-Grid? Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 36 Circuits
File Size 1,218.29K  /  7 Page

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Texas Instruments
Part No. 5962-0152001VPA
Description Complementary High Current MOSFET Driver 8-CDIP -55 to 125
Tech specs 　 　

Official Product Page

HUA FENG CIRCUIT





    A-70567-0022

Molex Electronics Ltd.
Part No. A-70567-0022
Description 2.54mm (.100) Pitch C-Grid垄莽 Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 48 Circuits, Tin (Sn) Plating
File Size 1,218.42K  /  7 Page

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Texas Instruments
Part No. 5962-0152001QPA
Description Complementary High Current MOSFET Driver 8-CDIP -55 to 125
Tech specs 　 　

Official Product Page

    A-70567-0021

Molex Electronics Ltd.
Part No. A-70567-0021
Description 2.54mm (.100) Pitch C-Grid垄莽 Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 46 Circuits, Tin (Sn) Plating
File Size 1,218.42K  /  7 Page

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Texas Instruments
Part No. TPA0152PWPR
Description Stereo 2-W Audio Power Amp with Digital Volume Control 24-HTSSOP -40 to 85
Tech specs 　 　

Official Product Page

    A-70567-0020

Molex Electronics Ltd.
Part No. A-70567-0020
Description 2.54mm (.100) Pitch C-Grid垄莽 Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 44 Circuits, Tin (Sn) Plating
File Size 1,218.41K  /  7 Page

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Texas Instruments
Part No. TPA0152PWP
Description Stereo 2-W Audio Power Amp with Digital Volume Control 24-HTSSOP -40 to 85
Tech specs 　 　

Official Product Page

    70567-0018

Molex Electronics Ltd.
Part No. 70567-0018
Description 2.54mm (.100) Pitch C-Grid垄莽 Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 40 Circuits, Tin (Sn) Plating
File Size 1,218.45K  /  7 Page

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Texas Instruments
Part No. F2800152QRHBRQ1
Description Automotive C2000&trade; 32-bit MCU 100-MHz 64-KB flash with CAN-FD, lockstep ASIL B 32-VQFN -40 to 125
Tech specs 　 　

Official Product Page

    70567-0125

Molex Electronics Ltd.
Part No. 70567-0125
Description 2.54mm (.100) Pitch C-Grid? Header, Through Hole without Peg, Dual Row, VerticalShrouded, High Temperature, 50 Circuits, Tin (Sn) Plating
File Size 1,211.75K  /  7 Page

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Texas Instruments
Part No. F2800152QPHPRQ1
Description Automotive C2000&trade; 32-bit MCU 100-MHz 64-KB flash with CAN-FD, lockstep ASIL B 48-HTQFP -40 to 125
Tech specs 　 　

Official Product Page

    A-70567-0019

Molex Electronics Ltd.
Part No. A-70567-0019
Description 2.54mm (.100) Pitch C-Grid垄莽 Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 42 Circuits, Tin (Sn) Plating
File Size 1,218.42K  /  7 Page

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Amphenol Communications Solutions
Part No. 68015-202HLF
Description BergStik®, Board to Board connector, Unshrouded Right Angled Header, Through Hole, Single Row, 2 Positions, 2.54 mm (0.100in) Pitch.
Tech specs 　 　

Official Product Page

    A-70567-0279

Molex Electronics Ltd.
Part No. A-70567-0279
Description 2.54mm (.100) Pitch C-Grid? Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 18 Circuits, 0.38μm (15μ) Gold, (Au) Selective Plating
File Size 1,218.38K  /  7 Page

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Amphenol Communications Solutions
Part No. 68015-214HLF
Description BergStik®, Board to Board connector, Unshrouded Right Angled Header, Through Hole, Single Row, 14 Positions, 2.54 mm (0.100in) Pitch.
Tech specs 　 　

Official Product Page

    70567-0120

Molex Electronics Ltd.
Part No. 70567-0120
Description 2.54mm (.100) Pitch C-Grid? Header, Through Hole without Peg, Dual Row, VerticalShrouded, High Temperature, 40 Circuits, Tin (Sn) Plating
File Size 1,211.71K  /  7 Page

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Amphenol Communications Solutions
Part No. 68015-231HLF
Description BergStik®, Board to Board connector, Unshrouded Right Angled Header, Through Hole, Single Row, 31 Positions, 2.54 mm (0.100in) Pitch.
Tech specs 　 　

Official Product Page

    70567-0143 15-80-0185

Molex Electronics Ltd.
Part No. 70567-0143 15-80-0185
Description 2.54mm (.100) Pitch C-Grid? Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 18 Circuits, 0.76μm (30μ) Gold (Au) Selective Plating
File Size 1,218.29K  /  7 Page

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Amphenol Communications Solutions
Part No. 68015-224HLF
Description BergStik®, Board to Board connector, Unshrouded Right Angled Header, Through Hole, Single Row, 24 Positions, 2.54 mm (0.100in) Pitch.
Tech specs 　 　

Official Product Page

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