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MACOM[Tyco Electronics]
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| Part No. |
MAAPGM0042-DIE
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| OCR Text |
...m.
(117
x 78 x 3 mils)
2.980mm
1.980mm 1.736mm.
VDD
0.0940mm
0.940mm.
OUT
IN
0.239mm. 0
VGG
2.846mm.
0
Chip edge to bond pad dimensions are shown to the center of the bond pad.
Figure 5. Die Layout
... |
| Description |
1.2W X/Ku-Band Power Amplifier 11.5-16.0 GHz
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| File Size |
420.43K /
6 Page |
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MACOM[Tyco Electronics]
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| Part No. |
MAAPGM0038-DIE
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| OCR Text |
...m.
0.317mm.
2.303mm.
2.980mm.
2.980mm. 2.828mm.
2.828mm.
VGG
VDD
1.490mm.
OUT
1.490mm.
IN
0.152mm. 0 0
0.152mm.
Chip edge to bond pad dimensions are shown to the center of the bond pad.
Bond Pad ... |
| Description |
1.2W C/Ku-Band Power Amplifier 7.5-13.5 GHz
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| File Size |
334.38K /
6 Page |
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it Online |
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MACOM[Tyco Electronics]
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| Part No. |
MAAPGM0026-DIE
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| OCR Text |
...on
0.177mm.
1.490mm.
2.980mm.
1.580mm.
VDD
1.378mm.
OUT
0.840mm.
0.840mm.
IN VGG
0.202mm. 0
1.490mm.
2.853mm.
0
Figure 5. Die Layout
Chip edge to bond pad dimensions are shown to the center of the... |
| Description |
Amplifier, Power, 0.6W 1.5-3.3 GHz
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| File Size |
183.22K /
5 Page |
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it Online |
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MACOM[Tyco Electronics]
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| Part No. |
MAAPGM0041-DIE
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| OCR Text |
...s)
0.176mm.
1.490mm.
2.980mm.
1.804mm. 1.652mm.
VDD
OUT
0.852mm.
0.852mm.
IN
0.152mm. 0 0
VGG
2.853mm.
Figure 5. Die Layout
1.489mm.
Bond Pad Dimensions
Pad RF In and Out DC Drain Supply Voltage... |
| Description |
1.3W X/Ku-Band Power Amplifier 11.0-15.0 GHz
|
| File Size |
253.62K /
6 Page |
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it Online |
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MACOM[Tyco Electronics]
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| Part No. |
MAAMGM0003-DIE
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| OCR Text |
...8
x 98 x 3 mils)
2.145mm. 2.980mm. 2.480mm. 2.853mm.
2.328mm.
GATE
OUT
2.004mm.
0.469mm.
IN
0.152mm. 0
HI
MID
LO
VGG
GND
0.127mm.
1.325mm.
1.625mm.
2.050mm.
2.225mm.
2.525mm.
0
... |
| Description |
0.4W Variable Distributed Amplifier 1.0 - 15.0 GHz
|
| File Size |
265.55K /
7 Page |
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it Online |
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MACOM[Tyco Electronics]
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| Part No. |
MAAPGM0044-DIE
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| OCR Text |
...ion
(117 x 71 x 3 mils)
2.980mm.
1.483mm.
1.803mm. 1.654mm.
VDD
GND:G GND:G
0.854mm.
0.854mm.
OUT
IN
GND:G GND:G GND:G GND:G GND:G
GN D:G GND:G
VGG
0 2.823mm. 1.483mm. 0
Chip edge to bond pad dimen... |
| Description |
Amplifier, Power, 0.5W 11.5-16.5 GHz
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| File Size |
252.14K /
5 Page |
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it Online |
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SONY
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| Part No. |
ICX406AQ
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| OCR Text |
...approx. 3.95m pixels diagonal 8.980mm number of recommended recording pixels: 2272 (h) 1740 (v) approx. 3.87m pixels diagonal 8.875mm aspect ratio 4:3 chip size: 8.10mm (h) 6.64mm (v) unit cell size: 3.125m (h) 3.125m (v) o... |
| Description |
Diagonal 8.98mm(Type 1/1.8) Frame Readout CCD
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| File Size |
343.54K /
33 Page |
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it Online |
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