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Molex Electronics Ltd.
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| Part No. |
90325-9004 0903259004
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| Description |
1.27mm (.050) Pitch Picoflex庐 PF-50 Header, Vertical, Low Profile, 4 Circuits, Tin (Sn) Plating, Tube Packaging
1.27mm (.050) Pitch Picoflex? PF-50 Header, Vertical, Low Profile, 4 Circuits, Tin (Sn) Plating, Tube Packaging
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| File Size |
120.07K /
3 Page |
 View
it Online |
Download Datasheet
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Amphenol Communications Solutions |
| Part No. |
95290-325LF
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| Description |
DX VCC DR.100 DP SMT
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| Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
| Part No. |
10115859-004LF
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| Description |
HPCE R/A REC 36P24S
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| Tech specs |
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Official Product Page
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Molex Electronics Ltd.
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| Part No. |
90325-9026
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| Description |
1.27mm (.050) Pitch Picoflex庐 PF-50 Header, Vertical, Low Profile, 26 Circuits, Tin (Sn) Plating, Tube Packaging
1.27mm (.050) Pitch Picoflex? PF-50 Header, Vertical, Low Profile, 26 Circuits, Tin (Sn) Plating, Tube Packaging
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| File Size |
120.07K /
3 Page |
View
it Online |
Download Datasheet |
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Amphenol Communications Solutions |
| Part No. |
91269-004LF
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| Description |
Minitek® 2.00mm, Board to Board, Shrouded Header - Through Hole - Single row - 4 Positions - 2mm (0.079in) - Right Angle.
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Official Product Page
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Molex Electronics Ltd.
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| Part No. |
90325-9024
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| Description |
1.27mm (.050) Pitch Picoflex庐 PF-50 Header, Vertical, Low Profile, 24 Circuits, Tin (Sn) Plating, Tube Packaging
1.27mm (.050) Pitch Picoflex? PF-50 Header, Vertical, Low Profile, 24 Circuits, Tin (Sn) Plating, Tube Packaging
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| File Size |
119.86K /
3 Page |
View
it Online |
Download Datasheet |
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Amphenol Communications Solutions |
| Part No. |
87900-414HLF
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| Description |
BergStik® 2.54mm, Board to Board connector, Unshrouded Header, Through Hole, Double Row, 14 Positions, 2.54 mm Pitch, Vertical, 18.29 mm (0.72in) Mating, 3.05 mm (0.12in) Tail.
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Official Product Page
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Molex Electronics Ltd.
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| Part No. |
90325-9016
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| Description |
1.27mm (.050) Pitch Picoflex庐 PF-50 Header, Vertical, Low Profile, 16 Circuits, Tin (Sn) Plating, Tube Packaging
1.27mm (.050) Pitch Picoflex? PF-50 Header, Vertical, Low Profile, 16 Circuits, Tin (Sn) Plating, Tube Packaging
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| File Size |
120.05K /
3 Page |
View
it Online |
Download Datasheet |
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Amphenol Communications Solutions |
| Part No. |
87900-434HLF
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| Description |
BergStik® 2.54mm, Board to Board connector, Unshrouded Header, Through Hole, Double Row, 34 Positions, 2.54 mm Pitch, Vertical, 18.29 mm (0.72in) Mating, 3.05 mm (0.12in) Tail.
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| Tech specs |
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Official Product Page
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Molex Electronics Ltd.
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| Part No. |
90325-9014
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| Description |
1.27mm (.050) Pitch Picoflex庐 PF-50 Header, Vertical, Low Profile, 14 Circuits, Tin (Sn) Plating, Tube Packaging
1.27mm (.050) Pitch Picoflex? PF-50 Header, Vertical, Low Profile, 14 Circuits, Tin (Sn) Plating, Tube Packaging
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| File Size |
120.07K /
3 Page |
View
it Online |
Download Datasheet |
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Amphenol Communications Solutions |
| Part No. |
87900-454HLF
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| Description |
BergStik® 2.54mm, Board to Board connector, Unshrouded Header, Through Hole, Double Row, 54 Positions, 2.54 mm Pitch, Vertical, 18.29 mm (0.72in) Mating, 3.05 mm (0.12in) Tail.
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| Tech specs |
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Official Product Page
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Molex Electronics Ltd.
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| Part No. |
90325-9010
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| Description |
1.27mm (.050) Pitch Picoflex庐 PF-50 Header, Vertical, Low Profile, 10 Circuits, Tin (Sn) Plating, Tube Packaging
1.27mm (.050) Pitch Picoflex? PF-50 Header, Vertical, Low Profile, 10 Circuits, Tin (Sn) Plating, Tube Packaging
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| File Size |
119.98K /
3 Page |
View
it Online |
Download Datasheet |
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Amphenol Communications Solutions |
| Part No. |
87900-402HLF
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| Description |
BergStik® 2.54mm, Board to Board connector, Unshrouded Header, Through Hole, Double Row, 2 Positions, 2.54 mm Pitch, Vertical, 18.29 mm (0.72in) Mating, 3.05 mm (0.12in) Tail.
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| Tech specs |
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Official Product Page
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Molex Electronics Ltd.
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| Part No. |
90325-9008
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| Description |
1.27mm (.050) Pitch Picoflex庐 PF-50 Header, Vertical, Low Profile, 8 Circuits, Tin (Sn) Plating, Tube Packaging
1.27mm (.050) Pitch Picoflex? PF-50 Header, Vertical, Low Profile, 8 Circuits, Tin (Sn) Plating, Tube Packaging
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| File Size |
120.07K /
3 Page |
View
it Online |
Download Datasheet |
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Amphenol Communications Solutions |
| Part No. |
87900-422HLF
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| Description |
BergStik® 2.54mm, Board to Board connector, Unshrouded Header, Through Hole, Double Row, 22 Positions, 2.54 mm Pitch, Vertical, 18.29 mm (0.72in) Mating, 3.05 mm (0.12in) Tail.
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| Tech specs |
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Official Product Page
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Molex Electronics Ltd.
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| Part No. |
90325-9006
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| Description |
1.27mm (.050) Pitch Picoflex庐 PF-50 Header, Vertical, Low Profile, 6 Circuits, Tin (Sn) Plating, Tube Packaging
1.27mm (.050) Pitch Picoflex? PF-50 Header, Vertical, Low Profile, 6 Circuits, Tin (Sn) Plating, Tube Packaging
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| File Size |
119.98K /
3 Page |
View
it Online |
Download Datasheet |
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Amphenol Communications Solutions |
| Part No. |
87900-442HLF
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| Description |
BergStik® 2.54mm, Board to Board connector, Unshrouded Header, Through Hole, Double Row, 42 Positions, 2.54 mm Pitch, Vertical, 18.29 mm (0.72in) Mating, 3.05 mm (0.12in) Tail.
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| Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
| Part No. |
87900-462HLF
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| Description |
BergStik® 2.54mm, Board to Board connector, Unshrouded Header, Through Hole, Double Row, 62 Positions, 2.54 mm Pitch, Vertical, 18.29 mm (0.72in) Mating, 3.05 mm (0.12in) Tail.
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Official Product Page
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