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CMPT992 MEGA6 74521 L604C DN2530N3 05004GOF ADVANCE FN3668
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  90143-0026 Datasheet PDF File

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    90143-0026

Molex Electronics Ltd.
Part No. 90143-0026
Description 2.54mm (.100) Pitch C-Grid III Modular Crimp Housing, Dual Row, 26 Circuits
File Size 250.36K  /  2 Page

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Rochester Electronics LLC
Part No. DS0026H/883
Description DS0026 - Low Skew Clock Driver, CAN8 - Dual marked (7800802GA)
Tech specs 　 　

Official Product Page

HUA FENG CIRCUIT





    90143-0014

Molex Electronics Ltd.
Part No. 90143-0014
Description 2.54mm (.100) Pitch C-Grid III Modular Crimp Housing, Dual Row, 14 Circuits
File Size 250.10K  /  2 Page

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Amphenol Communications Solutions
Part No. 87901-434HLF
Description BergStik® 2.54mm, Board to Board connector, Unshrouded Header, Through Hole, Double Row, 34 Positions, 2.54 mm Pitch, Vertical, 20.83 mm (0.82in) Mating, 3.05 mm (0.12in) Tail.
Tech specs 　 　

Official Product Page

    90143-0010

Molex Electronics Ltd.
Part No. 90143-0010
Description 2.54mm (.100) Pitch C-Grid III Modular Crimp Housing, Dual Row, 10 Circuits
File Size 250.10K  /  2 Page

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Amphenol Communications Solutions
Part No. 87901-438HLF
Description BergStik® 2.54mm, Board to Board connector, Unshrouded Header, Through Hole, Double Row, 38 Positions, 2.54 mm Pitch, Vertical, 20.83 mm (0.82in) Mating, 3.05 mm (0.12in) Tail.
Tech specs 　 　

Official Product Page

    90143-0022

Molex Electronics Ltd.
Part No. 90143-0022
Description 2.54mm (.100) Pitch C-Grid III Modular Crimp Housing, Dual Row, 22 Circuits
File Size 250.36K  /  2 Page

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Amphenol Communications Solutions
Part No. 87901-430
Description BERGSTIK II .100CC DR-STRAIGHT
Tech specs 　 　

Official Product Page

    90143-0024

Molex Electronics Ltd.
Part No. 90143-0024
Description 2.54mm (.100) Pitch C-Grid III Modular Crimp Housing, Dual Row, 24 Circuits
File Size 250.36K  /  2 Page

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Amphenol Communications Solutions
Part No. 87901-432HLF
Description BergStik® 2.54mm, Board to Board connector, Unshrouded Header, Through Hole, Double Row, 32 Positions, 2.54 mm Pitch, Vertical, 20.83 mm (0.82in) Mating, 3.05 mm (0.12in) Tail.
Tech specs 　 　

Official Product Page

    90143-0028

Molex Electronics Ltd.
Part No. 90143-0028
Description 2.54mm (.100) Pitch C-Grid III Modular Crimp Housing, Dual Row, 28 Circuits
File Size 250.36K  /  2 Page

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Amphenol Communications Solutions
Part No. 87901-436HLF
Description BergStik® 2.54mm, Board to Board connector, Unshrouded Header, Through Hole, Double Row, 36 Positions, 2.54 mm Pitch, Vertical, 20.83 mm (0.82in) Mating, 3.05 mm (0.12in) Tail.
Tech specs 　 　

Official Product Page

    90143-0036

Molex Electronics Ltd.
Part No. 90143-0036
Description 2.54mm (.100) Pitch C-Grid III Modular Crimp Housing, Dual Row, 36 Circuits
File Size 250.24K  /  2 Page

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Amphenol Communications Solutions
Part No. GSD090143HR
Description Sd Card Connector, Push-push Type, 9 Position.
Tech specs 　 　

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    90143-0040

Molex Electronics Ltd.
Part No. 90143-0040
Description 2.54mm (.100) Pitch C-Grid III Modular Crimp Housing, Dual Row, 40 Circuits
File Size 250.24K  /  2 Page

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Amphenol Communications Solutions
Part No. 20021621-00026D8LF
Description 1.27mm (0.05in.) pitch, Header with eject latch, 26 contacts
Tech specs 　 　

Official Product Page

    90143-0050

Molex Electronics Ltd.
Part No. 90143-0050
Description 2.54mm (.100) Pitch C-Grid III Modular Crimp Housing, Dual Row, 50 Circuits
File Size 250.24K  /  2 Page

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Amphenol Communications Solutions
Part No. 20021323-00026D4LF
Description Minitek127®, Board to Board Receptacle, Double Row, Bottom entry, 26 positions, 1.27mm (0.500in) pitch.
Tech specs 　 　

Official Product Page

    90143-0056

Molex Electronics Ltd.
Part No. 90143-0056
Description 2.54mm (.100) Pitch C-Grid III Modular Crimp Housing, Dual Row, 56 Circuits
File Size 250.36K  /  2 Page

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Amphenol Communications Solutions
Part No. 20021311-00026T4LF
Description 1.27mm (0.05in.) pitch, Receptacle Top entry, 26 contacts
Tech specs 　 　

Official Product Page

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