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  90136-1105 Datasheet PDF File

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    0901361105 90136-1105

Molex Electronics Ltd.
Part No. 0901361105 90136-1105
Description 2.54mm (.100) Pitch C-Grid III?/a> Header, Single Row, Vertical, Shrouded, 5 Circuits, 4μm (160μ) Tin/Lead (Sn) over Nickel (Ni)
2.54mm (.100) Pitch C-Grid III Header, Single Row, Vertical, Shrouded, 5 Circuits, 4μm (160μ) Tin/Lead (Sn) over Nickel (Ni)

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Amphenol Communications Solutions

Part No. 78290-136HLF
Description BergStik® 2.54mm, Board to Board connector, Unshrouded Header, Through Hole, Single Row, 36 Positions, 2.54 mm Pitch, Vertical, 16.51 mm (0.65in) Mating, 12.7 mm (0.5in) Tail.
Tech specs    

Official Product Page

HUA FENG CIRCUIT





    90136-2222

Molex Electronics Ltd.
Part No. 90136-2222
Description 2.54mm (.100) Pitch C-Grid III Header, Single Row, Right Angle, Shrouded, 22 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating

File Size 162.01K  /  4 Page

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Amphenol Communications Solutions

Part No. 68690-136HLF
Description BergStik®, Board to Board connector, Unshrouded Vertical Header, Through Hole, Double Row, 36 Positions, 2.54 mm (0.100in)Pitch.
Tech specs    

Official Product Page

    90136-2325

Molex Electronics Ltd.
Part No. 90136-2325
Description 2.54mm (.100) Pitch C-Grid III?/a> Header, Single Row, Right Angle, Shrouded, 25 Circuits, 0.76μm (30μ) Gold (Au) Selective Plating

File Size 254.33K  /  5 Page

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Amphenol Communications Solutions

Part No. 69190-136HLF
Description BergStik®, Board to Board connector, Unshrouded vertical header, Through Hole, Single Row, 36 Positions, 2.54 mm (0.100in) Pitch.
Tech specs    

Official Product Page

    90136-1322

Molex Electronics Ltd.
Part No. 90136-1322
Description 2.54mm (.100) Pitch C-Grid III Header, Single Row, Vertical, Shrouded, 22 Circuits, 0.76μm (30μ) Gold (Au) Selective Plating

File Size 159.23K  /  4 Page

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Amphenol Communications Solutions

Part No. 10119110-560003LF
Description BergStik® 2.54mm, Board To Board Connector, Unshrouded Right Angle Header, Through Hole, Double row , 60 Positions, 2.54mm (0.100in) Pitch.
Tech specs    

Official Product Page

    90136-1325

Molex Electronics Ltd.
Part No. 90136-1325
Description 2.54mm (.100) Pitch C-Grid III Header, Single Row, Vertical, Shrouded, 25 Circuits, 0.76μm (30μ) Gold (Au) Selective Plating

File Size 159.22K  /  4 Page

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Amphenol Communications Solutions

Part No. 70298-1105LF
Description 4 Row Signal Header, 48 Position, Straight, Press-Fit, Wide body
Tech specs    

Official Product Page

    90136-2218

Molex Electronics Ltd.
Part No. 90136-2218
Description 2.54mm (.100) Pitch C-Grid III Header, Single Row, Right Angle, Shrouded, 18 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating

File Size 254.43K  /  5 Page

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Amphenol Communications Solutions

Part No. 10076801-105-12LF
Description BergStik®, Board to Board connector, Unshrouded Vertical Header, Through Hole, Double row , 12 Positions, 2.54mm (0.100in) Pitch, Pin In Paste
Tech specs    

Official Product Page

    90136-2215

Molex Electronics Ltd.
Part No. 90136-2215
Description 2.54mm (.100) Pitch C-Grid III Header, Single Row, Right Angle, Shrouded, 15 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating

File Size 254.43K  /  5 Page

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Amphenol Communications Solutions

Part No. 10076801-105-20LF
Description BergStik®, Board to Board connector, Unshrouded Vertical Header, Through Hole, Double row , 20 Positions, 2.54mm (0.100in) Pitch, Pin In Paste
Tech specs    

Official Product Page

    90136-2210

Molex Electronics Ltd.
Part No. 90136-2210
Description 2.54mm (.100) Pitch C-Grid III Header, Single Row, Right Angle, Shrouded, 10 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating
2.54mm (.100) Pitch C-Grid III垄芒 Header, Single Row, Right Angle, Shrouded, 10 Circuits, 0.38楼矛m (15楼矛) Gold (Au) Selective Plating

File Size 254.60K  /  5 Page

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Amphenol Communications Solutions

Part No. 77311-105-01LF
Description BergStik®, Board to Board connector, Unshrouded vertical Header, Through Hole, Single Row, 01 Positions, 2.54 mm Pitch.
Tech specs    

Official Product Page

    90136-2232

Molex Electronics Ltd.
Part No. 90136-2232
Description 2.54mm (.100) Pitch C-Grid III Header, Single Row, Right Angle, Shrouded, 32 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating

File Size 254.33K  /  5 Page

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Amphenol Communications Solutions

Part No. 78211-105LF
Description PV® Wire-to-Board Connector System, Mini Latch Housing, Single Row, 2.54mm (0.100in), 5 Positions..
Tech specs    

Official Product Page

    90136-2230

Molex Electronics Ltd.
Part No. 90136-2230
Description 2.54mm (.100) Pitch C-Grid III Header, Single Row, Right Angle, Shrouded, 30 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating

File Size 254.33K  /  5 Page

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Amphenol Communications Solutions

Part No. F304-1A7H1-11050-E100
Description Flex Connector, 0.50mm Pitch, Height 2.50mm, Right angle, Flip type, ZIF, 50 position, Double beam, With MYLAR
Tech specs    

Official Product Page

For 90136-1105 Found Datasheets File :: 150+       Page :: | <1> | 2 | 3 | 4 | 5 | 6 | 7 | 8 | 9 | 10 | 11 | 12 | 13 | 14 | 15 |   

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