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  90130-1144 Datasheet PDF File

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    90130-1144 0901301144

Molex Electronics Ltd.
Part No. 90130-1144 0901301144
Description 2.54mm (.100) Pitch C-Grid III Header, Dual Row, Vertical, Shrouded, Fully Loaded, 44 Circuits, Black, 3μm (118μ) Tin (Sn) over Nickel (Ni)

File Size 586.01K  /  7 Page

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Amphenol Communications Solutions

Part No. 68690-130HLF
Description BergStik®, Board to Board connector, Unshrouded Vertical Header, Through Hole, Double Row, 30 Positions, 2.54 mm (0.100in)Pitch.
Tech specs    

Official Product Page

HUA FENG CIRCUIT





    Advanced Thermal Soluti...
Part No. ATS-1144-C1-R0
Description Heat Sink for Half Brick DC-DC Converter

File Size 379.98K  /  1 Page

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Amphenol Communications Solutions

Part No. 92090-130LF
Description Minitek® 2.00mm, Board to Board, PCB mounted Receptacle, Vertical, Surface Mount, Double Row, Top Entry, 30 Positions, 2.00mm (0.079in) Pitch..
Tech specs    

Official Product Page

    ST-81144

List of Unclassifed Manufacturers
ETC[ETC]
Electronic Theatre Controls, Inc.
Part No. ST-81144
Description T1/CEPT/ISDN PRI TRANSFORMERS T1/CEPT/ISDN革命制度党变形金

File Size 135.16K  /  1 Page

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Amphenol Communications Solutions

Part No. 10065490-130TRLF
Description Minitek® 2.00mm, Board To Board, Receptacle, Vertical, Surface Mount, Double Row, 30 Positions, 2.00mm (0.079in) Pitch.
Tech specs    

Official Product Page

    90130-3326

Molex Electronics Ltd.
Part No. 90130-3326
Description 2.54mm (.100) Pitch C-Grid III Header, Dual Row, Right Angle, Shrouded, Fully Loaded, 26 Circuits, Black 0.76μm (30μ) Gold (Au) Selective Plating
2.54mm (.100) Pitch C-Grid III垄芒 Header, Dual Row, Right Angle, Shrouded, Fully Loaded, 26 Circuits, Black 0.76楼矛m (30楼矛) Gold (Au) Selective Plating

File Size 168.42K  /  4 Page

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Amphenol Communications Solutions

Part No. 78290-130HLF
Description BergStik® 2.54mm, Board to Board connector, Unshrouded Header, Through Hole, Single Row, 30 Positions, 2.54 mm Pitch, Vertical, 16.51 mm (0.65in) Mating, 12.7 mm (0.5in) Tail.
Tech specs    

Official Product Page

    90130-3334

Molex Electronics Ltd.
Part No. 90130-3334
Description
File Size 168.26K  /  4 Page

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Amphenol Communications Solutions

Part No. L17H2990130
Description Dsub, Stamped Signal 3A, Dual Port Right Angle PCB Thru Hole, F=19.05mm (0.750in), 26/26 (Socket/Socket), Flash Gold, Bright Tin Shell, 4-40 Threaded Rear Insert, 4*Arrowhead Boardlock
Tech specs    

Official Product Page

    90130-3308

Molex Electronics Ltd.
Part No. 90130-3308
Description
File Size 168.45K  /  4 Page

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Amphenol Communications Solutions

Part No. 69190-130HLF
Description BergStik®, Board to Board connector, Unshrouded vertical header, Through Hole, Single Row, 30 Positions, 2.54 mm (0.100in) Pitch.
Tech specs    

Official Product Page

    90130-3306

Molex Electronics Ltd.
Part No. 90130-3306
Description
File Size 168.45K  /  4 Page

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Amphenol Communications Solutions

Part No. 10114492-008LF
Description HPCE R/A REC 32P24S
Tech specs    

Official Product Page

    90130-3108

Molex Electronics Ltd.
Part No. 90130-3108
Description 2.54mm (.100) Pitch C-Grid III Header, Dual Row, Right Angle, Shrouded, Fully Loaded, 8 Circuits, Black, 3μm (118μ) Tin (Sn) over Nickel (Ni)

File Size 168.35K  /  4 Page

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Amphenol Communications Solutions

Part No. 87901-144HLF
Description BergStik® 2.54mm, Board to Board connector, Unshrouded Header, Through Hole, Double Row, 44 Positions, 2.54 mm Pitch, Vertical, 20.83 mm (0.82in) Mating, 3.05 mm (0.12in) Tail.
Tech specs    

Official Product Page

    90130-3106

Molex Electronics Ltd.
Part No. 90130-3106
Description 2.54mm (.100) Pitch C-Grid III Header, Dual Row, Right Angle, Shrouded, Fully Loaded, 6 Circuits, Black, 3μm (118μ) Tin (Sn) over Nickel (Ni)

File Size 168.71K  /  4 Page

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Amphenol Communications Solutions

Part No. 89361-144SLF
Description Minitek® IDC 2.00mm Pitch, Wire To Board Connector, Receptacle.
Tech specs    

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    90130-3140

Molex Electronics Ltd.
Part No. 90130-3140
Description 2.54mm (.100) Pitch C-Grid III垄芒 Header, Dual Row, Right Angle, Shrouded, Fully Loaded, 40 Circuits, Black, 3楼矛m (118楼矛) Tin (Sn) over Nickel (Ni)

File Size 168.60K  /  4 Page

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Amphenol Communications Solutions

Part No. 10128492-114400ULF
Description ExaMEZZ® 56Gbps High Speed Mezzanine Connector System, Mezzanine, Vertical, 4 pair, 19 column, 266 Positions, Press-Fit termination, 2.00mm (0.078in) Pitch.
Tech specs    

Official Product Page

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