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  90130-1140 Datasheet PDF File

For 90130-1140 Found Datasheets File :: 150+       Page :: | <1> | 2 | 3 | 4 | 5 | 6 | 7 | 8 | 9 | 10 | 11 | 12 | 13 | 14 | 15 |   

    90130-1140 0901301140

Molex Electronics Ltd.
Part No. 90130-1140 0901301140
Description 2.54mm (.100) Pitch C-Grid III Header, Dual Row, Vertical, Shrouded, Fully Loaded, 40 Circuits, Black, 3μm (118μ) Tin (Sn) over Nickel (Ni)

File Size 585.88K  /  7 Page

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Amphenol Communications Solutions

Part No. 1140084168
Description 1140084168-Micro SD Normal Open H=1.55 NONE PUSH
Tech specs    

Official Product Page

HUA FENG CIRCUIT





    3M Company
Part No. CFAK12P1140/KS35L
Description PROXIMITY SENSOR-CAPACITIVE, 200mA, CYLINDRICAL

File Size 91.38K  /  1 Page

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Amphenol Communications Solutions

Part No. 68690-130HLF
Description BergStik®, Board to Board connector, Unshrouded Vertical Header, Through Hole, Double Row, 30 Positions, 2.54 mm (0.100in)Pitch.
Tech specs    

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    90130-3108

Molex Electronics Ltd.
Part No. 90130-3108
Description 2.54mm (.100) Pitch C-Grid III Header, Dual Row, Right Angle, Shrouded, Fully Loaded, 8 Circuits, Black, 3μm (118μ) Tin (Sn) over Nickel (Ni)

File Size 168.35K  /  4 Page

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Amphenol Communications Solutions

Part No. 92090-130LF
Description Minitek® 2.00mm, Board to Board, PCB mounted Receptacle, Vertical, Surface Mount, Double Row, Top Entry, 30 Positions, 2.00mm (0.079in) Pitch..
Tech specs    

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    90130-3326

Molex Electronics Ltd.
Part No. 90130-3326
Description 2.54mm (.100) Pitch C-Grid III Header, Dual Row, Right Angle, Shrouded, Fully Loaded, 26 Circuits, Black 0.76μm (30μ) Gold (Au) Selective Plating
2.54mm (.100) Pitch C-Grid III垄芒 Header, Dual Row, Right Angle, Shrouded, Fully Loaded, 26 Circuits, Black 0.76楼矛m (30楼矛) Gold (Au) Selective Plating

File Size 168.42K  /  4 Page

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Amphenol Communications Solutions

Part No. 10065490-130TRLF
Description Minitek® 2.00mm, Board To Board, Receptacle, Vertical, Surface Mount, Double Row, 30 Positions, 2.00mm (0.079in) Pitch.
Tech specs    

Official Product Page

    90130-3324

Molex Electronics Ltd.
Part No. 90130-3324
Description 2.54mm (.100) Pitch C-Grid III Header, Dual Row, Right Angle, Shrouded, Fully Loaded, 24 Circuits, Black 0.76μm (30μ) Gold (Au) Selective Plating
2.54mm (.100) Pitch C-Grid III垄芒 Header, Dual Row, Right Angle, Shrouded, Fully Loaded, 24 Circuits, Black 0.76楼矛m (30楼矛) Gold (Au) Selective Plating

File Size 168.61K  /  4 Page

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Amphenol Communications Solutions

Part No. 78290-130HLF
Description BergStik® 2.54mm, Board to Board connector, Unshrouded Header, Through Hole, Single Row, 30 Positions, 2.54 mm Pitch, Vertical, 16.51 mm (0.65in) Mating, 12.7 mm (0.5in) Tail.
Tech specs    

Official Product Page

    90130-3140

Molex Electronics Ltd.
Part No. 90130-3140
Description 2.54mm (.100) Pitch C-Grid III垄芒 Header, Dual Row, Right Angle, Shrouded, Fully Loaded, 40 Circuits, Black, 3楼矛m (118楼矛) Tin (Sn) over Nickel (Ni)

File Size 168.60K  /  4 Page

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Amphenol Communications Solutions

Part No. L17H2990130
Description Dsub, Stamped Signal 3A, Dual Port Right Angle PCB Thru Hole, F=19.05mm (0.750in), 26/26 (Socket/Socket), Flash Gold, Bright Tin Shell, 4-40 Threaded Rear Insert, 4*Arrowhead Boardlock
Tech specs    

Official Product Page

    90130-3306

Molex Electronics Ltd.
Part No. 90130-3306
Description
File Size 168.45K  /  4 Page

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Amphenol Communications Solutions

Part No. 69190-130HLF
Description BergStik®, Board to Board connector, Unshrouded vertical header, Through Hole, Single Row, 30 Positions, 2.54 mm (0.100in) Pitch.
Tech specs    

Official Product Page

    90130-3308

Molex Electronics Ltd.
Part No. 90130-3308
Description
File Size 168.45K  /  4 Page

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Amphenol Communications Solutions

Part No. 77311-401-00LF
Description BergStik®, Board to Board connector, Unshrouded vertical Header, Through Hole, Single Row, 00 Positions, 2.54 mm Pitch.
Tech specs    

Official Product Page

    90130-3218

Molex Electronics Ltd.
Part No. 90130-3218
Description 2.54mm (.100) Pitch C-Grid III?/a> Header, Dual Row, Right Angle, Shrouded, Fully Loaded, 18 Circuits, Black 0.38μm (15μ) Gold (Au) Selective Plating

File Size 168.46K  /  4 Page

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Amphenol Communications Solutions

Part No. 78511-403HLF
Description BergStik®, Board to Board connector, Unshrouded Vertical Header, Through Hole, Single Row, 3 Positions, 2.54 mm Pitch.
Tech specs    

Official Product Page

    90130-3212

Molex Electronics Ltd.
Part No. 90130-3212
Description 2.54mm (.100) Pitch C-Grid III?/a> Header, Dual Row, Right Angle, Shrouded, Fully Loaded, 12 Circuits, Black 0.38μm (15μ) Gold (Au) Selective Plating

File Size 168.45K  /  4 Page

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Amphenol Communications Solutions

Part No. 87401-140LF
Description Rib-Cage® Board To Board Connector, Surface Mount Vertical Shrouded PCB Header, 80 Positions, Plain Mounting style.
Tech specs    

Official Product Page

For 90130-1140 Found Datasheets File :: 150+       Page :: | <1> | 2 | 3 | 4 | 5 | 6 | 7 | 8 | 9 | 10 | 11 | 12 | 13 | 14 | 15 |   

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