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  87891-1818 Datasheet PDF File

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    87891-1818

Molex Electronics Ltd.
Part No. 87891-1818
Description 2.54mm (.100) Pitch KK庐 Header, Through Hole, Breakaway, Vertical, 18 Circuits, 0.38渭m (15渭) Gold (Au) Plating, with Cap, Tape on Reel Packaging, Lead-free
2.54mm (.100) Pitch KK? Header, Through Hole, Breakaway, Vertical, 18 Circuits, 0.38μm (15μ) Gold (Au) Plating, with Cap, Tape on Reel Packaging, Lead-free

File Size 287.95K  /  5 Page

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Amphenol Communications Solutions

Part No. 77311-818-18LF
Description BergStik®, Board to Board connector, Unshrouded vertical Header, Through Hole, Single Row, 18 Positions, 2.54 mm Pitch.
Tech specs    

Official Product Page

HUA FENG CIRCUIT





    87891-0106

Molex Electronics Ltd.
Part No. 87891-0106
Description 2.54mm (.100) Pitch KK庐 Header, Through Hole, Vertical, 1 Circuit, 2.50 渭m (100渭) Tin (Sn) Overall Plating, Tray Packaging, Lead-free
2.54mm (.100) Pitch KK? Header, Through Hole, Vertical, 1 Circuit, 2.50 μm (100μ) Tin (Sn) Overall Plating, Tray Packaging, Lead-free

File Size 759.44K  /  10 Page

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Amphenol Communications Solutions

Part No. 10131318-18111G0LF
Description Minitek® Pwr 4.2 HCC, Dual Row, Right Angle Through Hole Header, Gold Flash plating, Natural Color, 18 Positions, GW Compatible Nylon66, Tray Packing.
Tech specs    

Official Product Page

    87891-0306

Molex Electronics Ltd.
Part No. 87891-0306
Description 2.54mm (.100) Pitch KK庐 Header, Through Hole, Breakaway, Vertical, 3 Circuits, 2.50渭m (100渭) Tin (Sn) Overall Plating, Tray Packaging, Lead-free
2.54mm (.100) Pitch KK? Header, Through Hole, Breakaway, Vertical, 3 Circuits, 2.50μm (100μ) Tin (Sn) Overall Plating, Tray Packaging, Lead-free

File Size 759.44K  /  10 Page

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Amphenol Communications Solutions

Part No. 75188-818-18LF
Description BergStik® 2.54mm, Board To Board Connector, Unshrouded Vertical header, Through Hole, Single Row, 18 Positions, 5.08mm (0.200in) Pitch.
Tech specs    

Official Product Page

    87891-0408

Molex Electronics Ltd.
Part No. 87891-0408
Description 2.54mm (.100) Pitch KK庐 Header, Through Hole, Vertical, 4 Circuit, 2.50渭m (100渭) Tin (Sn) Overall Plating, Tray Packaging, Lead-free
2.54mm (.100) Pitch KK? Header, Through Hole, Vertical, 4 Circuit, 2.50μm (100μ) Tin (Sn) Overall Plating, Tray Packaging, Lead-free

File Size 287.76K  /  5 Page

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Amphenol Communications Solutions

Part No. 75188-118-18LF
Description BergStik® 2.54mm, Board To Board Connector, Unshrouded Vertical header, Through Hole, Single Row, 18 Positions, 5.08mm (0.200in) Pitch.
Tech specs    

Official Product Page

    87891-0606

Molex Electronics Ltd.
Part No. 87891-0606
Description 2.54mm (.100) Pitch KK庐 Header, Through Hole, Breakaway, Vertical, 6 Circuits, 2.50渭m (100渭) Tin (Sn) Overall Plating, Tray Packaging, Lead-free
2.54mm (.100) Pitch KK? Header, Through Hole, Breakaway, Vertical, 6 Circuits, 2.50μm (100μ) Tin (Sn) Overall Plating, Tray Packaging, Lead-free

File Size 759.44K  /  10 Page

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Amphenol Communications Solutions

Part No. 77311-818-04LF
Description BergStik®, Board to Board connector, Unshrouded vertical Header, Through Hole, Single Row, 04 Positions, 2.54 mm Pitch.
Tech specs    

Official Product Page

    87891-1817

Molex Electronics Ltd.
Part No. 87891-1817
Description 2.54mm (.100) Pitch KK庐 Header, Through Hole, Breakaway, Vertical, 18 Circuits, 2.50渭m (100渭) Tin (Sn) Plating, with Cap, Tape on Reel Packaging, Lead-free
2.54mm (.100) Pitch KK? Header, Through Hole, Breakaway, Vertical, 18 Circuits, 2.50μm (100μ) Tin (Sn) Plating, with Cap, Tape on Reel Packaging, Lead-free

File Size 287.95K  /  5 Page

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Amphenol Communications Solutions

Part No. 77311-818-14LF
Description BergStik®, Board to Board connector, Unshrouded vertical Header, Through Hole, Single Row, 14 Positions, 2.54 mm Pitch.
Tech specs    

Official Product Page

    87891-4006

Molex Electronics Ltd.
Part No. 87891-4006
Description 2.54mm (.100) Pitch KK庐 Header, Through Hole, Breakaway, Vertical, 40 Circuits, 2.50渭m (100渭) Tin (Sn) Overall Plating, Tray Packaging, Lead-free
2.54mm (.100) Pitch KK? Header, Through Hole, Breakaway, Vertical, 40 Circuits, 2.50μm (100μ) Tin (Sn) Overall Plating, Tray Packaging, Lead-free

File Size 759.44K  /  10 Page

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Amphenol Communications Solutions

Part No. 77311-818-24LF
Description BergStik®, Board to Board connector, Unshrouded vertical Header, Through Hole, Single Row, 24 Positions, 2.54 mm Pitch.
Tech specs    

Official Product Page

    0428789128 42878-9128

Molex Electronics Ltd.
Part No. 0428789128 42878-9128
Description Modular Jack, Vertical, Low Profile, 8/4, Keyed, Panel Stops

File Size 223.41K  /  4 Page

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Amphenol Communications Solutions

Part No. 77311-818-34LF
Description BergStik®, Board to Board connector, Unshrouded vertical Header, Through Hole, Single Row, 34 Positions, 2.54 mm Pitch.
Tech specs    

Official Product Page

    87891-2818 0878912818

Molex Electronics Ltd.
Part No. 87891-2818 0878912818
Description 2.54mm (.100) Pitch KK? Header, Through Hole, Breakaway, Vertical, 28 Circuits, 0.38μm (15μ) Gold (Au) Plating, with Cap, Tape on Reel Packaging, Lead-free
2.54mm (.100) Pitch KK垄莽 Header, Through Hole, Breakaway, Vertical, 28 Circuits, 0.38楼矛m (15楼矛) Gold (Au) Plating, with Cap, Tape on Reel Packaging, Lead-free

File Size 288.12K  /  5 Page

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Amphenol Communications Solutions

Part No. 10131318-1812100LF
Description Minitek® Pwr 4.2 HCC, Dual Row, Right Angle Through Hole Header, Gold Flash plating, Black Color, 18 Positions, Non GW Compatible Nylon66, Tray Packing.
Tech specs    

Official Product Page

    87891-0204 0878910204

Molex Electronics Ltd.
Part No. 87891-0204 0878910204
Description 2.54mm (.100) Pitch KK庐 Header, Through Hole, Breakaway, Vertical, 2 Circuits, 0.38渭m (15渭) Gold (Au) Selective Plating, Tray Packaging, Lead-free
2.54mm (.100) Pitch KK? Header, Through Hole, Breakaway, Vertical, 2 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating, Tray Packaging, Lead-free

File Size 759.42K  /  10 Page

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Amphenol Communications Solutions

Part No. 89891-818HLF
Description REC VER THT 36pos
Tech specs    

Official Product Page

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