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  87832-2222 Datasheet PDF File

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    87832-2222

Molex Electronics Ltd.
Part No. 87832-2222
Description 2.00mm (.079) Pitch Milli-Grid Header, Surface Mount, Vertical, Shrouded, Leadfree 22 Circuits, 0.38μm (15μ) Gold (Au) Plating, Pick-and-Place Cap

File Size 367.61K  /  6 Page

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Amphenol Communications Solutions

Part No. 10131319-222220ULF
Description Minitek®Pwr 4.2 High Current Connector System, Dual Row, Vertical Through Hole Header, 100u\\ Matte Tin plating, Black Color, 22 Positions, Non GW Compatible LCP, Tape and Reel without cap.
Tech specs    

Official Product Page

HUA FENG CIRCUIT





    87832-2623

Molex Electronics Ltd.
Part No. 87832-2623
Description 2.00mm (.079) Pitch Milli-Grid Header, Surface Mount, Vertical, Shrouded, Leadfree, 26 Circuits, 0.76μm (30μ) Gold (Au) Plating, Pick-and-Place Cap

File Size 386.40K  /  6 Page

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Amphenol Communications Solutions

Part No. 10131319-22222G0LF
Description Minitek® Pwr 4.2 HCC, Dual Row, Vertical Through Hole Header, 100u\\ Matte Tin overall plating, Black Color, 22 Positions, LCP, GW Compatible, Tray Packing.
Tech specs    

Official Product Page

    87832-3820

Molex Electronics Ltd.
Part No. 87832-3820
Description 2.00mm (.079) Pitch Milli-Grid Header, Surface Mount, Vertical, Shrouded, Leadfree 38 Circuits, 0.38μm (15μ) Gold (Au) Plating

File Size 367.47K  /  6 Page

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Amphenol Communications Solutions

Part No. 68022-222HLF
Description BergStik®, Board to Board connector, Unshrouded Right Angled Header, Through Hole, Double Row, 22 Positions, 2.54 mm (0.100in)Pitch.
Tech specs    

Official Product Page

    87832-4621

Molex Electronics Ltd.
Part No. 87832-4621
Description 2.00mm (.079) Pitch Milli-Grid Header, Surface Mount, Vertical, Shrouded, Leadfree 46 Circuits, 0.76μm (30μ) Gold (Au) Plating

File Size 386.26K  /  6 Page

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Amphenol Communications Solutions

Part No. 10131319-2222200LF
Description Minitek® Pwr 4.2 HCC, Dual Row, Vertical Through Hole Header, 100u\\ Matte Tin overall plating, Black Color, 22 Positions, LCP, Non GW Compatible, Tray Packing.
Tech specs    

Official Product Page

    87832-3220

Molex Electronics Ltd.
Part No. 87832-3220
Description 2.00mm (.079) Pitch Milli-Grid Header, Surface Mount, Vertical, Shrouded, Leadfree 32 Circuits, 0.38μm (15μ) Gold (Au) Plating

File Size 367.53K  /  6 Page

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Amphenol Communications Solutions

Part No. 10131319-22222GTLF
Description Minitek® Pwr 4.2 HCC, Dual Row, Vertical Through Hole Header, 100u\\ Matte Tin overall plating, Black Color, 22 Positions, LCP, GW Compatible, Tape and Reel with cap.
Tech specs    

Official Product Page

    87832-3821

Molex Electronics Ltd.
Part No. 87832-3821
Description 2.00mm (.079) Pitch Milli-Grid Header, Surface Mount, Vertical, Shrouded, Leadfree 38 Circuits, 0.76μm (30μ) Gold (Au) Plating,

File Size 386.26K  /  6 Page

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Amphenol Communications Solutions

Part No. 10131319-22222GPLF
Description Minitek® Pwr 4.2 HCC, Dual Row, Vertical Through Hole Header, 100u\\ Matte Tin overall plating, Black Color, 22 Positions, LCP, GW Compatible, Tray Packing, With Pegs.
Tech specs    

Official Product Page

    87832-4016

Molex Electronics Ltd.
Part No. 87832-4016
Description 2.00mm (.079) Pitch Milli-Grid Header, Surface Mount, Vertical, Shrouded, Leadfree 40 Circuits, 0.38μm (15μ) Gold (Au) Plating, with Locking Windows

File Size 345.64K  /  5 Page

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Amphenol Communications Solutions

Part No. 10131319-22222GRLF
Description Minitek® Pwr 4.2 HCC, Dual Row, Vertical Through Hole Header, 100u\\ Matte Tin overall plating, Black Color, 22 Positions, LCP, GW Compatible, With Pegs, Tape and Reel with cap.
Tech specs    

Official Product Page

    87832-3221

Molex Electronics Ltd.
Part No. 87832-3221
Description 2.00mm (.079) Pitch Milli-Grid Header, Surface Mount, Vertical, Shrouded, Leadfree 32 Circuits, 0.76μm (30μ) Gold (Au) Plating

File Size 386.32K  /  6 Page

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Amphenol Communications Solutions

Part No. 10131319-222220PLF
Description Minitek® Pwr 4.2 HCC, Dual Row, Vertical Through Hole Header, 100u\\ Matte Tin overall plating, Black Color, 22 Positions, LCP, Non GW Compatible, Tray Packing, With Pegs.
Tech specs    

Official Product Page

    87832-3222

Molex Electronics Ltd.
Part No. 87832-3222
Description 2.00mm (.079) Pitch Milli-Grid Header, Surface Mount, Vertical, Shrouded, Leadfree, 32 Circuits, 0.38μm (15μ) Gold (Au) Plating, Pick-and-Place Cap,

File Size 367.55K  /  6 Page

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Amphenol Communications Solutions

Part No. 10131319-222220TLF
Description Minitek® Pwr 4.2 HCC, Dual Row, Vertical Through Hole Header, 100u\\ Matte Tin overall plating, Black Color, 22 Positions, LCP, Non GW Compatible, Tape and Reel with cap.
Tech specs    

Official Product Page

    87832-1614

Molex Electronics Ltd.
Part No. 87832-1614
Description 2.00mm (.079) Pitch Milli-Grid Header, Surface Mount, Vertical, Shrouded, Leadfree 16 Circuits, 0.38μm (15μ) Gold (Au) Plating, with Locking Windows

File Size 345.80K  /  5 Page

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Amphenol Communications Solutions

Part No. 10131319-222220RLF
Description Minitek® Pwr 4.2 HCC, Dual Row, Vertical Through Hole Header, 100u\\ Matte Tin overall plating, Black Color, 22 Positions, LCP, Non GW Compatible, With Pegs, Tape and Reel with cap.
Tech specs    

Official Product Page

For 87832-2222 Found Datasheets File :: 150+       Page :: | <1> | 2 | 3 | 4 | 5 | 6 | 7 | 8 | 9 | 10 | 11 | 12 | 13 | 14 | 15 |   

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