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  87758-4250 Datasheet PDF File

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    87758-4250

Molex Electronics Ltd.
Part No. 87758-4250
Description 2.00mm (.079) Pitch Milli-Grid?/a> Header, Through Hole, Vertical, 42 Circuits
File Size 135.47K  /  4 Page

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Amphenol Communications Solutions
Part No. 54121-816142500LF
Description BergStik®, Board to Board connector, Unshrouded vertical stacked header, Through Hole, Single Row, 14 Positions, 2.54mm (0.100in) Pitch.
Tech specs 　 　

Official Product Page

HUA FENG CIRCUIT





    TWR-3.3_4250-12_625-D24 TWR-3.3_4250-12_625-D48 TWR-3.3_4250-15_500-D24 TWR-3.3_4250-15_500-D48 TWR30W TWR-3.3/4250-15/5

Murata Manufacturing Co., Ltd.
Part No. TWR-3.3_4250-12_625-D24 TWR-3.3_4250-12_625-D48 TWR-3.3_4250-15_500-D24 TWR-3.3_4250-15_500-D48 TWR30W TWR-3.3/4250-15/500-D48 TWR-3.3/4250-12/625-D24 TWR-3.3/4250-12/625-D48 TWR-3.3/4250-15/500-D24
Description 30W, Triple Output DC/DC Converters
File Size 148.90K  /  5 Page

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Amphenol Communications Solutions
Part No. 54122-112042500LF
Description BergStik®, Board to Board connector, Unshrouded stacking vertical header, through hole, double Row, 4 position, 2.54mm (0.100in) pitch
Tech specs 　 　

Official Product Page

   
Part No. 55H12T944250/200
Description THERMOSCHALTER
File Size 61.95K  /  1 Page

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Amphenol Communications Solutions
Part No. U10A474250T
Description SlimSAS Right angle X8 30u\\ Gold plating, Latch pin length=3.0mm, 24G, T&R packing
Tech specs 　 　

Official Product Page

    87758-1617

Molex Electronics Ltd.
Part No. 87758-1617
Description 2.00mm (.079) Pitch Milli-Grid Header, Through Hole, Vertical, 16 Circuits, 0.76μm (30μ) Gold (Au) Selective Plating, Pocket Tray Packaging, Lead-free
File Size 170.76K  /  4 Page

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Amphenol Communications Solutions
Part No. U10KH7425001T
Description SlimSAS Vertical X12 30u\\ Gold plating, Latch pin outside, Latch pin length=3.0mm, 24G, T&R packing
Tech specs 　 　

Official Product Page

    87758-2416

Molex Electronics Ltd.
Part No. 87758-2416
Description 2.00mm (.079) Pitch Milli-Grid Header, Through Hole, Vertical, 24 Circuits, 0.38μm 15μ) Gold (Au) Selective Plating, Pocket Tray Packaging, Lead-free
File Size 170.71K  /  4 Page

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Amphenol Communications Solutions
Part No. 77315-425-04LF
Description BergStik®, Board to Board connector, Unshrouded Header, Through Hole, Single Row, 4 Positions 2.54mm (0.100in) Pitch, Right Angle
Tech specs 　 　

Official Product Page

    87758-2417

Molex Electronics Ltd.
Part No. 87758-2417
Description 2.00mm (.079) Pitch Milli-Grid Header, Through Hole, Vertical, 24 Circuits, 0.76μm(30μ) Gold (Au) Selective Plating, Pocket Tray Packaging, Lead-free
File Size 170.76K  /  4 Page

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Amphenol Communications Solutions
Part No. 61124-250CACLF
Description Assembly, Top Mount, D/D(136Pins), VTB, Type 123, 3.3V, 5mm s/o, Right Push Rod Eject, 9.5mm Eject Travel
Tech specs 　 　

Official Product Page

    87758-2050

Molex Electronics Ltd.
Part No. 87758-2050
Description 2.00mm (.079) Pitch Milli-Grid Header, Through Hole, Vertical, 20 Circuits
File Size 135.92K  /  4 Page

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Amphenol Communications Solutions
Part No. 54122-112142500LF
Description BergStik®, Board to Board connector, Unshrouded stacking vertical header, through hole, double Row, 14 position, 2.54mm (0.100in) pitch
Tech specs 　 　

Official Product Page

    87758-2017

Molex Electronics Ltd.
Part No. 87758-2017
Description 2.00mm (.079) Pitch Milli-Grid Header, Through Hole, Vertical, 20 Circuits, 0.76μm (30μ) Gold (Au) Selective Plating, Pocket Tray Packaging, Lead-free
File Size 170.76K  /  4 Page

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Amphenol Communications Solutions
Part No. 54122-811242500LF
Description BergStik®, Board to Board connector, Unshrouded stacking vertical header, through hole, double Row, 24 position, 2.54mm (0.100in) pitch
Tech specs 　 　

Official Product Page

    87758-1817

Molex Electronics Ltd.
Part No. 87758-1817
Description 2.00mm (.079) Pitch Milli-Grid Header, Through Hole, Vertical, 18 Circuits, 0.76μm (30μ) Gold (Au) Selective Plating, Pocket Tray Packaging, Lead-free
File Size 170.70K  /  4 Page

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Amphenol Communications Solutions
Part No. 54242-504140950LF
Description BergStik®, Board to Board connector, Unshrouded vertical stacked header, Surface Mount, Double Row, 14 Positions, 2.54mm (0.100in) Pitch.
Tech specs 　 　

Official Product Page

    87758-1816

Molex Electronics Ltd.
Part No. 87758-1816
Description 2.00mm (.079) Pitch Milli-Grid Header, Through Hole, Vertical, 18 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating, Pocket Tray Packaging, Lead-free
File Size 170.71K  /  4 Page

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Amphenol Communications Solutions
Part No. 59112-G24-25-051LF
Description Minitek® 2.00mm, Board To Board, Unshrouded Vertical Stacking Header, Through Hole, Double Row, 50 Positions.
Tech specs 　 　

Official Product Page

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