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METHODE ELECTRONICS INC
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| Part No. |
800F-222-503 8000-221-302 800F-206-503
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| Description |
44 CONTACT(S), FEMALE, STRAIGHT TWO PART BOARD CONNECTOR, SURFACE MOUNT
42 CONTACT(S), FEMALE, STRAIGHT TWO PART BOARD CONNECTOR, SOLDER
12 CONTACT(S), FEMALE, STRAIGHT TWO PART BOARD CONNECTOR, SURFACE MOUNT
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| File Size |
320.65K /
3 Page |
 View
it Online |
Download Datasheet
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Amphenol Communications Solutions |
| Part No. |
68000-401HLF
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| Description |
BergStik®, Board to Board connector, Unshrouded Header, Through Hole, Single Row, 1 Positions, 2.54 mm Pitch, Vertical, 5.84 mm (0.23 in.) Mating, 2.41 mm (0.095 in.) Tail
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Official Product Page
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Amphenol Communications Solutions |
| Part No. |
CE1208000110111
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| Description |
Cool Edge 0.80mm Hybrid Power and Signal Connectors, Storage and Server System, Through Hole/Surface mount, 2 power pins, 80 signal pins, Vertical
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Official Product Page
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Amphenol Communications Solutions |
| Part No. |
68000-232HLF
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| Description |
BergStik®, Board to Board connector, Unshrouded Header, Through Hole, Single Row, 32 Positions, 2.54 mm Pitch, Vertical, 5.84 mm (0.23 in.) Mating, 2.41 mm (0.095 in.) Tail
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Official Product Page
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Amphenol Communications Solutions |
| Part No. |
68000-434HLF
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| Description |
BergStik®, Board to Board connector, Unshrouded Header, Through Hole, Single Row, 34 Positions, 2.54 mm Pitch, Vertical, 5.84 mm (0.23 in.) Mating, 2.41 mm (0.095 in.) Tail
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Official Product Page
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Amphenol Communications Solutions |
| Part No. |
68000-119HLF
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| Description |
BergStik®, Board to Board connector, Unshrouded Header, Through Hole, Single Row, 19 Positions, 2.54 mm Pitch, Vertical, 5.84 mm (0.23 in.) Mating, 2.41 mm (0.095 in.) Tail
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| Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
| Part No. |
68000-403HLF
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| Description |
BergStik®, Board to Board connector, Unshrouded Header, Through Hole, Single Row, 3 Positions, 2.54 mm Pitch, Vertical, 5.84 mm (0.23 in.) Mating, 2.41 mm (0.095 in.) Tail
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Official Product Page
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Amphenol Communications Solutions |
| Part No. |
68000-228HLF
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| Description |
BergStik®, Board to Board connector, Unshrouded Header, Through Hole, Single Row, 28 Positions, 2.54 mm Pitch, Vertical, 5.84 mm (0.23 in.) Mating, 2.41 mm (0.095 in.) Tail
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Official Product Page
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Amphenol Communications Solutions |
| Part No. |
10035388-000LF
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| Description |
Power Card Edge, Power Connectors, 2 x 29P STB Right Angle.
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| Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
| Part No. |
68000-123HLF
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| Description |
BergStik®, Board to Board connector, Unshrouded Header, Through Hole, Single Row, 23 Positions, 2.54 mm Pitch, Vertical, 5.84 mm (0.23 in.) Mating, 2.41 mm (0.095 in.) Tail
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Official Product Page
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VISAY[Vishay Siliconix]
Vishay Intertechnology,Inc.
Vishay Intertechnology, Inc.
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| Part No. |
271F 271G MDP14 MDP16-01-101G MDP16-01-101J MDP16-03-101G MDP16-05221_271F MDP16-05221_271G MDP16 MDP16-01-101F MDP16-03-101F MDP16-03-101J MDP16-05221_271J MDP16-05221/271J MDP16-05221/271F MDP16-05221/271G
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| Description |
Dual Inline Package, Molded DIP, 01, 03, 05 Schematics, Rugged, Molded Case Construction, Highly Stable, Automatic Insert Compatible, Uniform Performance Characteristics, Available in Tube Pack
Thick Film Resistor Networks Dual-In-Line Molded DIP 01 03 05 Schematics
(MDP14 / MDP16) Thick Film Resistor Networks
Sound/Security Multiconductor Cable; Number of Conductors:2; Conductor Size AWG:18; No. Strands x Strand Size:7 x 26; Jacket Material:Polyvinylchloride (PVC); Leaded Process Compatible:Yes; Capacitance:65pF/ft RoHS Compliant: Yes
Thick Film Resistor Networks, Dual-In-Line, Molded DIP, 01, 03, 05 Schematics 厚膜电阻网络，双列直插，模压浸，0135电路
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| File Size |
214.21K /
4 Page |
View
it Online |
Download Datasheet |
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Amphenol Communications Solutions |
| Part No. |
68000-101HLF
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| Description |
BergStik®, Board to Board connector, Unshrouded Header, Through Hole, Single Row, 1 Positions, 2.54 mm Pitch, Vertical, 5.84 mm (0.23 in.) Mating, 2.41 mm (0.095 in.) Tail
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Official Product Page
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Price and Availability
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