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  75757-0422 Datasheet PDF File

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    75757-0422 0757570422

Molex Electronics Ltd.
Part No. 75757-0422 0757570422
Description 3.50mm (.138) Pitch, MX150 Header, Breakaway, Vertical, 2 Circuits, 1.25um (50u) Nickel (Ni) Overall
File Size 98.91K  /  3 Page

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Amphenol Communications Solutions
Part No. 10137785-042222LF
Description Minitek® Pwr 4.2 HCC, Single Row, Vertical Through Hole Header, Nylon 66, Gold Flash plating, Black Color, 4 Positions, Non GW Compatible, without Post, Tray packing.
Tech specs 　 　

Official Product Page

HUA FENG CIRCUIT





    75757-5121

Molex Electronics Ltd.
Part No. 75757-5121
Description 3.50mm (.138) Pitch, MX150?/a> Header, Breakaway, Vertical, 4 Circuits, 2.50μm (100μ) Tin (Sn) Plating, 16.09mm (.633) Mating Pin Length, 3.05mm (.120) PC Tail
File Size 166.21K  /  4 Page

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Amphenol Communications Solutions
Part No. 10127820-0422CLF
Description Minitek® Pwr 4.2, Dual Row, Vertical Through Hole Header, 80u\\ Min Tin plating, Natural Color, 4 Positions, Non GW Compatible Nylon66, Tape and Reel with cap.
Tech specs 　 　

Official Product Page

    75757-1302

Molex Electronics Ltd.
Part No. 75757-1302
Description 3.50mm (.138) Pitch, MX150?/a> Header, Breakaway, Vertical, 20 Circuits, 0.75μm (30μ) Select Gold (Au) Plating, 11.20mm (.441) Mating Pin Length
File Size 166.40K  /  4 Page

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Amphenol Communications Solutions
Part No. 10127820-0422LCLF
Description Minitek® Pwr 4.2, Dual Row, Vertical Through Hole Header, 80u\\ Min Tin plating, Natural Color, 4 Positions, LCP, GW Compatible, Taoe and Reel with cap.
Tech specs 　 　

Official Product Page

    75757-5261

Molex Electronics Ltd.
Part No. 75757-5261
Description 3.50mm (.138) Pitch, MX150?/a> Header, Breakaway, Vertical, 12 Circuits, 1.25μm (50μ) Nickel (Ni) Overall, 2.50μm (100μ) Minimum Select Matte Tin (Sn) Plating on Tail
File Size 166.28K  /  4 Page

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Amphenol Communications Solutions
Part No. 10127820-0422GCLF
Description Minitek® Pwr 4.2, Dual Row, Vertical Through Hole Header, 80u\\ Min Tin plating, Natural Color, 4 Positions, GW Compatible Nylon66, Tape and Reel with cap.
Tech specs 　 　

Official Product Page

    75757-1221

Molex Electronics Ltd.
Part No. 75757-1221
Description 3.50mm (.138) Pitch, MX150?/a> Header, Breakaway, Vertical, 4 Circuits, Gold (Au) Flash Plating, 11.20mm (.441) Mating Pin Length, 3.05mm (.120) PC Tail Length
File Size 166.45K  /  4 Page

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Amphenol Communications Solutions
Part No. G88MPH0422CEU
Description Micro Power Plus 3.0 Connector System - G88MP Series, Wire to Board connector, Housing, Dual row, 3.0mm pitch, 4 positions, Ny66, Black, BAG
Tech specs 　 　

Official Product Page

    75757-5101

Molex Electronics Ltd.
Part No. 75757-5101
Description 3.50mm (.138) Pitch, MX150?/a> Header, Breakaway, Vertical, 20 Circuits, 2.50μm (100μ) Tin (Sn) Plating, 16.09mm (.633) Mating Pin Length
File Size 166.21K  /  4 Page

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Amphenol Communications Solutions
Part No. 10134160-4220LF
Description Minitek® Pwr 3.0, Receptacle Terminal, 30u\\ Gold Plating, Chrysocal, AWG(#20-24).
Tech specs 　 　

Official Product Page

    75757-5241

Molex Electronics Ltd.
Part No. 75757-5241
Description 3.50mm (.138) Pitch, MX150?/a> Header, Breakaway, Vertical, 8 Circuits, 1.25μm (50μ) Nickel (Ni) Overall, 2.50μm (100μ) Minimum Select Matte Tin (Sn) Plating on Tail
File Size 166.27K  /  4 Page

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Amphenol Communications Solutions
Part No. G88MPH0422AEU
Description Micro Power Plus, Housing, Dual row, 3.0mm pitch, 4 positions, Ny66, Black, BAG
Tech specs 　 　

Official Product Page

    75757-5201

Molex Electronics Ltd.
Part No. 75757-5201
Description 3.50mm (.138) Pitch, MX150?/a> Header, Breakaway, Vertical, 20 Circuits, 1.25μm (50μ) Nickel (Ni) Overall, 2.50μm (100μ) Minimum Select Matte Tin (Sn) Plating on Tail
File Size 166.28K  /  4 Page

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Amphenol Communications Solutions
Part No. 68004-229HLF
Description BergStik® 2.54mm, Board to Board connector, Unshrouded Header, Through Hole, Single Row, 29 Positions, 2.54 mm Pitch, Vertical, 8.08 mm (0.318in) Mating, 2.72 mm (0.107in) Tail.
Tech specs 　 　

Official Product Page

    75757-5181

Molex Electronics Ltd.
Part No. 75757-5181
Description 3.50mm (.138) Pitch, MX150 Header, Breakaway, Vertical, 16 Circuits, 2.50um (100u) Tin (Sn) Plating
File Size 166.21K  /  4 Page

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Amphenol Communications Solutions
Part No. 57102-G04-22LF
Description Minitek® 2.00mm, Board/Wire to Board Connector, 2.00mm (0,079in), Unshrouded Vertical Header, Through Hole, Double Row, 44 Positions
Tech specs 　 　

Official Product Page

    75757-0432

Molex Electronics Ltd.
Part No. 75757-0432
Description 3.50mm (.138) Pitch, MX150?/a> Header, Breakaway, Vertical, 4 Circuits, 1.25μm (50μ) Nickel (Ni) Overall, 1.50μm (60μ) Minimum Select Matte Tin (Sn) Plating Overall
File Size 99.27K  /  3 Page

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Amphenol Communications Solutions
Part No. 68004-227HLF
Description BergStik® 2.54mm, Board to Board connector, Unshrouded Header, Through Hole, Single Row, 27 Positions, 2.54 mm Pitch, Vertical, 8.08 mm (0.318in) Mating, 2.72 mm (0.107in) Tail.
Tech specs 　 　

Official Product Page

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