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Toshiba Electronic Devices & Storage Corporation |
| Part No. |
TPH1100CQ5
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| Description |
N-ch MOSFET, 150 V, 49 A, 0.0111 Ω@10 V, High-speed diode, SOP Advance(N)
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| Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
| Part No. |
54112-110062000LF
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| Description |
BergStik®, Board to Board connector, Unshrouded vertical stacked header, Through Hole, Double Row, 6 Positions, 2.54mm (0.100in) Pitch.
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| Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
| Part No. |
89074-1100LF
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| Description |
4 Row Signal Header, Straight, Press-Fit, 2 Mod
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| Tech specs |
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Official Product Page
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Molex Electronics Ltd.
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| Part No. |
73810-1210
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| Description |
2.00mm (.079) Pitch HDM? Board-to-Board Midplane Header, Vertical SMC, Press-Fit, Double End Option, Slide On Housing, 144 Circuits
2.00mm (.079") Pitch HDM庐 Board-to-Board Midplane Header, Vertical SMC, Press-Fit, Double End Option, Slide On Housing, 144 Circuits
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| File Size |
156.98K /
4 Page |
 View
it Online |
Download Datasheet
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Amphenol Communications Solutions |
| Part No. |
54112-107641100LF
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| Description |
BergStik®, Board to Board connector, Unshrouded vertical stacked header, Through Hole, Double Row, 64 Positions, 2.54mm (0.100in) Pitch.
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| Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
| Part No. |
10132798-021100LF
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| Description |
BergStak® 0.5mm Mezzanine Connector, Board To Board Connectors, 20 position, 2.15mm height receptacle connector.
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| Tech specs |
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Official Product Page
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Molex Electronics Ltd.
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| Part No. |
73810-1218
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| Description |
2.00mm (.079) Pitch HDM? Board-to-Board Midplane Header, Vertical SMC, PressFit, Double End Option, Slide On Housing, 144 Circuits
2.00mm (.079") Pitch HDM庐 Board-to-Board Midplane Header, Vertical SMC, PressFit, Double End Option, Slide On Housing, 144 Circuits
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| File Size |
164.68K /
4 Page |
View
it Online |
Download Datasheet |
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Amphenol Communications Solutions |
| Part No. |
20021211-00006T8LF
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| Description |
Minitek127®, Board/Wire to Board connector, Shrouded Vertical Header, Through Hole, Double Row, 6 Positions, 1.27 mm (.050in) Pitch.
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| Tech specs |
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Official Product Page
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Molex Electronics Ltd.
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| Part No. |
73810-1217
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| Description |
2.00mm (.079) Pitch HDM? Board-to-Board Midplane Header, Vertical SMC, Press-Fit, Double End Option, Slide On Housing, 144 Circuits
2.00mm (.079") Pitch HDM庐 Board-to-Board Midplane Header, Vertical SMC, Press-Fit, Double End Option, Slide On Housing, 144 Circuits
|
| File Size |
164.68K /
4 Page |
View
it Online |
Download Datasheet |
| |
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Amphenol Communications Solutions |
| Part No. |
20021611-00012T1LF
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| Description |
1.27mm (0.05in.) pitch, Header with eject latch, 12 contacts
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| Tech specs |
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Official Product Page
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Molex Electronics Ltd.
|
| Part No. |
73810-1216
|
| Description |
2.00mm (.079) Pitch HDM? Board-to-Board Midplane Header, Vertical SMC, PressFit, Double End Option, Slide On Housing, 144 Circuits
2.00mm (.079") Pitch HDM庐 Board-to-Board Midplane Header, Vertical SMC, PressFit, Double End Option, Slide On Housing, 144 Circuits
|
| File Size |
156.83K /
4 Page |
View
it Online |
Download Datasheet |
| |
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Amphenol Communications Solutions |
| Part No. |
10134811-001LF
|
| Description |
HPCE VT Receptacle 6LP Omitted 2LP
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| Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
| Part No. |
10131318-2211100LF
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| Description |
Minitek® Pwr 4.2 HCC, Dual Row, Right Angle Through Hole Header, Gold Flash plating, Natural Color, 22 Positions, Non GW Compatible Nylon66, Tray Packing.
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| Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
| Part No. |
10131318-0811100LF
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| Description |
Minitek® Pwr 4.2 HCC, Dual Row, Right Angle Through Hole Header, Gold Flash plating, Natural Color, 8 Positions, Non GW Compatible Nylon66, Tray Packing.
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| Tech specs |
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Official Product Page
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Bom2Buy.com
Price and Availability
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