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  73780-3245 Datasheet PDF File

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    Molex, Inc.
MOLEX INC
Part No. 73780-3247 73780-3245 73780-3145 73780-3243 73780-3163 73780-2255 73780-2256
Description HDM DC Stkg Mod PF 3.0 30 SAu 144Ckt 144 CONTACT(S), FEMALE, STRAIGHT TWO PART BOARD CONNECTOR, PRESS FIT, RECEPTACLE
HDM DC Stkg Mod PF 3.0 144 Ckt 15 High 144 CONTACT(S), FEMALE, STRAIGHT TWO PART BOARD CONNECTOR, PRESS FIT, RECEPTACLE
HDM DC Stacking Module PF 30Au 144Ckt 144 CONTACT(S), FEMALE, STRAIGHT TWO PART BOARD CONNECTOR, PRESS FIT, RECEPTACLE
HDM DC Stacking Module 144Ckt 144 CONTACT(S), FEMALE, STRAIGHT TWO PART BOARD CONNECTOR, PRESS FIT, RECEPTACLE
737803163 144 CONTACT(S), FEMALE, STRAIGHT TWO PART BOARD CONNECTOR, PRESS FIT, RECEPTACLE
HDM DC Stacking Mod PF3.5 72 Ckt 72 CONTACT(S), FEMALE, STRAIGHT TWO PART BOARD CONNECTOR, PRESS FIT, RECEPTACLE
HDM DC Stkg Mod PF 3.5 30 Sau 72 Ckt

File Size 194.46K  /  1 Page

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Amphenol Communications Solutions

Part No. 10132450-0611GLF
Description Minitek® Pwr 3.0 HCC, Dual Row, Vertical Through Hole Header, Gold Flash plating, Black Color, 6 Positions, GW Compatible PA9T, Tray packing.
Tech specs    

Official Product Page

HUA FENG CIRCUIT





    0737803245 73780-3245

Molex Electronics Ltd.
Part No. 0737803245 73780-3245
Description 2.00mm (.079) Pitch HDM? Board-to-Board Daughtercard Receptacle, Vertical, SignalModule, 144 Circuits, Mounted Height 15.00mm (.591), Pin Length 3.00mm (.118),

File Size 198.71K  /  3 Page

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Amphenol Communications Solutions

Part No. 10132450-0811GLF
Description Minitek® Pwr 3.0 HCC, Dual Row, Vertical Through Hole Header, Gold Flash plating, Black Color, 8 Positions, GW Compatible PA9T, Tray packing.
Tech specs    

Official Product Page

    73780-0234

Molex Electronics Ltd.
Part No. 73780-0234
Description 2.00mm (.079) Pitch HDM? Board-to-Board Daughtercard Receptacle, Vertical, SignalModule, 72 Circuits, Mounted Height 14.00mm (.551), Pin Length 2.50mm (.098),

File Size 202.01K  /  3 Page

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Amphenol Communications Solutions

Part No. 10132450-0211GLF
Description Minitek® Pwr 3.0 HCC, Dual Row, Vertical Through Hole Header, Gold Flash plating, Black Color, 2 Positions, GW Compatible PA9T, Tray packing.
Tech specs    

Official Product Page

    73780-2164

Molex Electronics Ltd.
Part No. 73780-2164
Description 2.00mm (.079) Pitch HDM? Board-to-Board Daughtercard Receptacle, Vertical, SignalModule, 72 Circuits, Mounted Height 14.00mm (.551), Pin Length 4.00mm (.157),

File Size 194.17K  /  3 Page

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Amphenol Communications Solutions

Part No. 10132450-0421GLF
Description Minitek® Pwr 3.0 HCC, Dual Row, Vertical Through Hole Header, Tin plating, Black Color, 4 Positions, GW Compatible PA9T, Tray packing.
Tech specs    

Official Product Page

    73780-2157

Molex Electronics Ltd.
Part No. 73780-2157
Description 2.00mm (.079) Pitch HDM? Board-to-Board Daughtercard Receptacle, Vertical, SignalModule, 72 Circuits, Mounted Height 17.00mm (.669), Pin Length 3.50mm (.138),

File Size 198.95K  /  3 Page

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Amphenol Communications Solutions

Part No. 10132450-1211GLF
Description Minitek® Pwr 3.0 HCC, Dual Row, Vertical Through Hole Header, Gold Flash plating, Black Color, 12 Positions, GW Compatible PA9T, Tray packing.
Tech specs    

Official Product Page

    73780-2147

Molex Electronics Ltd.
Part No. 73780-2147
Description 2.00mm (.079) Pitch HDM Board-to-Board Daughtercard Receptacle, Vertical, Signal Module, 72 Circuits

File Size 194.17K  /  3 Page

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Amphenol Communications Solutions

Part No. 86832-454HLF
Description BergStik® 2.54mm, Board to Board connector, Unshrouded Header, Through Hole, Double Row, 54 Positions, 2.54 mm Pitch, Vertical, 8.26 mm (0.325 in.) Mating, 2.54 mm (0.1 in.) Tail.
Tech specs    

Official Product Page

    73780-2133

Molex Electronics Ltd.
Part No. 73780-2133
Description 2.00mm (.079) Pitch HDM? Board-to-Board Daughtercard Receptacle, Vertical, SignalModule, 72 Circuits, Mounted Height 13.00mm (.512), Pin Length 2.50mm (.098),

File Size 236.74K  /  3 Page

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Amphenol Communications Solutions

Part No. 10132450-1821GLF
Description Minitek® Pwr 3.0 HCC, Dual Row, Vertical Through Hole Header, Tin plating, Black Color, 18 Positions, GW Compatible PA9T, Tray packing.
Tech specs    

Official Product Page

    73780-2267

Molex Electronics Ltd.
Part No. 73780-2267
Description 2.00mm (.079) Pitch HDM? Board-to-Board Daughtercard Receptacle, Vertical, SignalModule, 72 Circuits, Mounted Height 17.00mm (.669), Pin Length 4.00mm (.157),

File Size 198.95K  /  3 Page

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Amphenol Communications Solutions

Part No. 10132450-1411GLF
Description Minitek® Pwr 3.0 HCC, Dual Row, Vertical Through Hole Header, Gold Flash plating, Black Color, 14 Positions, GW Compatible PA9T, Tray packing.
Tech specs    

Official Product Page

    73780-2257

Molex Electronics Ltd.
Part No. 73780-2257
Description 2.00mm (.079) Pitch HDM? Board-to-Board Daughtercard Receptacle, Vertical, SignalModule, 72 Circuits, Mounted Height 17.00mm (.669), Pin Length 3.50mm (.138),

File Size 198.99K  /  3 Page

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Amphenol Communications Solutions

Part No. 10132450-0221GLF
Description Minitek® Pwr 3.0 HCC, Dual Row, Vertical Through Hole Header, Tin plating, Black Color, 2 Positions, GW Compatible PA9T, Tray packing.
Tech specs    

Official Product Page

    73780-0224

Molex Electronics Ltd.
Part No. 73780-0224
Description 2.00mm (.079) Pitch HDM Board-to-Board Daughtercard Receptacle, Vertical, Signal Module, 72 Circuits, Mounted

File Size 202.00K  /  3 Page

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Amphenol Communications Solutions

Part No. 86832-456HLF
Description BergStik® 2.54mm, Board to Board connector, Unshrouded Header, Through Hole, Double Row, 56 Positions, 2.54 mm Pitch, Vertical, 8.26 mm (0.325 in.) Mating, 2.54 mm (0.1 in.) Tail.
Tech specs    

Official Product Page

For 73780-3245 Found Datasheets File :: 150+       Page :: | <1> | 2 | 3 | 4 | 5 | 6 | 7 | 8 | 9 | 10 | 11 | 12 | 13 | 14 | 15 |   

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