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  73644-2202 Datasheet PDF File

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    73644-2202 0736442202

Molex Electronics Ltd.
Part No. 73644-2202 0736442202
Description 2.00mm (.079) Pitch HDM? Board-to-Board Backplane Header, Vertical, SMC, Press-Fit, Guide Post Location B, Polarizing Key Position B, 72 Circuits

File Size 174.00K  /  4 Page

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Amphenol Communications Solutions

Part No. 84512-202LF
Description 100 Position BGA Plug, 0mm Component Height, 1.27mm x 1.27mm Array, Lead-free
Tech specs    

Official Product Page

HUA FENG CIRCUIT





    73644-2117

Molex Electronics Ltd.
Part No. 73644-2117
Description 2.00mm (.079) Pitch HDM Board-to-Board Backplane Header, Vertical, SMC, Press- Fit, Guide Post Location A

File Size 163.63K  /  4 Page

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Amphenol Communications Solutions

Part No. 71922-020LF
Description Quickie®, Wire to Board connectors, Double Row, 20Positions, 2.54 mm (0.1 in.), Right Angle, Eject Latch Header.
Tech specs    

Official Product Page

    73644-1207

Molex Electronics Ltd.
Part No. 73644-1207
Description 2.00mm (.079) Pitch HDM Board-to-Board Backplane Header, Vertical, SMC, Press- Fit, Guide Post Location A

File Size 167.28K  /  4 Page

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Amphenol Communications Solutions

Part No. 10082202-101-60LF
Description BergStik®, Board to Board connector, Unshrouded Right Angle Header, Through Hole, Pin In Paste, Double row , 60 Positions, 2.54mm (0.100in) Pitch
Tech specs    

Official Product Page

    73644-1201

Molex Electronics Ltd.
Part No. 73644-1201
Description 2.00mm (.079) Pitch HDM? Board-to-Board Backplane Header, Vertical, SMC, PressFit, Guide Post Location A, Polarizing Key Position A, 144 Circuits

File Size 160.13K  /  4 Page

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Amphenol Communications Solutions

Part No. 61082-202509PLF
Description BergStak® 0.80mm Pitch, Receptacle, Vertical, Double Row, 200 Positions.
Tech specs    

Official Product Page

    73644-1202

Molex Electronics Ltd.
Part No. 73644-1202
Description 2.00mm (.079) Pitch HDM Board-to-Board Backplane Header, Vertical, SMC, Press- Fit, Guide Post Location B

File Size 167.27K  /  4 Page

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Amphenol Communications Solutions

Part No. 61082-202402LF
Description BergStak® 0.80mm Pitch, Receptacle, Vertical, Double Row, 200 Positions.
Tech specs    

Official Product Page

    73644-2016

Molex Electronics Ltd.
Part No. 73644-2016
Description 2.00mm (.079) Pitch HDM Board-to-Board Backplane Header, Vertical, SMC, Press- Fit, Guide Post Location B

File Size 164.19K  /  4 Page

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Amphenol Communications Solutions

Part No. 71922-020
Description Quickie®, Wire to Board connectors, Double Row, 20 Positions, 2.54 mm (0.1 in.), Right Angle, Eject Latch Header 0.76 um (30 u\\.) Gold or GXT™ Plating
Tech specs    

Official Product Page

    73644-1206

Molex Electronics Ltd.
Part No. 73644-1206
Description 2.00mm (.079) Pitch HDM? Board-to-Board Backplane Header, Vertical, SMC, PressFit, Guide Post Location B, Polarizing Key Position D, 144 Circuits

File Size 159.58K  /  4 Page

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Amphenol Communications Solutions

Part No. G874D122202C1EU
Description Mini power, Right Angle, Dual row, 4.2mm pitch, 12 positions , 100u\\ Tin, 2.30mm tail length, LCP, Natural , TRAY
Tech specs    

Official Product Page

    73644-1204

Molex Electronics Ltd.
Part No. 73644-1204
Description 2.00mm (.079) Pitch HDM? Board-to-Board Backplane Header, Vertical, SMC, PressFit, Guide Post Location B, Polarizing Key Position C, 144 Circuits

File Size 167.28K  /  4 Page

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Amphenol Communications Solutions

Part No. 10082202-101A06LF
Description BergStik®, Board to Board connector, Unshrouded Right Angle Header, Through Hole, Pin In Paste, Double row , 6 Positions, 2.54mm (0.100in) Pitch
Tech specs    

Official Product Page

    73644-3210

Molex Electronics Ltd.
Part No. 73644-3210
Description 2.00mm (.079) Pitch HDM? Board-to-Board Backplane Header, Vertical, SMC, PressFit, Guide Post Location B, Polarizing Key Position F, 144 Circuits

File Size 164.13K  /  4 Page

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Amphenol Communications Solutions

Part No. 85832-202LF
Description Metral® Board Connectors, Backplane Connectors, 5 Row Signal Header, Straight, Press-Fit, Wide body, 2 Mod.
Tech specs    

Official Product Page

    73644-2018

Molex Electronics Ltd.
Part No. 73644-2018
Description 2.00mm (.079) Pitch HDM? Board-to-Board Backplane Header, Vertical, SMC, PressFit, Guide Post Location N/A, Polarizing Key Position N/A, 72 Circuits

File Size 174.00K  /  4 Page

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Amphenol Communications Solutions

Part No. 10153302-20211LF
Description PC104, Board to Board Connectors, 2.54mm Pitch, 2x20P, DIP=3.4, Press Fit, Gold Flash
Tech specs    

Official Product Page

For 73644-2202 Found Datasheets File :: 150+       Page :: | <1> | 2 | 3 | 4 | 5 | 6 | 7 | 8 | 9 | 10 | 11 | 12 | 13 | 14 | 15 |   

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