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  73644-2201 Datasheet PDF File

For 73644-2201 Found Datasheets File :: 150+       Page :: | <1> | 2 | 3 | 4 | 5 | 6 | 7 | 8 | 9 | 10 | 11 | 12 | 13 | 14 | 15 |   

    Molex, Inc.
MOLEX INC
Part No. 73644-0117 73644-2000 73644-0016 73644-3116 73644-2201 73644-0205 73644-1011 73644-0204
Description HDM BP GP A 30 SAu GF 72Ckt 72 CONTACT(S), MALE, STRAIGHT TWO PART BOARD CONNECTOR, PRESS FIT
HDM BP KEYED W/GUIDE &POL 736442000 72 CONTACT(S), MALE, STRAIGHT TWO PART BOARD CONNECTOR, PRESS FIT
736440016 72 CONTACT(S), MALE, STRAIGHT TWO PART BOARD CONNECTOR, PRESS FIT
144CKT HDM BACKPLANE MODU 736443116 144 CONTACT(S), MALE, STRAIGHT TWO PART BOARD CONNECTOR, PRESS FIT
2MM HDM BP GP Polz Pn AA 72Ckt 72 CONTACT(S), MALE, STRAIGHT TWO PART BOARD CONNECTOR, PRESS FIT
Header; No. of Contacts:72; Pitch Spacing:2mm; No. of Rows:6; Series:HDM; Connector Body Material:Polymer; Contact Termination:Press-Fit 72 CONTACT(S), MALE, STRAIGHT TWO PART BOARD CONNECTOR, PRESS FIT
HDM Bkpln Mod W/PolKey 144Ckt 144 CONTACT(S), MALE, STRAIGHT TWO PART BOARD CONNECTOR, PRESS FIT
HDM BP GP Polz Pn 30 SAu GF 72Ckt

File Size 155.64K  /  2 Page

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Amphenol Communications Solutions

Part No. 10082201-104A06LF
Description BergStik®, Board to Board connector, Unshrouded Right Angle Header, Through Hole, Pin In Paste, Single row , 6 Positions, 2.54mm (0.100in) Pitch
Tech specs    

Official Product Page

HUA FENG CIRCUIT





    73644-2201 0736442201

Molex Electronics Ltd.
Part No. 73644-2201 0736442201
Description 2.00mm (.079) Pitch HDM? Board-to-Board Backplane Header, Vertical, SMC, PressFit, Guide Post Location A, Polarizing Key Position A, 72 Circuits

File Size 164.18K  /  4 Page

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Amphenol Communications Solutions

Part No. 68002-201HLF
Description BergStik®, Board to Board connector, Unshrouded Vertical Header, Through Hole, Single Row, 1 Positions, 2.54 mm (0.100in) Pitch.
Tech specs    

Official Product Page

    Samsung Electronic
Part No. KA2201/N
Description 1.2 Audio Power Amplifier

File Size 271.52K  /  4 Page

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Amphenol Communications Solutions

Part No. 84502-201
Description 300 Position BGA Receptacle, 5.5mm Component Height, 1.27mm x 1.27mm Array
Tech specs    

Official Product Page

    73644-1204

Molex Electronics Ltd.
Part No. 73644-1204
Description 2.00mm (.079) Pitch HDM? Board-to-Board Backplane Header, Vertical, SMC, PressFit, Guide Post Location B, Polarizing Key Position C, 144 Circuits

File Size 167.28K  /  4 Page

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Amphenol Communications Solutions

Part No. 10060912-201LF
Description GIG-Array®, Mezzanine Connectors, 15mm Receptacle 200 Position Lead Free.
Tech specs    

Official Product Page

    73644-2018

Molex Electronics Ltd.
Part No. 73644-2018
Description 2.00mm (.079) Pitch HDM? Board-to-Board Backplane Header, Vertical, SMC, PressFit, Guide Post Location N/A, Polarizing Key Position N/A, 72 Circuits

File Size 174.00K  /  4 Page

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Amphenol Communications Solutions

Part No. 10082201-101-10LF
Description BergStik®, Board to Board connector, Unshrouded Right Angle Header, Through Hole, Pin In Paste, Single row , 10 Positions, 2.54mm (0.100in) Pitch
Tech specs    

Official Product Page

    73644-2017

Molex Electronics Ltd.
Part No. 73644-2017
Description 2.00mm (.079) Pitch HDM? Board-to-Board Backplane Header, Vertical, SMC, PressFit, Guide Post Location A, Polarizing Key Position N/A, 72 Circuits

File Size 164.18K  /  4 Page

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Amphenol Communications Solutions

Part No. L17H2220125
Description Dsub, Stamped Signal 3A, Dual Port Right Angle PCB Thru Hole, F=19.05mm (0.750in), 9/9 (Socket/Socket), Flash Gold, Bright Tin Shell, M3 Removable Front Screwlock, 2*Arrowhead Boardlock
Tech specs    

Official Product Page

    73644-1207

Molex Electronics Ltd.
Part No. 73644-1207
Description 2.00mm (.079) Pitch HDM Board-to-Board Backplane Header, Vertical, SMC, Press- Fit, Guide Post Location A

File Size 167.28K  /  4 Page

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Amphenol Communications Solutions

Part No. RJE0162201
Description Modular Jack - Right Angle, Input Output Connectors 6P2C, Shield.
Tech specs    

Official Product Page

    73644-0005

Molex Electronics Ltd.
Part No. 73644-0005
Description 2.00mm (.079) Pitch HDM Board-to-Board Backplane Header, Vertical, SMC, Press- Fit, Guide Post Location A

File Size 166.78K  /  4 Page

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Amphenol Communications Solutions

Part No. 10082201-404-06LF
Description BergStik®, Board to Board connector, Unshrouded Right Angle Header, Through Hole, Pin In Paste, Single row , 6 Positions, 2.54mm (0.100in) Pitch
Tech specs    

Official Product Page

    73644-1202

Molex Electronics Ltd.
Part No. 73644-1202
Description 2.00mm (.079) Pitch HDM Board-to-Board Backplane Header, Vertical, SMC, Press- Fit, Guide Post Location B

File Size 167.27K  /  4 Page

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Amphenol Communications Solutions

Part No. 10082201-405-03LF
Description BergStik®, Board to Board connector, Unshrouded Right Angle Header, Through Hole, Pin In Paste, Single row , 3 Positions, 2.54mm (0.100in) Pitch
Tech specs    

Official Product Page

    73644-1206

Molex Electronics Ltd.
Part No. 73644-1206
Description 2.00mm (.079) Pitch HDM? Board-to-Board Backplane Header, Vertical, SMC, PressFit, Guide Post Location B, Polarizing Key Position D, 144 Circuits

File Size 159.58K  /  4 Page

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Amphenol Communications Solutions

Part No. 10123982-201
Description MEG-Array®, Mezzanine, 320 Positions, Receptacle, 1.27mm (0.050in) Pitch, 4.00mm (0.157in) Stack Height.
Tech specs    

Official Product Page

For 73644-2201 Found Datasheets File :: 150+       Page :: | <1> | 2 | 3 | 4 | 5 | 6 | 7 | 8 | 9 | 10 | 11 | 12 | 13 | 14 | 15 |   

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