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  73644-1001 Datasheet PDF File

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    73644-1001 0736441001

Molex Electronics Ltd.
Part No. 73644-1001 0736441001
Description 2.00mm (.079) Pitch HDM? Board-to-Board Backplane Header, Vertical, SMC, Press-Fit, Guide Post Location A, Polarizing Key Position A, 144 Circuits

File Size 167.84K  /  4 Page

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Amphenol Cables on Demand

Part No. SF-NDYYYF0001-001M_Group
Description Amphenol SF-NDYYYF0001-001M 1m (3.3') 400GbE QSFP-DD Cable - Amphenol 400-Gigabit Ethernet Passive Copper QSFP Double Density Cable (Dual Entry 30 AWG) - QSFP-DD to QSFP-DD
Tech specs    

Official Product Page

HUA FENG CIRCUIT





    73644-1203

Molex Electronics Ltd.
Part No. 73644-1203
Description 2.00mm (.079) Pitch HDM Board-to-Board Backplane Header, Vertical, SMC, Press- Fit, Guide Post Location A

File Size 159.58K  /  4 Page

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Amphenol Cables on Demand

Part No. SF-NDVVYF0001-001M
Description Amphenol SF-NDVVYF0001-001M 1m (3.3') 400GbE OSFP Cable - Amphenol 400-Gigabit Ethernet Passive Copper OSFP Cable (30 AWG) – OSFP to OSFP
Tech specs    

Official Product Page

    73644-2018

Molex Electronics Ltd.
Part No. 73644-2018
Description 2.00mm (.079) Pitch HDM? Board-to-Board Backplane Header, Vertical, SMC, PressFit, Guide Post Location N/A, Polarizing Key Position N/A, 72 Circuits

File Size 174.00K  /  4 Page

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Amphenol Cables on Demand

Part No. SF-NDYYYF0001-001M
Description Amphenol SF-NDYYYF0001-001M 1m (3.3') 400GbE QSFP-DD Cable - Amphenol 400-Gigabit Ethernet Passive Copper QSFP Double Density Cable (Dual Entry 30 AWG) - QSFP-DD to QSFP-DD
Tech specs    

Official Product Page

    73644-2016

Molex Electronics Ltd.
Part No. 73644-2016
Description 2.00mm (.079) Pitch HDM Board-to-Board Backplane Header, Vertical, SMC, Press- Fit, Guide Post Location B

File Size 164.19K  /  4 Page

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Amphenol Communications Solutions

Part No. 10018783-10011MLF
Description PCI Express® GEN 3 Card Edge, Storage and Server Connector, Vertical, Through Hole, x4, 64 Positions, 1.00mm (0.039in) Pitch
Tech specs    

Official Product Page

    73644-3210

Molex Electronics Ltd.
Part No. 73644-3210
Description 2.00mm (.079) Pitch HDM? Board-to-Board Backplane Header, Vertical, SMC, PressFit, Guide Post Location B, Polarizing Key Position F, 144 Circuits

File Size 164.13K  /  4 Page

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Amphenol Communications Solutions

Part No. 10018783-10010TLF
Description PCI Express® GEN 3 Card Edge, Storage and Server Connector, Vertical, Through Hole, x1, 36 Positions, 1.00mm (0.039in) Pitch
Tech specs    

Official Product Page

    73644-2017

Molex Electronics Ltd.
Part No. 73644-2017
Description 2.00mm (.079) Pitch HDM? Board-to-Board Backplane Header, Vertical, SMC, PressFit, Guide Post Location A, Polarizing Key Position N/A, 72 Circuits

File Size 164.18K  /  4 Page

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Amphenol Communications Solutions

Part No. 10018783-10013YLF
Description PCI Express® Gen 3 Card Edge Connector, Storage and Server System, Hard Tray, Vertical - Mount Connector, Through Hole Termination, 164 Positions.
Tech specs    

Official Product Page

    73644-0005

Molex Electronics Ltd.
Part No. 73644-0005
Description 2.00mm (.079) Pitch HDM Board-to-Board Backplane Header, Vertical, SMC, Press- Fit, Guide Post Location A

File Size 166.78K  /  4 Page

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Amphenol Communications Solutions

Part No. 10018783-10012TLF
Description PCI Express® GEN 3 Card Edge, Storage and Server Connector, Vertical, Through Hole, x8, 98 Positions, 1.00mm (0.039in) Pitch
Tech specs    

Official Product Page

    73644-1207

Molex Electronics Ltd.
Part No. 73644-1207
Description 2.00mm (.079) Pitch HDM Board-to-Board Backplane Header, Vertical, SMC, Press- Fit, Guide Post Location A

File Size 167.28K  /  4 Page

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Amphenol Communications Solutions

Part No. 10018783-11001TLF
Description PCI Express® GEN 3 Card Edge, Storage and Server Connector, Vertical, Through Hole, x4, 64 Positions, 1.00mm (0.039in) Pitch
Tech specs    

Official Product Page

    73644-1202

Molex Electronics Ltd.
Part No. 73644-1202
Description 2.00mm (.079) Pitch HDM Board-to-Board Backplane Header, Vertical, SMC, Press- Fit, Guide Post Location B

File Size 167.27K  /  4 Page

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Amphenol Communications Solutions

Part No. 10018783-10013TLF
Description PCI Express® GEN 3 Card Edge, Storage and Server Connector, Vertical, Through Hole, x16, 164 Positions, 1.00mm (0.039in) Pitch
Tech specs    

Official Product Page

    73644-1206

Molex Electronics Ltd.
Part No. 73644-1206
Description 2.00mm (.079) Pitch HDM? Board-to-Board Backplane Header, Vertical, SMC, PressFit, Guide Post Location B, Polarizing Key Position D, 144 Circuits

File Size 159.58K  /  4 Page

View it Online

Download Datasheet

   

Amphenol Communications Solutions

Part No. 10018783-10011TLF
Description PCI Express® GEN 3 Card Edge, Storage and Server Connector, Vertical, Through Hole, x4, 64 Positions, 1.00mm (0.039in) Pitch
Tech specs    

Official Product Page

For 73644-1001 Found Datasheets File :: 150+       Page :: | <1> | 2 | 3 | 4 | 5 | 6 | 7 | 8 | 9 | 10 | 11 | 12 | 13 | 14 | 15 |   

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