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  71764-0406 Datasheet PDF File

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    Molex, Inc.
MOLEX INC
Part No. 71764-9003 71764-0212 71764-0004 71764-0322 71764-0008 71764-0406
Description CGrid R/A Bkway Hdr Tin 6Ckt W/ Vd 5 CONTACT(S), MALE, RIGHT ANGLE TWO PART BOARD CONNECTOR, SOLDER
CGrid R/A Bkway Hdr 30 SAu 12Ckt 12 CONTACT(S), MALE, RIGHT ANGLE TWO PART BOARD CONNECTOR, SOLDER
717640004 4 CONTACT(S), MALE, RIGHT ANGLE TWO PART BOARD CONNECTOR, SOLDER
CGrid R/A Bkway Hdr Tin 22Ckt 22 CONTACT(S), MALE, RIGHT ANGLE TWO PART BOARD CONNECTOR, SOLDER
CGrid R/A Bkway Hdr Tin 8Ckt 8 CONTACT(S), MALE, RIGHT ANGLE TWO PART BOARD CONNECTOR, SOLDER
CGrid R/A Bkway Hdr 15 SAu 6Ckt

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Amphenol Communications Solutions

Part No. G832MB030406022HR
Description 0.80mm Board-to-Board 85Ω Connector, Pitch 0.8mm, Height 11.7 mm, 40 Positions, Dual Row, BTB Vertical Receptacle SMT, Gold Flash White.
Tech specs    

Official Product Page

HUA FENG CIRCUIT





    71764-0224

Molex Electronics Ltd.
Part No. 71764-0224
Description 2.54mm (.100) Pitch C-Grid? Breakaway Header, Low Profile, Dual Row, Right AngleHigh Temperature, 24 Circuits, 0.76μm (30μ) Gold (Au) Selective Plating

File Size 121.00K  /  5 Page

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Amphenol Communications Solutions

Part No. 69190-406HLF
Description BergStik®, Board to Board connector, Unshrouded vertical header, Through Hole, Single Row, 06 Positions, 2.54 mm (0.100in) Pitch.
Tech specs    

Official Product Page

    71764-0126

Molex Electronics Ltd.
Part No. 71764-0126
Description 2.54mm (.100") Pitch C-Grid庐 Breakaway Header, Low Profile, Dual Row, Right AngleHigh Temperature, 26 Circuits, 0.38渭m (15渭") Gold (Au) Selective Plating

File Size 121.16K  /  5 Page

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Amphenol Communications Solutions

Part No. 77319-804-06LF
Description BergStik®, Board to Board connector, Unshrouded right angled header, Through Hole, Double Row, 06 Positions, 2.54 mm (0.100) Pitch.
Tech specs    

Official Product Page

    71764-0106

Molex Electronics Ltd.
Part No. 71764-0106
Description 2.54mm (.100) Pitch C-Grid? Breakaway Header, Low Profile, Dual Row, Right AngleHigh Temperature, 6 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating
2.54mm (.100") Pitch C-Grid庐 Breakaway Header, Low Profile, Dual Row, Right AngleHigh Temperature, 6 Circuits, 0.38渭m (15渭") Gold (Au) Selective Plating

File Size 121.09K  /  5 Page

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Amphenol Communications Solutions

Part No. 54776-604-06LF
Description BergStik®, Board to Board connector, Unshrouded Vertical Stacking Header, Through Hole, Double row , Double body, Triplex, 6 Positions, 2.54mm (0.100in) Pitch
Tech specs    

Official Product Page

    71764-0104

Molex Electronics Ltd.
Part No. 71764-0104
Description 2.54mm (.100) Pitch C-Grid? Breakaway Header, Low Profile, Dual Row, Right Angle,High Temperature, 4 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating
2.54mm (.100") Pitch C-Grid庐 Breakaway Header, Low Profile, Dual Row, Right Angle,High Temperature, 4 Circuits, 0.38渭m (15渭") Gold (Au) Selective Plating

File Size 121.22K  /  5 Page

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Amphenol Communications Solutions

Part No. 59202-S28-04-065LF
Description Minitek® 2.00mm, Board To Board, Unshrouded Vertical Header, Surface Mount, Double Row, 8 Positions.
Tech specs    

Official Product Page

    71764-0128

Molex Electronics Ltd.
Part No. 71764-0128
Description 2.54mm (.100") Pitch C-Grid庐 Breakaway Header, Low Profile, Dual Row, Right AngleHigh Temperature, 28 Circuits, 0.38渭m (15渭") Gold (Au) Selective Plating

File Size 121.16K  /  5 Page

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Amphenol Communications Solutions

Part No. 77317-804-06
Description BergStik®, Board to Board connector, Unshrouded Right angle Header, Through Hole, Double Row, 6 Positions ,2.54mm (0.100in) Pitch,
Tech specs    

Official Product Page

    71764-0130

Molex Electronics Ltd.
Part No. 71764-0130
Description 2.54mm (.100") Pitch C-Grid庐 Breakaway Header, Low Profile, Dual Row, Right AngleHigh Temperature, 30 Circuits, 0.38渭m (15渭") Gold (Au) Selective Plating

File Size 121.01K  /  5 Page

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Amphenol Communications Solutions

Part No. 71600-406LF
Description Quickie IDC Receptacle, Wire to Board connector -Double row - 6Positions - 2.54 mm (0.100in) Pitch
Tech specs    

Official Product Page

    71764-0026

Molex Electronics Ltd.
Part No. 71764-0026
Description 2.54mm (.100) Pitch C-Grid? Breakaway Header, Low Profile, Dual Row, Right AngleHigh Temperature, 26 Circuits, Tin (Sn) Plating
2.54mm (.100") Pitch C-Grid庐 Breakaway Header, Low Profile, Dual Row, Right AngleHigh Temperature, 26 Circuits, Tin (Sn) Plating

File Size 121.06K  /  5 Page

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Amphenol Communications Solutions

Part No. 68000-406HLF
Description BergStik®, Board to Board connector, Unshrouded Header, Through Hole, Single Row, 6 Positions, 2.54 mm Pitch, Vertical, 5.84 mm (0.23 in.) Mating, 2.41 mm (0.095 in.) Tail
Tech specs    

Official Product Page

    71764-0024

Molex Electronics Ltd.
Part No. 71764-0024
Description 2.54mm (.100) Pitch C-Grid Breakaway Header, Low Profile, Dual Row, Right Angle, High Temperature, 24 Circuits
2.54mm (.100") Pitch C-Grid Breakaway Header, Low Profile, Dual Row, Right Angle, High Temperature, 24 Circuits

File Size 120.83K  /  5 Page

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Amphenol Communications Solutions

Part No. 86380-406HLF
Description 86380-406HLF-B/S II HDR DR SELF-RET
Tech specs    

Official Product Page

    71764-0022

Molex Electronics Ltd.
Part No. 71764-0022
Description 2.54mm (.100) Pitch C-Grid Breakaway Header, Low Profile, Dual Row, Right Angle, High Temperature
2.54mm (.100") Pitch C-Grid Breakaway Header, Low Profile, Dual Row, Right Angle, High Temperature

File Size 120.83K  /  5 Page

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Amphenol Communications Solutions

Part No. 10082201-404-06LF
Description BergStik®, Board to Board connector, Unshrouded Right Angle Header, Through Hole, Pin In Paste, Single row , 6 Positions, 2.54mm (0.100in) Pitch
Tech specs    

Official Product Page

For 71764-0406 Found Datasheets File :: 150+       Page :: | <1> | 2 | 3 | 4 | 5 | 6 | 7 | 8 | 9 | 10 | 11 | 12 | 13 | 14 | 15 |   

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