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  71764-0212 Datasheet PDF File

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    Molex, Inc.
MOLEX INC
Part No. 71764-9003 71764-0212 71764-0004 71764-0322 71764-0008 71764-0406
Description CGrid R/A Bkway Hdr Tin 6Ckt W/ Vd 5 CONTACT(S), MALE, RIGHT ANGLE TWO PART BOARD CONNECTOR, SOLDER
CGrid R/A Bkway Hdr 30 SAu 12Ckt 12 CONTACT(S), MALE, RIGHT ANGLE TWO PART BOARD CONNECTOR, SOLDER
717640004 4 CONTACT(S), MALE, RIGHT ANGLE TWO PART BOARD CONNECTOR, SOLDER
CGrid R/A Bkway Hdr Tin 22Ckt 22 CONTACT(S), MALE, RIGHT ANGLE TWO PART BOARD CONNECTOR, SOLDER
CGrid R/A Bkway Hdr Tin 8Ckt 8 CONTACT(S), MALE, RIGHT ANGLE TWO PART BOARD CONNECTOR, SOLDER
CGrid R/A Bkway Hdr 15 SAu 6Ckt

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Amphenol Communications Solutions

Part No. 20021221-00010T4LF
Description Minitek127®, Wire to Board connector, Shrouded vertical header, Surface Mount, Double Row, 10 Positions, 1.27mm (0.500in) Pitch.
Tech specs    

Official Product Page

HUA FENG CIRCUIT





    0717640212 71764-0212

Molex Electronics Ltd.
Part No. 0717640212 71764-0212
Description 2.54mm (.100) Pitch C-Grid? Breakaway Header, Low Profile, Dual Row, Right AngleHigh Temperature, 12 Circuits, 0.76μm (30μ) Gold (Au) Selective Plating
MOLEX Connector

File Size 121.09K  /  5 Page

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Amphenol Communications Solutions

Part No. 20021211-00006T8LF
Description Minitek127®, Board/Wire to Board connector, Shrouded Vertical Header, Through Hole, Double Row, 6 Positions, 1.27 mm (.050in) Pitch.
Tech specs    

Official Product Page

    71764-0222

Molex Electronics Ltd.
Part No. 71764-0222
Description 2.54mm (.100) Pitch C-Grid? Breakaway Header, Low Profile, DualRow, Right Angle,High Temperature, 22 Circuits, 0.76μm (30μ) Gold (Au) Selective Plating

File Size 121.00K  /  5 Page

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Amphenol Communications Solutions

Part No. 20021212-000A0T4LF
Description Minitek127®, Board/Wire to Board connector, Shrouded Right Angled Header, Through Hole, Double Row, 100 Positions, 1.27 mm (.050in) Pitch.
Tech specs    

Official Product Page

    71764-0220

Molex Electronics Ltd.
Part No. 71764-0220
Description 2.54mm (.100) Pitch C-Grid? Breakaway Header, Low Profile, Dual Row, Right Angle, High Temperature, 20 Circuits, 0.76μm (30μ) Gold (Au) Selective Plating

File Size 120.87K  /  5 Page

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Amphenol Communications Solutions

Part No. 10131319-02121G0LF
Description Minitek® Pwr 4.2 HCC, Dual Row, Vertical Through Hole Header, Gold Flash plating, Black Color, 2 Positions, GW Compatible Nylon66, Tray Packing.
Tech specs    

Official Product Page

    71764-0226

Molex Electronics Ltd.
Part No. 71764-0226
Description 2.54mm (.100) Pitch C-Grid? Breakaway Header, Low Profile, Dual Row, Right AngleHigh Temperature, 26 Circuits, 0.76μm (30μ) Gold (Au) Selective Plating

File Size 120.93K  /  5 Page

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Amphenol Communications Solutions

Part No. 10137927-0212LF
Description Minitek® Pwr 3.0, Dual Row, Vertical SMT Tails and DIP Hold Down Header, Black Color, Tin plating, 2 Positions, Non GW Compatible LCP, Tape and Reel withcap.
Tech specs    

Official Product Page

    71764-0228

Molex Electronics Ltd.
Part No. 71764-0228
Description 2.54mm (.100) Pitch C-Grid? Breakaway Header, Low Profile, Dual Row, Right AngleHigh Temperature, 28 Circuits, 0.76μm (30μ) Gold (Au) Selective Plating

File Size 121.07K  /  5 Page

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Amphenol Communications Solutions

Part No. G832MC111202122HR
Description 0.80mm Board-to-Board 100Ω Connector, Pitch 0.8mm, Height 4.7 mm, 120 Positions, Dual Row, BTB Vertical Plug SMT, 15u\\ Gold Black.
Tech specs    

Official Product Page

    71764-0224

Molex Electronics Ltd.
Part No. 71764-0224
Description 2.54mm (.100) Pitch C-Grid? Breakaway Header, Low Profile, Dual Row, Right AngleHigh Temperature, 24 Circuits, 0.76μm (30μ) Gold (Au) Selective Plating

File Size 121.00K  /  5 Page

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Amphenol Communications Solutions

Part No. 20021221-00008T4LF
Description Minitek127®, Wire to Board connector, Shrouded vertical header, Surface Mount, Double Row, 8 Positions, 1.27mm (0.500in) Pitch.
Tech specs    

Official Product Page

    71764-0130

Molex Electronics Ltd.
Part No. 71764-0130
Description 2.54mm (.100") Pitch C-Grid庐 Breakaway Header, Low Profile, Dual Row, Right AngleHigh Temperature, 30 Circuits, 0.38渭m (15渭") Gold (Au) Selective Plating

File Size 121.01K  /  5 Page

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Amphenol Communications Solutions

Part No. 20021211-00012T1LF
Description Minitek127®, Board/Wire to Board connector, Shrouded Vertical Header, Through Hole, Double Row, 12 Positions, 1.27 mm (.050in) Pitch.
Tech specs    

Official Product Page

    71764-0128

Molex Electronics Ltd.
Part No. 71764-0128
Description 2.54mm (.100") Pitch C-Grid庐 Breakaway Header, Low Profile, Dual Row, Right AngleHigh Temperature, 28 Circuits, 0.38渭m (15渭") Gold (Au) Selective Plating

File Size 121.16K  /  5 Page

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Amphenol Communications Solutions

Part No. 20021221-000A0D8LF
Description Minitek127®, Wire to Board connector, Shrouded vertical header, Surface Mount, Double Row, 100 Positions, 1.27mm (0.500in) Pitch.
Tech specs    

Official Product Page

    71764-0126

Molex Electronics Ltd.
Part No. 71764-0126
Description 2.54mm (.100") Pitch C-Grid庐 Breakaway Header, Low Profile, Dual Row, Right AngleHigh Temperature, 26 Circuits, 0.38渭m (15渭") Gold (Au) Selective Plating

File Size 121.16K  /  5 Page

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Amphenol Communications Solutions

Part No. 68021-262HLF
Description BergStik®, Board to Board connector, Unshrouded Right Angled Header, Through Hole, Double Row, 62 Positions, 2.54 mm (0.100in) Pitch.
Tech specs    

Official Product Page

For 71764-0212 Found Datasheets File :: 150+       Page :: | <1> | 2 | 3 | 4 | 5 | 6 | 7 | 8 | 9 | 10 | 11 | 12 | 13 | 14 | 15 |   

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