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  71308-5470 Datasheet PDF File

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    71308-5470

Molex Electronics Ltd.
Part No. 71308-5470
Description 2.54mm (.100) Pitch C-Grid? Header, Surface Mount, Dual Row, Vertical, 70 Circuits1.50μm (59μ) Minimum Bright Tin (Sn) Over Nickel (Ni) Plating, without PCB Locator
File Size 1,475.56K  /  8 Page

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Amphenol Communications Solutions
Part No. 79425-470HLF
Description BergStik® 2.54mm, Board to Board connector, Unshrouded Header, Through Hole, Double Row, 70 Positions, 2.54 mm Pitch, Vertical, 4.83 mm (0.19 in.) Mating, 3.05 mm (0.12 in.) Tail.
Tech specs 　 　

Official Product Page

HUA FENG CIRCUIT





    71308

Molex Electronics Ltd.
Part No. 71308
Description PLEASE CHECK WWW.MOLEX.COM FOR LATEST PART INFORMATION
File Size 32.09K  /  2 Page

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Amphenol Communications Solutions
Part No. 95547-050CAHLF
Description Assembly, Top Mount, S/D(68Pins), VTB, Type 123, 5V, 5mm s/o, Right Push Rod Eject, 8mm Card Travel
Tech specs 　 　

Official Product Page

    71308-5478

Molex Electronics Ltd.
Part No. 71308-5478
Description 2.54mm (.100) Pitch C-Grid? Header, Surface Mount, Dual Row, Vertical, 78 Circuits1.50μm (59μ) Minimum Bright Tin (Sn) Over Nickel (Ni) Plating, without PCB Locator
File Size 1,475.56K  /  8 Page

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Amphenol Communications Solutions
Part No. 95547-050CALF
Description Assembly, Top Mount, S/D(68Pins), VTB, Type 123, 5V, 5mm s/o, Right Push Rod Eject, 8mm Card Travel
Tech specs 　 　

Official Product Page

    71308-6444

Molex Electronics Ltd.
Part No. 71308-6444
Description 2.54mm (.100) Pitch C-Grid? Header, Surface Mount, Dual Row, Vertical, 44 Circuits1.50μm (59μ) Minimum Bright Tin (Sn) Over Nickel (Ni) Plating, with 3.30mm (.130)
File Size 1,475.57K  /  8 Page

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Amphenol Communications Solutions
Part No. 95547-040CALF
Description Assembly, Top Mount, S/D(68Pins), VTB, Type 123, 5V, 4.3mm s/o, Right Push Rod Eject, 8mm Card Travel
Tech specs 　 　

Official Product Page

    71308-6452

Molex Electronics Ltd.
Part No. 71308-6452
Description 2.54mm (.100) Pitch C-Grid? Header, Surface Mount, Dual Row, Vertical, 52 Circuits1.50μm (59μ) Minimum Bright Tin (Sn) Over Nickel (Ni) Plating, with 3.30mm (.130)
File Size 1,475.57K  /  8 Page

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Amphenol Communications Solutions
Part No. 95547-020CALF
Description Assembly, Top Mount, S/D(68Pins), VTB, Type 123, 5V, 2.2mm s/o, Right Push Rod Eject, 8mm Card Travel
Tech specs 　 　

Official Product Page

    71308-6454

Molex Electronics Ltd.
Part No. 71308-6454
Description 2.54mm (.100) Pitch C-Grid? Header, Surface Mount, Dual Row, Vertical, 54 Circuits1.50μm (59μ) Minimum Bright Tin (Sn) Over Nickel (Ni) Plating, with 3.30mm (.130)
File Size 1,475.57K  /  8 Page

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Amphenol Communications Solutions
Part No. 68695-470HLF
Description BergStik® 2.54mm, Board To Board Connector, Unshrouded Header, Through Hole, Double Row, 70 Positions, 2.54mm Pitch, Right Angle, 5.84mm (0.23in) Mating, 2.29mm (0.09in) Tail.
Tech specs 　 　

Official Product Page

    71308-6456

Molex Electronics Ltd.
Part No. 71308-6456
Description 2.54mm (.100) Pitch C-Grid? Header, Surface Mount, Dual Row, Vertical, 56 Circuits1.50μm (59μ) Minimum Bright Tin (Sn) Over Nickel (Ni) Plating, with 3.30mm (.130)
File Size 1,475.57K  /  8 Page

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Amphenol Communications Solutions
Part No. 10157547-0011SR1LF
Description Minitek® Multipitch™,1.25mm Crimp-to-Wire Connector Platform, Wire to Board Header, 11 Position, Top Latch, Tin (preplated)
Tech specs 　 　

Official Product Page

    71308-6458

Molex Electronics Ltd.
Part No. 71308-6458
Description 2.54mm (.100) Pitch C-Grid? Header, Surface Mount, Dual Row, Vertical, 58 Circuits,1.50μm (59μ) Minimum Bright Tin (Sn) Over Nickel (Ni) Plating, with 3.30mm (.130)
File Size 1,475.57K  /  8 Page

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Amphenol Communications Solutions
Part No. 10157547-0010SR1LF
Description Minitek® Multipitch™,1.25mm Crimp-to-Wire Connector Platform, Wire to Board Header, 10 Position, Top Latch, Tin (preplated)
Tech specs 　 　

Official Product Page

    71308-0036

Molex Electronics Ltd.
Part No. 71308-0036
Description 2.54mm Pitch C-Grid? Header, Surface Mount, Dual Row, Vertical, 36 Circuits, Tin (Sn) Plating, without PCB Locator Pegs
File Size 27.03K  /  2 Page

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Amphenol Communications Solutions
Part No. 10157547-0003SR1LF
Description Minitek® Multipitch™,1.25mm Crimp-to-Wire Connector Platform, Wire to Board Header, 3 Position, Top Latch, Tin (preplated)
Tech specs 　 　

Official Product Page

    71308-0038

Molex Electronics Ltd.
Part No. 71308-0038
Description 2.54mm Pitch C-Grid? Header, Surface Mount, Dual Row, Vertical, 38 Circuits, Tin (Sn) Plating, without PCB Locator Pegs
File Size 27.04K  /  2 Page

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Amphenol Communications Solutions
Part No. 10157547-0013SR1LF
Description Minitek® Multipitch™,1.25mm Crimp-to-Wire Connector Platform, Wire to Board Header, 13 Position, Top Latch, Tin (preplated)
Tech specs 　 　

Official Product Page

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