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  70543-0201 Datasheet PDF File

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    Molex, Inc.
Part No. 70543-0251 70543-0045 70543-0248 70543-0278 70543-0272 70543-0166 70543-0167 70543-0058 70543-0201
Description CGRID SL VHDR TIN 5 CKT 5 CONTACT(S), MALE, STRAIGHT TWO PART BOARD CONNECTOR, SOLDER
Header; No. of Contacts:11; Pitch Spacing:2.54mm; No. of Rows:1; Series:SL; Connector Body Material:Polyester; Mounting Type:PC Board; Terminal Type:Straight Pin 11 CONTACT(S), MALE, STRAIGHT TWO PART BOARD CONNECTOR, SOLDER
CGRID SL VHDR TIN 2 CKT 2 CONTACT(S), MALE, STRAIGHT TWO PART BOARD CONNECTOR, SOLDER
CGRID SL VHDR 15 GOLD 8 CKT 8 CONTACT(S), MALE, STRAIGHT TWO PART BOARD CONNECTOR, SOLDER
CGRID SL VHDR 15 GOLD 2 CKT 2 CONTACT(S), MALE, STRAIGHT TWO PART BOARD CONNECTOR, SOLDER
CGrid SL SMT Vhdr SR 150 30 SAu 3Ckt 3 CONTACT(S), MALE, STRAIGHT TWO PART BOARD CONNECTOR, SOLDER
CGRID SL VHDR SR 30 GOLD 4CKT 4 CONTACT(S), MALE, STRAIGHT TWO PART BOARD CONNECTOR, SOLDER
CGrid SL Srd VHdr SR 120 Tin 24Ckt 24 CONTACT(S), MALE, STRAIGHT TWO PART BOARD CONNECTOR, SOLDER
CGrid SL SMT Vhdr SR 120 15 SAu 3Ckt 3 CONTACT(S), MALE, STRAIGHT TWO PART BOARD CONNECTOR, SOLDER

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Rochester Electronics LLC

Part No. MD28F020-12/B
Description 28F020 - 2048K (256K x 8) CMOS Flash Memory
Tech specs    

Official Product Page

HUA FENG CIRCUIT





    Intersil, Corp.
Part No. HI3-0201HS4 HI3-0201HS5 HI1-0201HS2 HI1-0201HS5 HI1-0222-7 HI1-0222-2 HI1-0201HS4 HI1-0304-2 HI1-0300-5 HI4-0201HS5 HI4-0201/883 HI1-0300-2 HI1-0300-7
Description Box-shaped pin header, Discrete wire crimping connection, Discrete wire connectors; HRS No: 536-0414-4 90; Contact Mating Area Plating: Tin
Interface IC 接口IC

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Amphenol Communications Solutions

Part No. 68705-430HLF
Description BergStik®, Board to Board connector, Unshrouded Header, Through Hole, Single Row, 30 Positions, 2.54 mm Pitch, Vertical, 5.08 mm (0.2 in.) Mating, 2.41 mm (0.095 in.) Tail
Tech specs    

Official Product Page

    70543-0014

Molex Electronics Ltd.
Part No. 70543-0014
Description 2.54mm (.100) Pitch SL Header, Single Row, Vertical, .120 Pocket, Shrouded, 15Circuits, 0.38μm (15μ) Gold (Au) Selective Plating, Tin (Sn) PC Tail Plating

File Size 418.15K  /  4 Page

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Amphenol Communications Solutions

Part No. 68705-433HLF
Description BergStik®, Board to Board connector, Unshrouded Header, Through Hole, Single Row, 33 Positions, 2.54 mm Pitch, Vertical, 5.08 mm (0.2 in.) Mating, 2.41 mm (0.095 in.) Tail
Tech specs    

Official Product Page

    70543-0020

Molex Electronics Ltd.
Part No. 70543-0020
Description 2.54mm (.100) Pitch SL Header, Single Row, Vertical, .120 Pocket, Shrouded, 21Circuits, 0.38μm (15μ) Gold (Au) Selective Plating, Tin (Sn) PC Tail Plating

File Size 418.15K  /  4 Page

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Amphenol Communications Solutions

Part No. 68705-435HLF
Description BergStik®, Board to Board connector, Unshrouded Header, Through Hole, Single Row, 35 Positions, 2.54 mm Pitch, Vertical, 5.08 mm (0.2 in.) Mating, 2.41 mm (0.095 in.) Tail
Tech specs    

Official Product Page

    70543-0024

Molex Electronics Ltd.
Part No. 70543-0024
Description 2.54mm (.100) Pitch SL Header, Single Row, Vertical, .120 Pocket, Shrouded, 25Circuits, 0.38μm (15μ) Gold (Au) Selective Plating, Tin (Sn) PC Tail Plating

File Size 418.15K  /  4 Page

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Amphenol Communications Solutions

Part No. 68705-432HLF
Description BergStik®, Board to Board connector, Unshrouded Header, Through Hole, Single Row, 32 Positions, 2.54 mm Pitch, Vertical, 5.08 mm (0.2 in.) Mating, 2.41 mm (0.095 in.) Tail
Tech specs    

Official Product Page

    70543-0016

Molex Electronics Ltd.
Part No. 70543-0016
Description 2.54mm (.100) Pitch SL Header, Single Row, Vertical, .120 Pocket, Shrouded, 17Circuits, 0.38μm (15μ) Gold (Au) Selective Plating, Tin (Sn) PC Tail Plating

File Size 418.18K  /  4 Page

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Amphenol Communications Solutions

Part No. 94937-0543LF
Description Header, Top Mount, Upper Deck(68Pins), 5V, 4.3mm s/o
Tech specs    

Official Product Page

    70543-0023

Molex Electronics Ltd.
Part No. 70543-0023
Description 2.54mm (.100) Pitch SL Header, Single Row, Vertical, .120 Pocket, Shrouded, 24Circuits, 0.38μm (15μ) Gold (Au) Selective Plating, Tin (Sn) PC Tail Plating

File Size 418.15K  /  4 Page

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Amphenol Communications Solutions

Part No. 68705-431HLF
Description BergStik®, Board to Board connector, Unshrouded Header, Through Hole, Single Row, 31 Positions, 2.54 mm Pitch, Vertical, 5.08 mm (0.2 in.) Mating, 2.41 mm (0.095 in.) Tail
Tech specs    

Official Product Page

    70543-0022

Molex Electronics Ltd.
Part No. 70543-0022
Description 2.54mm (.100) Pitch SL Header, Single Row, Vertical, .120 Pocket, Shrouded, 23Circuits, 0.38μm (15μ) Gold (Au) Selective Plating, Tin (Sn) PC Tail Plating

File Size 418.15K  /  4 Page

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Amphenol Communications Solutions

Part No. 61127-0543LF
Description Header, Top Mount, Upper Deck(68Pins), VTB, 3.3V, 4.3mm s/o
Tech specs    

Official Product Page

    70543-0036

Molex Electronics Ltd.
Part No. 70543-0036
Description 2.54mm (.100) Pitch SL Header, Single Row, Vertical, .120 Pocket, Shrouded, 2Circuits, Tin (Sn) Plating

File Size 418.20K  /  4 Page

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Amphenol Communications Solutions

Part No. 68705-434HLF
Description BergStik®, Board to Board connector, Unshrouded Header, Through Hole, Single Row, 34 Positions, 2.54 mm Pitch, Vertical, 5.08 mm (0.2 in.) Mating, 2.41 mm (0.095 in.) Tail
Tech specs    

Official Product Page

    70543-0013

Molex Electronics Ltd.
Part No. 70543-0013
Description 2.54mm (.100) Pitch SLHeader, Single Row, Vertical, .120 Pocket, Shrouded, 14 Circuits, 0.38um (15u)

File Size 418.24K  /  4 Page

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Amphenol Communications Solutions

Part No. 10127402-01H2410LF
Description PwrBlade® ULTRA,Vertical,PF,4LP15S4HP
Tech specs    

Official Product Page

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