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  63865-3270 Datasheet PDF File

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    63865-3470 63865-3170 63865-3200 63865-3100 63865-3270

Molex Electronics Ltd.
Part No. 63865-3470 63865-3170 63865-3200 63865-3100 63865-3270
Description Conductor Anvil

File Size 21.68K  /  1 Page

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Amphenol Communications Solutions

Part No. 65863-865PLF
Description Quickie Header, Wire to Board Connector, Double Row, 50 Positions, 2.54 mm (0.1 in.), Vertical, Eject Latch Header 0.76 um (30 u\\.) Gold Mating Plating.
Tech specs    

Official Product Page

HUA FENG CIRCUIT





    63865-2070

Molex Electronics Ltd.
Part No. 63865-2070
Description Conductor Anvil

File Size 29.65K  /  1 Page

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Amphenol Communications Solutions

Part No. 65863-270LF
Description Quickie Header, Wire to Board Connector, Double Row, 34 Positions, 2.54 mm (0.1 in.), Vertical, Eject Latch Header 0.76 um (30 u\\.) Gold Mating Plating.
Tech specs    

Official Product Page

    63865-5100

Molex Electronics Ltd.
Part No. 63865-5100
Description FineAdjust Applicator

File Size 41.02K  /  1 Page

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Amphenol Communications Solutions

Part No. UE78B132700321
Description SFP 2X1 STD DBL BEND TAB
Tech specs    

Official Product Page

    63865-5170 63865-5100

Molex Electronics Ltd.
Part No. 63865-5170 63865-5100
Description Anvil

File Size 30.76K  /  1 Page

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Amphenol Communications Solutions

Part No. 10138327-01103ZLF
Description PCI Express® GEN 3 Card Edge, Storage and Server Connector, Vertical, Through Hole, x16, 164 Positions, 1.00mm (0.039in) Pitch
Tech specs    

Official Product Page

    63865-2070 63865-2000

Molex Electronics Ltd.
Part No. 63865-2070 63865-2000
Description Insulation Punch

File Size 27.54K  /  1 Page

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Amphenol Communications Solutions

Part No. 75160-327-02LF
Description BergStik®, Board to Board connector, Unshrouded vertical header, through hole, single Row,2 position, 2.54mm pitch
Tech specs    

Official Product Page

    63865-2000 63865-2070

Molex Electronics Ltd.
Part No. 63865-2000 63865-2070
Description Insulation Anvil

File Size 30.58K  /  1 Page

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Amphenol Communications Solutions

Part No. 75844-327-06LF
Description BergStik®, Board to Board connector, Unshrouded vertical header, Through Hole, Double Row, 6 Positions, 2.54mm (0.100in) Pitch.
Tech specs    

Official Product Page

    63865-2000 63865-2070

Molex Electronics Ltd.
Part No. 63865-2000 63865-2070
Description Conductor Punch

File Size 27.54K  /  1 Page

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Amphenol Communications Solutions

Part No. 75168-327-02LF
Description BergStik®, Board to Board connector, Unshrouded Right Angled header, Through Hole, Single Row, 02 Positions, 2.54mm (0.100in) Pitch.
Tech specs    

Official Product Page

    63865-3500 63865-3670 63865-3700 63865-3770

Molex Electronics Ltd.
Part No. 63865-3500 63865-3670 63865-3700 63865-3770
Description Conductor Anvil

File Size 21.68K  /  1 Page

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Amphenol Communications Solutions

Part No. 75160-327-07LF
Description BergStik®, Board to Board connector, Unshrouded vertical header, through hole, single Row,7 position, 2.54mm pitch
Tech specs    

Official Product Page

    15-45-3270

Molex Electronics Ltd.
Part No. 15-45-3270
Description 2.54mm (.100) Pitch C-Grid? PCB Connector, Surface Mount, High Profile, Dual Row, Vertical, 70 Circuits

File Size 736.19K  /  6 Page

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Amphenol Communications Solutions

Part No. UE78B532700321
Description 2X5 SFP COMBO GND TABS
Tech specs    

Official Product Page

    OPTREX
Part No. UE-33270
Description LCD_Module

File Size 171.25K  /  1 Page

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Amphenol Communications Solutions

Part No. 75844-327-08LF
Description BergStik®, Board to Board connector, Unshrouded vertical header, Through Hole, Double Row, 8 Positions, 2.54mm (0.100in) Pitch.
Tech specs    

Official Product Page

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