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Murata Manufacturing Co Ltd |
| Part No. |
GCM32E5C3A103FX01L
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| Description |
Chip Multilayer Ceramic Capacitors for Automotive
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| Tech specs |
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Official Product Page
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Murata Manufacturing Co Ltd |
| Part No. |
GCM32E5C3A103FX01K
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| Description |
Chip Multilayer Ceramic Capacitors for Automotive
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| Tech specs |
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Official Product Page
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Toshiba Electronic Devices & Storage Corporation |
| Part No. |
TC75S103F
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| Description |
Operational Amplifier, 1.8V to 5.5V, I/O Rail to Rail, IDD=100μA, SOT-25
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| Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
| Part No. |
130-3142-11H
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| Description |
Paladin® 112Gb/s Backplane Connector, 3-Pair, 4 Column, Daughtercard Module, APP.
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| Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
| Part No. |
130-3142-11D
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| Description |
Paladin® 112Gb/s Backplane Connector, 3-Pair, 4 Column, Daughtercard Module, Nickel Sulfamate.
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| Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
| Part No. |
130-3162-11D
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| Description |
Paladin® 112Gb/s Backplane Connector, 3-Pair, 6 Column, Daughtercard Module, Nickel Sulfamate.
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| Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
| Part No. |
130-3182-11H
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| Description |
Paladin® 112Gb/s Backplane Connector, 3-Pair, 8 Column, Daughtercard Module, APP.
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| Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
| Part No. |
130-3162-11H
|
| Description |
Paladin® 112Gb/s Backplane Connector, 3-Pair, 6 Column, Daughtercard Module, APP.
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| Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
| Part No. |
130-3142-15H
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| Description |
Paladin Plus 3-Pair, 4 Column, Right Angle Receptacle, Signal Module, APP
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| Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
| Part No. |
130-3182-11D
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| Description |
Paladin® 112Gb/s Backplane Connector, 3-Pair, 8 Column, Daughtercard Module, Nickel Sulfamate.
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| Tech specs |
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Official Product Page
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