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  501190-2017 Datasheet PDF File

For 501190-2017 Found Datasheets File :: 150+       Page :: | <1> | 2 | 3 | 4 | 5 | 6 | 7 | 8 | 9 | 10 | 11 | 12 | 13 | 14 | 15 |   

    5011902017 501190-2017 SD-501190-004 SD-501190-003

Molex Electronics Ltd.
Part No. 5011902017 501190-2017 SD-501190-004 SD-501190-003
Description 1.00mm (.039) Pitch Pico-Clasp Wire-to-Board PCB Header, Dual Row, Vertical, 20 Circuits, Lead-free
File Size 228.63K  /  5 Page

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Toshiba Electronic Devices & Storage Corporation
Part No. TPD2017FN
Description Intelligent power device (Low side switch) / VDD=6 V / 8ch / SSOP30
Tech specs 　 　

Official Product Page

HUA FENG CIRCUIT





    501190-4017 501190-2017 501190-2019 501190-2027 501190-2029 501190-4029 501190-3019 501190-3027 501190-3029 501190-3017

Molex Electronics Ltd.
Part No. 501190-4017 501190-2017 501190-2019 501190-2027 501190-2029 501190-4029 501190-3019 501190-3027 501190-3029 501190-3017 5011905027
Description 1.0 WIRE TO BOARD CONN. WAFER ASSY (2-ROW S/T) -LEAD FREE-
File Size 435.90K  /  5 Page

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Amphenol Communications Solutions
Part No. 54242-108201750LF
Description BergStik®, Board to Board connector, Unshrouded vertical stacked header, Surface Mount, Double Row, 20 Positions, 2.54mm (0.100in) Pitch.
Tech specs 　 　

Official Product Page

    Molex, Inc.
Part No. 501190-4017
Description 1.0 WtB Wafer Assy 40Ckt EmbsTp Pkg 40 CONTACT(S), MALE, STRAIGHT TWO PART BOARD CONNECTOR, SURFACE MOUNT
File Size 195.96K  /  3 Page

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Amphenol Communications Solutions
Part No. 75844-201-72LF
Description BERGSTIK
Tech specs 　 　

Official Product Page

    5011904017 501190-4017

Molex Electronics Ltd.
Part No. 5011904017 501190-4017
Description 1.00mm (.039) Pitch Pico-Clasp Wire-to-Board PCB Header, Dual Row, Vertical, 40 Circuits
File Size 228.63K  /  5 Page

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Amphenol Communications Solutions
Part No. 54122-110201700LF
Description BergStik®, Board to Board connector, Unshrouded stacking vertical header, through hole, double Row, 20 position, 2.54mm (0.100in) pitch
Tech specs 　 　

Official Product Page

    501190-3027 5011903027

Molex Electronics Ltd.
Part No. 501190-3027 5011903027
Description 1.00mm (.039) Pitch Pico-Clasp Wire-to-Board PCB Header, Dual Row, Vertical, 30 Circuits, Lead-free
File Size 228.40K  /  5 Page

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Amphenol Communications Solutions
Part No. 59202-F40-20-174LF
Description Minitek® 2.00mm, Board To Board, Unshrouded Vertical Header, Surface Mount, Double Row, 40 Positions.
Tech specs 　 　

Official Product Page

    5011905017 501190-5017 SD-501190-004 SD-501190-003

Molex Electronics Ltd.
Part No. 5011905017 501190-5017 SD-501190-004 SD-501190-003
Description 1.00mm (.039") Pitch Pico-Clasp Wire-to-Board PCB Header, Dual Row, Vertical, 50 Circuits, Lead-free
1.00mm (.039) Pitch Pico-Clasp Wire-to-Board PCB Header, Dual Row, Vertical, 50 Circuits, Lead-free
File Size 228.63K  /  5 Page

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Amphenol Communications Solutions
Part No. 59202-G40-20-174LF
Description Minitek® 2.00mm, Board To Board, Unshrouded Vertical Header, Surface Mount, Double Row, 40 Positions.
Tech specs 　 　

Official Product Page

   
Part No. 62017-3 62017-4
Description Optoelectronic
File Size 87.15K  /  2 Page

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Amphenol Communications Solutions
Part No. 54112-109201700LF
Description BergStik®, Board to Board connector, Unshrouded vertical stacked header, Through Hole, Double Row, 20 Positions, 2.54mm (0.100in) Pitch.
Tech specs 　 　

Official Product Page

    32017

SCHOTT CORPORATION
Part No. 32017
Description INDUCTOR, 9.3 mH POTS LOW PASS FILTER
File Size 7.99K  /  1 Page

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Amphenol Communications Solutions
Part No. 67292-017
Description BergStik® 2.54mm, Board To Board, Vertical 2 Row Guide Pin Header 34 Positions 2.54mm Pitch 3.81um (150u\\.) Tin-Lead Mating plating.
Tech specs 　 　

Official Product Page

    2017 2032

MICROPAC INDUSTRIES
Part No. 2017 2032
Description 28 and 48W true hermetically sealed proportionally controlled metal package heater hybrid
File Size 113.81K  /  3 Page

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Amphenol Communications Solutions
Part No. 72017-212LF
Description 5 Row Signal Receptacle, 150 Position, Straight, Solder to Board
Tech specs 　 　

Official Product Page

    Molex, Inc.
MOLEX INC
Part No. 40-06-2017 40-06-2005
Description Ground Term Clip STEEL, WIRE TERMINAL
File Size 63.84K  /  1 Page

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Amphenol Communications Solutions
Part No. 90312-017LF
Description Crimp-to-Wire Housing, Single Row, Pol. w/Latch, 17 Position
Tech specs 　 　

Official Product Page

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