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  4300.5063 Datasheet PDF File

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    4300.5065 4300.5064 4300.5063 4300.5062 4300.5061 KFX

Schurter Inc.
Part No. 4300.5065 4300.5064 4300.5063 4300.5062 4300.5061 KFX
Description IEC Appliance Inlet C14 with Filter, Increased Dielectric Strength
File Size 408.51K  /  3 Page

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Amphenol Communications Solutions
Part No. 10111743-009LF
Description HPCE R/A REC 52P22S
Tech specs 　 　

Official Product Page

HUA FENG CIRCUIT





    STA-5063

List of Unclassifed Manufacturers
ETC
SIRENZA MICRODEVICES
Part No. STA-5063
Description 3.3 ?6.2 GHz General Purpose 3.3V 15dBm Amplifier
3.3 - 6.2 GHz General Purpose 3.3V 15dBm Amplifier
File Size 202.40K  /  8 Page

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Amphenol Communications Solutions
Part No. 75543-002LF
Description PV® Wire-to-Board Connector System, Crimp to Wire Terminal Receptacle for 32-36 AWG Wire.
Tech specs 　 　

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Part No. 50632
Description Dual/Triple Ultra-Low-Voltage SOT23 µP Supervisory Circuits
File Size 84.65K  /  1 Page

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Amphenol Communications Solutions
Part No. 10106814-043002LF
Description 0.5 mm Pitch Hermaphroditic Mezzanine Connector, 40 positions, Short length, Half of mated height equals 3 mm
Tech specs 　 　

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Part No. 50631
Description AS-I BASE
File Size 109.48K  /  1 Page

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Amphenol Communications Solutions
Part No. 65043-007LF
Description PV® Wire-to-Board Connector System, 2.54 x 2.54mm (0.1 x 0.1inch) Centerline Crimp-to-Wire PV Receptacle Housing, Double Row.
Tech specs 　 　

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    STA-5063Z

SIRENZA MICRODEVICES
Part No. STA-5063Z
Description 3.3 - 6.2 GHz General Purpose 3.3V 15dBm Amplifier
File Size 144.63K  /  8 Page

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Amphenol Communications Solutions
Part No. 54122-124243000LF
Description BergStik®, Board to Board connector, Unshrouded Vertical Stacking Header, Through Hole, Single Row, 24 Positions, 2.54mm (0.100in) Pitch.
Tech specs 　 　

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    Shindengen Electric Mfg...
Part No. D4F60-5063
Description 600V 4A
File Size 360.80K  /  3 Page

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Amphenol Communications Solutions
Part No. 65043-002ELF
Description PV® Wire-to-Board Connector System, 2.54mm (0.1inch) Centerline Crimp-to-Wire PV Receptacle Housing, Double Row.
Tech specs 　 　

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    87381-5063

Molex Electronics Ltd.
Part No. 87381-5063
Description 2.00mm (.079) Pitch Milli-Grid Receptacle, Surface Mount, Top Entry, 0.76μm (30μ) Gold (Au) Plating, with Cap, without Locating Pegs, 50 Circuits, Lead-free
File Size 315.39K  /  6 Page

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Amphenol Communications Solutions
Part No. 10111743-008LF
Description HPCE R/A REC 52P22S
Tech specs 　 　

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    87568-5063

Molex Electronics Ltd.
Part No. 87568-5063
Description 2.00mm (.079) Pitch Milli-Grid Cable-to-Board Receptacle, Dual Row, IDT, Lead-free, 50 Circuits, 0.38mm (.015) Gold (Au) Selective Plating
File Size 274.58K  /  5 Page

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Amphenol Communications Solutions
Part No. 48243-000LF
Description PV® Wire-to-Board Connector System, 2.54mm (0.1inch) Centerline Crimp-to-Wire Receptacle.
Tech specs 　 　

Official Product Page

    D1F60-5063

Shindengen Electric Mfg.Co.Ltd
Part No. D1F60-5063
Description 600V 1A
File Size 309.40K  /  3 Page

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Amphenol Communications Solutions
Part No. 47743-002LF
Description PV® Wire-to-Board Connector System, 2.54mm (0.1inch) Centerline Crimp-to-Wire Receptacle.
Tech specs 　 　

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    TE Connectivity Ltd
Part No. 506344-6
Description THIS DRAWING IS A CONTROLLED DOCUMENT.
File Size 716.92K  /  3 Page

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Amphenol Communications Solutions
Part No. 84654-300CAHLF
Description Assembly, Top Mount, D/D(136Pins), R/A, 3.3V, 0mm s/o, Left Push Rod Eject, Narrow Body, 8mm Card Travel
Tech specs 　 　

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