001118-4830 pdf Datasheet P1 Part Num --- IC-ON-LINE


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001118-4830 Datasheet PDF File

For 001118-4830 Found Datasheets File :: 150+ Page :: | <1> | 2 | 3 | 4 | 5 | 6 | 7 | 8 | 9 | 10 | 11 | 12 | 13 | 14 | 15 |

					Molex Electronics Ltd.
Part No.	1118-4830 11-18-4830 0011-18-4830 001118-4830 60726A101
Description	Conductor Punch
File Size	14.32K / 1 Page	View it Online	Download Datasheet

						Amphenol Communications Solutions
Part No.	68001-118HLF
Description	BergStik®, Board to Board connector, Unshrouded vertical header, Through Hole, Single Row, , 18 Positions, 2.54 mm (0.100in) Pitch.
Tech specs				Official Product Page

HUA FENG CIRCUIT

					Molex Electronics Ltd.
Part No.	94830-1001 SD-94830-001
Description	Metal Dome for Keypad
File Size	114.80K / 2 Page	View it Online	Download Datasheet

						Amphenol Communications Solutions
Part No.	10117948-3040HLF
Description	mini-SAS HD Copper Cable Assemblies, Cable Assemblies, 28AWG Wire Size, 3Gb/s Data Rate, Minisas HD : 72; Minisas : 26(x2) Contacts, 8 Signal Pairs.
Tech specs				Official Product Page

					Molex Electronics Ltd.
Part No.	11-18-5373 0011-18-5373 001118-5373
Description	Insulation Anvil
File Size	16.05K / 1 Page	View it Online	Download Datasheet

						Amphenol Communications Solutions
Part No.	10114830-11108LF
Description	1.25mm Wire to Board Wafer, Right Angle, Surface Mount, 8 Positions
Tech specs				Official Product Page

					Molex Electronics Ltd.
Part No.	0011-18-5328 1118-5328 001118-5328
Description	Insulation Anvil
File Size	16.19K / 1 Page	View it Online	Download Datasheet

						Amphenol Communications Solutions
Part No.	10114830-11111LF
Description	1.25mm Wire to Board Wafer, Right Angle, Surface Mount, 11 Positions
Tech specs				Official Product Page

					Molex Electronics Ltd.
Part No.	001118-5327 0011-18-5327
Description	Insulation Punch
File Size	14.53K / 1 Page	View it Online	Download Datasheet

						Amphenol Communications Solutions
Part No.	10114830-11113LF
Description	1.25mm Wire to Board Wafer, Right Angle, Surface Mount, 13 Positions
Tech specs				Official Product Page

					Molex Electronics Ltd.
Part No.	0011-18-5112 001118-5112
Description	Insulation Punch
File Size	14.48K / 1 Page	View it Online	Download Datasheet

						Amphenol Communications Solutions
Part No.	10114830-10113LF
Description	1.25mm Wire to Board Wafer, Right Angle, Surface Mount, 13 Positions
Tech specs				Official Product Page

					Molex Electronics Ltd.
Part No.	0011-18-5168 001118-5168
Description	Conductor Anvil
File Size	16.07K / 1 Page	View it Online	Download Datasheet

						Amphenol Communications Solutions
Part No.	10114830-11110LF
Description	1.25mm Wire to Board Wafer, Right Angle, Surface Mount, 10 Positions
Tech specs				Official Product Page

					Molex Electronics Ltd.
Part No.	11-18-5237 0011-18-5237 1118-5237 001118-5237
Description	Conductor Punch
File Size	14.40K / 1 Page	View it Online	Download Datasheet

						Amphenol Communications Solutions
Part No.	10114830-10112LF
Description	1.25mm Wire to Board Wafer, Right Angle, Surface Mount, 12 Positions
Tech specs				Official Product Page

					Molex Electronics Ltd.
Part No.	11-18-4391 001118-4391 0011-18-4391
Description	Combination Anvil
File Size	19.29K / 1 Page	View it Online	Download Datasheet

						Amphenol Communications Solutions
Part No.	77311-483-04LF
Description	BergStik®, Board to Board connector, Unshrouded vertical Header, Through Hole, Single Row, 04 Positions, 2.54 mm Pitch.
Tech specs				Official Product Page

					Molex Electronics Ltd.
Part No.	11-18-5205 0011-18-5205 1118-5205 001118-5205
Description	Insulation Punch
File Size	14.53K / 1 Page	View it Online	Download Datasheet

						Amphenol Communications Solutions
Part No.	10117948-3010HLF
Description	mini-SAS HD Copper Cable Assemblies, Cable Assemblies, 28AWG Wire Size, 3Gb/s Data Rate, Minisas HD : 72; Minisas : 26(x2) Contacts, 8 Signal Pairs.
Tech specs				Official Product Page

For 001118-4830 Found Datasheets File :: 150+ Page :: | <1> | 2 | 3 | 4 | 5 | 6 | 7 | 8 | 9 | 10 | 11 | 12 | 13 | 14 | 15 |

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