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  90136-1105 Datasheet PDF File

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    90136-1207 0901361207

Molex Electronics Ltd.
http://
Part No. 90136-1207 0901361207
Description 2.54mm (.100) Pitch C-Grid III Header, Single Row, Vertical, Shrouded, 7 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating
2.54mm (.100) Pitch C-Grid III?/a> Header, Single Row, Vertical, Shrouded, 7 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating

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Amphenol Communications Solutions

Part No. 78290-136HLF
Description BergStik® 2.54mm, Board to Board connector, Unshrouded Header, Through Hole, Single Row, 36 Positions, 2.54 mm Pitch, Vertical, 16.51 mm (0.65in) Mating, 12.7 mm (0.5in) Tail.
Tech specs    

Official Product Page

HUA FENG CIRCUIT





    90136-2305 0901362305

Molex Electronics Ltd.
Part No. 90136-2305 0901362305
Description 2.54mm (.100) Pitch C-Grid III?/a> Header, Single Row, Right Angle, Shrouded, 5 Circuits, 0.76μm (30μ) Gold (Au) Selective Plating
2.54mm (.100) Pitch C-Grid III Header, Single Row, Right Angle, Shrouded, 5 Circuits, 0.76μm (30μ) Gold (Au) Selective Plating

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Amphenol Communications Solutions

Part No. 68690-136HLF
Description BergStik®, Board to Board connector, Unshrouded Vertical Header, Through Hole, Double Row, 36 Positions, 2.54 mm (0.100in)Pitch.
Tech specs    

Official Product Page

    0901362208 90136-2208

Molex Electronics Ltd.
Part No. 0901362208 90136-2208
Description 2.54mm (.100) Pitch C-Grid III Header, Single Row, Right Angle, Shrouded, 8 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating
MOLEX Connector

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Amphenol Communications Solutions

Part No. 69190-136HLF
Description BergStik®, Board to Board connector, Unshrouded vertical header, Through Hole, Single Row, 36 Positions, 2.54 mm (0.100in) Pitch.
Tech specs    

Official Product Page

    0901361107 90136-1107

Molex Electronics Ltd.
Part No. 0901361107 90136-1107
Description 2.54mm (.100) Pitch C-Grid III?/a> Header, Single Row, Vertical, Shrouded, 7 Circuits, 4μm (160μ) Tin/Lead (Sn) over Nickel (Ni)
2.54mm (.100) Pitch C-Grid III Header, Single Row, Vertical, Shrouded, 7 Circuits, 4μm (160μ) Tin/Lead (Sn) over Nickel (Ni)

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Amphenol Communications Solutions

Part No. 10119110-560003LF
Description BergStik® 2.54mm, Board To Board Connector, Unshrouded Right Angle Header, Through Hole, Double row , 60 Positions, 2.54mm (0.100in) Pitch.
Tech specs    

Official Product Page

    0901361108 90136-1108

Molex Electronics Ltd.
Part No. 0901361108 90136-1108
Description 2.54mm (.100) Pitch C-Grid III?/a> Header, Single Row, Vertical, Shrouded, 8 Circuits, 4μm (160μ) Tin/Lead (Sn) over Nickel (Ni)
2.54mm (.100) Pitch C-Grid III Header, Single Row, Vertical, Shrouded, 8 Circuits, 4μm (160μ) Tin/Lead (Sn) over Nickel (Ni)

File Size 159.33K  /  4 Page

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Amphenol Communications Solutions

Part No. 70298-1105LF
Description 4 Row Signal Header, 48 Position, Straight, Press-Fit, Wide body
Tech specs    

Official Product Page

    0901361104 90136-1104

Molex Electronics Ltd.
Part No. 0901361104 90136-1104
Description 2.54mm (.100) Pitch C-Grid III?/a> Header, Single Row, Vertical, Shrouded, 4 Circuits, 4μm (160μ) Tin/Lead (Sn) over Nickel (Ni)
2.54mm (.100) Pitch C-Grid III Header, Single Row, Vertical, Shrouded, 4 Circuits, 4μm (160μ) Tin/Lead (Sn) over Nickel (Ni)

File Size 159.23K  /  4 Page

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Amphenol Communications Solutions

Part No. 10076801-105-12LF
Description BergStik®, Board to Board connector, Unshrouded Vertical Header, Through Hole, Double row , 12 Positions, 2.54mm (0.100in) Pitch, Pin In Paste
Tech specs    

Official Product Page

    0901361103 90136-1103

Molex Electronics Ltd.
Part No. 0901361103 90136-1103
Description 2.54mm (.100) Pitch C-Grid III?/a> Header, Single Row, Vertical, Shrouded, 3 Circuits, 4μm (160μ) Tin/Lead (Sn) over Nickel (Ni)
2.54mm (.100) Pitch C-Grid III Header, Single Row, Vertical, Shrouded, 3 Circuits, 4μm (160μ) Tin/Lead (Sn) over Nickel (Ni)

File Size 159.23K  /  4 Page

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Amphenol Communications Solutions

Part No. 10076801-105-20LF
Description BergStik®, Board to Board connector, Unshrouded Vertical Header, Through Hole, Double row , 20 Positions, 2.54mm (0.100in) Pitch, Pin In Paste
Tech specs    

Official Product Page

    0901361102 90136-1102

Molex Electronics Ltd.
Part No. 0901361102 90136-1102
Description 2.54mm (.100) Pitch C-Grid III?/a> Header, Single Row, Vertical, Shrouded, 2 Circuits, 4μm (160μ) Tin/Lead (Sn) over Nickel (Ni)
2.54mm (.100) Pitch C-Grid III Header, Single Row, Vertical, Shrouded, 2 Circuits, 4μm (160μ) Tin/Lead (Sn) over Nickel (Ni)

File Size 159.23K  /  4 Page

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Amphenol Communications Solutions

Part No. 77311-105-01LF
Description BergStik®, Board to Board connector, Unshrouded vertical Header, Through Hole, Single Row, 01 Positions, 2.54 mm Pitch.
Tech specs    

Official Product Page

    0901361109 90136-1109

Molex Electronics Ltd.
Part No. 0901361109 90136-1109
Description 2.54mm (.100) Pitch C-Grid III?/a> Header, Single Row, Vertical, Shrouded, 9 Circuits, 4μm (160μ) Tin/Lead (Sn) over Nickel (Ni)
2.54mm (.100) Pitch C-Grid III Header, Single Row, Vertical, Shrouded, 9 Circuits, 4μm (160μ) Tin/Lead (Sn) over Nickel (Ni)

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Amphenol Communications Solutions

Part No. 78211-105LF
Description PV® Wire-to-Board Connector System, Mini Latch Housing, Single Row, 2.54mm (0.100in), 5 Positions..
Tech specs    

Official Product Page

    0901362332 90136-2332

Molex Electronics Ltd.
Part No. 0901362332 90136-2332
Description 2.54mm (.100) Pitch C-Grid III?/a> Header, Single Row, Right Angle, Shrouded, 32 Circuits, 0.76μm (30μ) Gold (Au) Selective Plating

File Size 254.06K  /  5 Page

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Amphenol Communications Solutions

Part No. F304-1A7H1-11050-E100
Description Flex Connector, 0.50mm Pitch, Height 2.50mm, Right angle, Flip type, ZIF, 50 position, Double beam, With MYLAR
Tech specs    

Official Product Page

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