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  73644-2201 Datasheet PDF File

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    0736443016 73644-3016

Molex Electronics Ltd.
Part No. 0736443016 73644-3016
Description 2.00mm (.079") Pitch HDM庐 Board-to-Board Backplane Header, Vertical, SMC, PressFit, Guide Post Location B, Polarizing Key Position N/A, 144 Circuits
2.00mm (.079) Pitch HDM? Board-to-Board Backplane Header, Vertical, SMC, PressFit, Guide Post Location B, Polarizing Key Position N/A, 144 Circuits

File Size 164.68K  /  4 Page

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Amphenol Communications Solutions

Part No. 10082201-104A06LF
Description BergStik®, Board to Board connector, Unshrouded Right Angle Header, Through Hole, Pin In Paste, Single row , 6 Positions, 2.54mm (0.100in) Pitch
Tech specs    

Official Product Page

HUA FENG CIRCUIT





    0736443017 73644-3017

Molex Electronics Ltd.
Part No. 0736443017 73644-3017
Description 2.00mm (.079") Pitch HDM Board-to-Board Backplane Header, Vertical, SMC, Press- Fit, Guide Post Location A
2.00mm (.079) Pitch HDM Board-to-Board Backplane Header, Vertical, SMC, Press- Fit, Guide Post Location A

File Size 164.68K  /  4 Page

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Amphenol Communications Solutions

Part No. 68002-201HLF
Description BergStik®, Board to Board connector, Unshrouded Vertical Header, Through Hole, Single Row, 1 Positions, 2.54 mm (0.100in) Pitch.
Tech specs    

Official Product Page

    0736443018 73644-3018

Molex Electronics Ltd.
Part No. 0736443018 73644-3018
Description 2.00mm (.079") Pitch HDM庐 Board-to-Board Backplane Header, Vertical, SMC, PressFit, Guide Post Location N/A, Polarizing Key Position N/A, 144 Circuits
2.00mm (.079) Pitch HDM? Board-to-Board Backplane Header, Vertical, SMC, PressFit, Guide Post Location N/A, Polarizing Key Position N/A, 144 Circuits

File Size 174.33K  /  4 Page

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Amphenol Communications Solutions

Part No. 84502-201
Description 300 Position BGA Receptacle, 5.5mm Component Height, 1.27mm x 1.27mm Array
Tech specs    

Official Product Page

    0736441017

Molex Electronics Ltd.
Part No. 0736441017
Description 2.00mm (.079") Pitch HDM庐 Board-to-Board Backplane Header, Vertical, SMC, Press-Fit, Guide Post Location A, Polarizing Key Position N/A, 144 Circuits

File Size 167.84K  /  4 Page

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Amphenol Communications Solutions

Part No. 10060912-201LF
Description GIG-Array®, Mezzanine Connectors, 15mm Receptacle 200 Position Lead Free.
Tech specs    

Official Product Page

    73644-1002 0736441002

Molex Electronics Ltd.
Part No. 73644-1002 0736441002
Description 2.00mm (.079) Pitch HDM? Board-to-Board Backplane Header, Vertical, SMC, PressFit, Guide Post Location B, Polarizing Key Position B, 144 Circuits

File Size 167.28K  /  4 Page

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Amphenol Communications Solutions

Part No. 10082201-101-10LF
Description BergStik®, Board to Board connector, Unshrouded Right Angle Header, Through Hole, Pin In Paste, Single row , 10 Positions, 2.54mm (0.100in) Pitch
Tech specs    

Official Product Page

    73644-1001 0736441001

Molex Electronics Ltd.
Part No. 73644-1001 0736441001
Description 2.00mm (.079) Pitch HDM? Board-to-Board Backplane Header, Vertical, SMC, Press-Fit, Guide Post Location A, Polarizing Key Position A, 144 Circuits

File Size 167.84K  /  4 Page

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Amphenol Communications Solutions

Part No. L17H2220125
Description Dsub, Stamped Signal 3A, Dual Port Right Angle PCB Thru Hole, F=19.05mm (0.750in), 9/9 (Socket/Socket), Flash Gold, Bright Tin Shell, M3 Removable Front Screwlock, 2*Arrowhead Boardlock
Tech specs    

Official Product Page

    0736440001 73644-0001

Molex Electronics Ltd.
Part No. 0736440001 73644-0001
Description 2.00mm (.079") Pitch HDM庐 Board-to-Board Backplane Header, Vertical, SMC, Press
2.00mm (.079) Pitch HDM? Board-to-Board Backplane Header, Vertical, SMC, Press

File Size 167.33K  /  4 Page

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Amphenol Communications Solutions

Part No. RJE0162201
Description Modular Jack - Right Angle, Input Output Connectors 6P2C, Shield.
Tech specs    

Official Product Page

    0736440002 73644-0002

Molex Electronics Ltd.
Part No. 0736440002 73644-0002
Description 2.00mm (.079") Pitch HDM庐 Board-to-Board Backplane Header, Vertical, SMC, PressFit, Guide Post Location B, Polarizing Key Position B, 72 Circuits
2.00mm (.079) Pitch HDM? Board-to-Board Backplane Header, Vertical, SMC, PressFit, Guide Post Location B, Polarizing Key Position B, 72 Circuits

File Size 166.79K  /  4 Page

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Amphenol Communications Solutions

Part No. 10082201-404-06LF
Description BergStik®, Board to Board connector, Unshrouded Right Angle Header, Through Hole, Pin In Paste, Single row , 6 Positions, 2.54mm (0.100in) Pitch
Tech specs    

Official Product Page

    73644-1000 0736441000

Molex Electronics Ltd.
Part No. 73644-1000 0736441000
Description 2.00mm (.079) Pitch HDM? Board-to-Board Backplane Header, Vertical, SMC, PressFit, Guide Post Location B, Polarizing Key Position A, 144 Circuits

File Size 167.84K  /  4 Page

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Amphenol Communications Solutions

Part No. 10082201-405-03LF
Description BergStik®, Board to Board connector, Unshrouded Right Angle Header, Through Hole, Pin In Paste, Single row , 3 Positions, 2.54mm (0.100in) Pitch
Tech specs    

Official Product Page

    0736440004 73644-0004

Molex Electronics Ltd.
Part No. 0736440004 73644-0004
Description 2.00mm (.079") Pitch HDM庐 Board-to-Board Backplane Header, Vertical, SMC, PressFit, Guide Post Location B, Polarizing Key Position C, 72 Circuits
2.00mm (.079) Pitch HDM? Board-to-Board Backplane Header, Vertical, SMC, PressFit, Guide Post Location B, Polarizing Key Position C, 72 Circuits

File Size 166.78K  /  4 Page

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Amphenol Communications Solutions

Part No. 10123982-201
Description MEG-Array®, Mezzanine, 320 Positions, Receptacle, 1.27mm (0.050in) Pitch, 4.00mm (0.157in) Stack Height.
Tech specs    

Official Product Page

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