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74LS15 ML101 STM32L0 S3C8285 1N5822G 74LS148D MGF4910D SI6433DQ
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For latent Found Datasheets File :: 707    Search Time::2.844ms    
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    DTC144T1 DTC144TT1

ONSEMI[ON Semiconductor]
Part No. DTC144T1 DTC144TT1
OCR Text ...perature gradient and result in latent failure due to mechanical stress. Mechanical stress or shock should not be applied during cooling * * Soldering a device without preheating can cause excessive thermal shock and stress which can ...
Description NPN Silicon Surface Mount Transistor with Monolithic Bias Resistor Network
Bias Resistor Transistor

File Size 52.59K  /  8 Page

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    M1MA151KT1 ON0328 M1MA152KT1

Motorola Inc
Motorola, Inc.
ONSEMI[ON Semiconductor]
MOTOROLA[Motorola, Inc]
Part No. M1MA151KT1 ON0328 M1MA152KT1
OCR Text ...perature gradient and result in latent failure due to mechanical stress. * Mechanical stress or shock should not be applied during cooling * Soldering a device without preheating can cause excessive thermal shock and stress which can result...
Description Inductor Kit RoHS Compliant: Yes
From old datasheet system
SC-59 PACKAGE SINGLE SILICON SWITCHING DIODES 40/80 V-100 mA SURFACE MOUNT

File Size 81.39K  /  6 Page

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    MGSF1P02LT1 MGSF1P02LT3

MOTOROLA[Motorola, Inc]
Part No. MGSF1P02LT1 MGSF1P02LT3
OCR Text ...perature gradient and result in latent failure due to mechanical stress. * Mechanical stress or shock should not be applied during cooling. * Soldering a device without preheating can cause excessive thermal shock and stress which can resul...
Description P-CHANNEL ENHANCEMENT-MODE TMOS MOSFET

File Size 195.68K  /  6 Page

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    BAT54SLT1 ON0127

ON Semiconductor
Motorola Inc
MOTOROLA[Motorola, Inc]
Part No. BAT54SLT1 ON0127
OCR Text ...perature gradient and result in latent failure due to mechanical stress. * Mechanical stress or shock should not be applied during cooling. * Soldering a device without preheating can cause excessive thermal shock and stress which can resul...
Description From old datasheet system
30 VOLTS DUAL HOT-CARRIER DETECTOR AND SWITCHING DIODES
30 VOLTS DUAL HOT-ARRIER

File Size 78.32K  /  4 Page

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    BAT54SWT1 ON0128

MOTOROLA[Motorola Inc]
ONSEMI[ON Semiconductor]
MOTOROLA[Motorola, Inc]
Part No. BAT54SWT1 ON0128
OCR Text ...perature gradient and result in latent failure due to mechanical stress. * Mechanical stress or shock should not be applied during cooling * Soldering a device without preheating can cause excessive thermal shock and stress which can result...
Description 30 VOLT DUAL SERIES SCHOTTKY BARRIER DIODES
From old datasheet system

File Size 78.90K  /  4 Page

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    BC817-16LT1 BC817-40LT3 BC817-25LT2 ON0159

ON Semiconductor
Part No. BC817-16LT1 BC817-40LT3 BC817-25LT2 ON0159
OCR Text ...perature gradient and result in latent failure due to mechanical stress. * Mechanical stress or shock should not be applied during cooling. * Soldering a device without preheating can cause excessive thermal shock and stress which can resul...
Description General Purpose Transistors(NPN Silicon)
CASE 318-8, STYLE6 SOT-23(TO-236AB)
From old datasheet system

File Size 67.03K  /  4 Page

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    BC817-25LT1 BC817-40LT1 BC81716LT1 BC817-16LT1

MOTOROLA INC
Motorola, Inc.
MOTOROLA[Motorola, Inc]
Part No. BC817-25LT1 BC817-40LT1 BC81716LT1 BC817-16LT1
OCR Text ...perature gradient and result in latent failure due to mechanical stress. * Mechanical stress or shock should not be applied during cooling. * Soldering a device without preheating can cause excessive thermal shock and stress which can resul...
Description CASE 318-08, STYLE 6 SOT-23 (TO-236AB)

File Size 90.10K  /  4 Page

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    MBD301 MBD301LT1

MOTOROLA[Motorola, Inc]
Part No. MBD301 MBD301LT1
OCR Text ...perature gradient and result in latent failure due to mechanical stress. * Mechanical stress or shock should not be applied during cooling. * Soldering a device without preheating can cause excessive thermal shock and stress which can resul...
Description 30 VOLTS SILICON HOT.CARRIER DETECTOR AND SWITCHING DIODES

File Size 130.53K  /  6 Page

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    MMBZ20VALT1 MMBZ5V6ALT1 MMBZ6V2ALT1 MMBZ15VALT1 ON2147

MOTOROLA[Motorola, Inc]
ON Semi
MOTOROLA[Motorola Inc]
Part No. MMBZ20VALT1 MMBZ5V6ALT1 MMBZ6V2ALT1 MMBZ15VALT1 ON2147
OCR Text ...perature gradient and result in latent failure due to mechanical stress. * Mechanical stress or shock should not be applied during cooling. * Soldering a device without preheating can cause excessive thermal shock and stress which can resul...
Description From old datasheet system
SOT?3 COMMON ANODE DUAL ZENER OVERVOLTAGE
SOT-23 COMMON ANODE DUAL ZENER OVERVOLTAGE TRANSIENT SUPPRESSORS 24 & 40 WATTS PEAK POWER

File Size 129.61K  /  6 Page

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    BAS70-04LT1 ON0122 BAS70-04LT1/D

Motorola, Inc.
ON Semiconductor
Part No. BAS70-04LT1 ON0122 BAS70-04LT1/D
OCR Text ...perature gradient and result in latent failure due to mechanical stress. * Mechanical stress or shock should not be applied during cooling. * Soldering a device without preheating can cause excessive thermal shock and stress which can resul...
Description Dual Series Schottky Diode(高速开关应用,-0.75V正向电压,反向电0V的双肖特基势垒二极管)
CYDC064B08 West Bridge Peripheral Controllers; Bus Width: x16; Speed: 55 ns
SCHOTTKY BARRIER DIODES
From old datasheet system

File Size 72.67K  /  4 Page

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