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  bottom-brazed Datasheet PDF File

For bottom-brazed Found Datasheets File :: 77    Search Time::1.359ms    
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    HOLTIC[Holt Integrated Circuits]
Part No. HI-1568PSTF HI-1567_06 HI-1567CDI HI-1567CDM HI-1567CDT HI-1567PCI HI-1567PCIF HI-1567PCM HI-1567PCMF HI-1567PCT HI-1567PCTF HI-1567PSI HI-1567PSIF HI-1567PSM HI-1567PSMF HI-1567PSTF HI-1568 HI-1568CDI HI-1568CDM HI-1568CDT HI-1568PCI HI-1568PCIF HI-1568PCM HI-1568PCMF HI-1568PCT HI-1568PCTF HI-1568PSI HI-1568PSIF HI-1568PSM HI-1568PSMF HI-1568PST
OCR Text ... metal heat sink located on the bottom surface of the device. This heat sink should be soldered down to the printed circuit board for optimu...brazed DIP 44-pin Plastic chipscale package Data taken at VDD=5.0V, continuous transmission at 1M...
Description 5V Monolithic Dual Transceivers

File Size 73.58K  /  9 Page

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    HOLTIC[Holt Integrated Circuits]
Part No. HI-1568PST HI-1567_03 HI-1567CDI HI-1567CDIM HI-1567CDIT HI-1567CDM HI-1567CDT HI-1567PCI HI-1567PCIT HI-1567PCT HI-1567PSI HI-1567PSIT HI-1567PSM HI-1567PST HI-1568CDI HI-1568CDIM HI-1568CDIT HI-1568CDM HI-1568CDT HI-1568PCI HI-1568PCIT HI-1568PCT HI-1568PSI HI-1568PSIM HI-1568PSIT HI-1568PSM HI-1567PSIM
OCR Text ... metal heat sink located on the bottom surface of the device. This heat sink should be soldered down to the printed circuit board for optimu...brazed DIP 44-pin Plastic chipscale package Data taken at VDD=5.0V, continuous transmission at 1M...
Description 5V MONOLITHIC DUAL TRANSCEIVERS

File Size 101.89K  /  9 Page

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    AD1385TD_883B

Analog Devices
Part No. AD1385TD_883B
OCR Text ...he AD1385 is housed in a 48-pin bottom-brazed ceramic bathtub package. The pinout is as follows: Pin Function 11 12 13 14 15 16 17 18 19 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 CLOCK IN POWER GROUND B1/B9 (MSB) B2/B10 B3/B11 B4/B12 B5...
Description 16-Bit 500 kHz Wide Temperature Range Sampling ADC

File Size 349.04K  /  20 Page

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    FLATPACK

Amkor Technology
Part No. FLATPACK
OCR Text ...ads brazed to either the top or bottom of the package. The lid for this package can be either ceramic "frit sealed" or metal "solder sealed". This package provides a hermetic environment for the IC inside. Applications: This IC package tech...
Description Ceramic Flat Pack Package

File Size 486.00K  /  1 Page

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    ISL73096RH ISL73096RHF_PROTO ISL73096RHX_SAMPLE ISL73096RH09 ISL73127RH ISL73127RHF_PROTO ISL73127RHX_SAMPLE ISL73128RH

Intersil Corporation
Part No. ISL73096RH ISL73096RHF_PROTO ISL73096RHX_SAMPLE ISL73096RH09 ISL73127RH ISL73127RHF_PROTO ISL73127RHX_SAMPLE ISL73128RH ISL73128RHF_PROTO ISL73128RHX_SAMPLE 5962F0721802VXC ISL73096RHX/SAMPLE ISL73127RHX/SAMPLE ISL73128RHX/SAMPLE 5962F0721801V9A ISL73096RHF/PROTO ISL73127RHF/PROTO ISL73128RHF/PROTO 5962F0721801VXC 5962F0721802V9A 5962F0721803V9A 5962F0721803VXC
OCR Text ... S1 at all four corners. 7. For bottom-brazed lead packages, no organic or polymeric materials shall be molded to the bottom of the package to cover the leads. 8. Dimension Q shall be measured at the point of exit (beyond the meniscus) of t...
Description Radiation Hardened Ultra High Frequency NPN/PNP Transistor Arrays

File Size 226.21K  /  5 Page

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    PIC12C508A-04_EJW PIC12C508A-04_EP PIC12C508A-04_ESM PIC12C508A-04_ESN PIC12C508A-04_IJW PIC12C508A-04_IP PIC12C508A-04_

Microchip Technology, Inc.
Microchip Technology Inc.
Part No. PIC12C508A-04_EJW PIC12C508A-04_EP PIC12C508A-04_ESM PIC12C508A-04_ESN PIC12C508A-04_IJW PIC12C508A-04_IP PIC12C508A-04_ISM PIC12C508A-04_ISN PIC12C508AT-04_EJW PIC12C508AT-04_EP PIC12C508AT-04_ESM PIC12C508AT-04_ESN PIC12C508AT-04_IJW PIC12C508AT-04_IP PIC12C508AT-04_ISM PIC12C508AT-04_ISN PIC12C509A-04_EJW PIC12C509A-04_EP PIC12C509A-04_ESM PIC12C509A-04_ESN PIC12C509A-04_IJW PIC12C509A-04_IP PIC12C509A-04_ISM PIC12C509A-04_ISN PIC12CE519-04_EJW PIC12CE519-04_EP PIC12CE519-04_ESM PIC12CE519-04_ESN PIC12CE519-04_IJW PIC12CE519-04_IP PIC12CE519-04_ISM PIC12CE519-04_ISN PIC12C509AT-04_EJW PIC12C509AT-04_EP PIC12C509AT-04_ESM PIC12C509AT-04_ESN PIC12C509AT-04_IJW PIC12C509AT-04_IP PIC12C509AT-04_ISM PIC12C509AT-04_ISN PIC12CE518T-04_EJW PIC12CE518T-04_ESM PIC12CE518T-04_ESN PIC12CE518T-04_IJW PIC12CE518T-04_IP PIC12CE518T-04_ISM PIC12CE518T-04_ISN PIC12LC508A-04_EJW PIC12LC508A-04_EP PIC12LC508A-04_ESM PIC12LC508A-04_ESN PIC12LC508A-04_IJW PIC12LC508A-04_IP PIC12LC508A-04_ISM PIC12LC508A-04_ISN PIC12CE519T-04_EJW PIC12LCE519T-04_EJW PIC12CE519T-04_EP PIC12LCE519T-04_EP PIC12CE519T-04_ESM PIC12LCE519T-04_ESM PIC12CE519T-04_ESN PIC12LCE519T-04_ESN PIC12CE519T-04_IJW PIC12LCE519T-04_IJW
OCR Text ... literature number found on the bottom outside corner of any page. The last character of the literature number is the version number. e.g., ...brazed package, is optimal for prototype development and pilot programs. The UV erasable version can...
Description 8-BIT, OTPROM, 4 MHz, RISC MICROCONTROLLER, PDIP8
8-BIT, OTPROM, 4 MHz, RISC MICROCONTROLLER, PDSO8
Circular Connector; MIL SPEC:MIL-DTL-38999 Series III; Body Material:Metal; Series:TV07; No. of Contacts:5; Connector Shell Size:15; Connecting Termination:Crimp; Circular Shell Style:Jam Nut Receptacle; Body Style:Straight 8引脚位CMOS微控制器
TV 4C 4#12 SKT RECP 8引脚位CMOS微控制器
ER 6C 6#16S PIN RECP BOX 8引脚位CMOS微控制器
ER 5C 5#16S SKT RECP BOX 8引脚位CMOS微控制器
Circular Connector; MIL SPEC:MIL-DTL-38999 Series III; Body Material:Metal; Series:TV07; No. of Contacts:26; Connector Shell Size:17; Connecting Termination:Crimp; Circular Shell Style:Jam Nut Receptacle; Body Style:Straight 8引脚位CMOS微控制器
Circular Connector; MIL SPEC:MIL-DTL-38999 Series III; Body Material:Metal; Series:TVS07; Number of Contacts:10; Connector Shell Size:13; Connecting Termination:Crimp; Circular Shell Style:Jam Nut Receptacle; Body Style:Straight 8引脚位CMOS微控制器
8-Pin, 8-Bit CMOS Microcontrollers 8引脚位CMOS微控制器
CB 5C 5#16S SKT RECP BOX 8引脚位CMOS微控制器
TV 6C 6#20 PIN WALL RECP 8引脚位CMOS微控制器
8-Pin, 8-Bit CMOS Microcontrollers 8引脚8位CMOS微控制器
BNC RIGHT ANGLE PLUG FOR RG 58
Circular Connector; MIL SPEC:MIL-DTL-38999 Series III; Body Material:Metal; Series:TVS07; Number of Contacts:8; Connector Shell Size:13; Connecting Termination:Crimp; Circular Shell Style:Jam Nut Receptacle; Body Style:Straight
Circular Connector; MIL SPEC:MIL-DTL-38999 Series III; Body Material:Metal; Series:TVS07; No. of Contacts:22; Connector Shell Size:13; Connecting Termination:Crimp; Circular Shell Style:Jam Nut Receptacle; Body Style:Straight
Circular Connector; MIL SPEC:MIL-DTL-38999 Series III; Body Material:Metal; Series:TVS07; Number of Contacts:22; Connector Shell Size:13; Connecting Termination:Crimp; Circular Shell Style:Jam Nut Receptacle; Body Style:Straight
TV 37C 37#22D SKT RECP
TV 22C 22#22D PIN RECP
TV 4C 4#12 PIN RECP
PIC12C5XX/CE5XX Datasheet
8-Pin/ 8-Bit CMOS Microcontrollers
MICROCONTROLLER|8-BIT|PIC CPU|CMOS|SOP|8PIN|PLASTIC
RADIATION HARDENED HIGH EFFICIENCY, 5 AMP SWITCHING REGULATORS
Single Supply, Dual Precision Op Amp; Package: PDIP; No of Pins: 8; Temperature Range: 0°C to 70°C
MICROCONTROLLER|8-BIT|PIC CPU|CMOS|DIP|8PIN|PLASTIC 单片机| 8位|知情同意的CPU |的CMOS |双酯| 8引脚|塑料

File Size 829.67K  /  113 Page

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    HOLTIC
Part No. HI-1565 HI-1566
OCR Text ... metal heat sink located on the bottom surface of the device. This heat sink should be soldered down to the printed circuit board for optimu...brazed DIP 44-pin Plastic chipscale package Data taken at VDD=5.0V, continuous transmission at 1M...
Description (HI-1565 / HI-1566) 5V Monolithic Dual Transceivers

File Size 101.66K  /  9 Page

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    HI-1567 HI-1567CD HI-1567CDM-03 HI-1568CDM-03

Holt Integrated Circuit...
Holt Integrated Circuits, Inc.
Part No. HI-1567 HI-1567CD HI-1567CDM-03 HI-1568CDM-03
OCR Text ...2667 .0381) Heat sink stud on bottom of package. Package Type: 24HEW .5035 .0075 (12.789 .191) .300 TYP. (7.620) .025 Min.. ...BRAZED DIP PACKAGE TYPE: 20C 1.000 .010 (25.400 .254) .310 .010 (7.874 .254) .050 TYP. (1.27...
Description 5V MONOLITHIC DUAL TRANSCEIVERS DATACOM, MIL-STD-1553 DATA BUS TRANSCEIVER, CDIP20
Power Resistor; Series:200; Resistance:100ohm; Resistance Tolerance: /- 5%; Power Rating:12W; Resistor Element Material:Ceramic; Temperature Coefficient: /-260 ppm; Leaded Process Compatible:No; Packaging:Bulk RoHS Compliant: No

File Size 216.46K  /  7 Page

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    5962-0721301QXC 5962-0721303QXC

Intersil Corporation
Part No. 5962-0721301QXC 5962-0721303QXC
OCR Text ... S1 at all four corners. 7. For bottom-brazed lead packages, no organic or polymeric materials shall be molded to the bottom of the package to cover the leads. 8. Dimension Q shall be measured at the point of exit (beyond the meniscus) of t...
Description 500MHz Rail-to-Rail Amplifiers

File Size 158.68K  /  5 Page

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    5962-0625501QXC

Intersil Corporation
Part No. 5962-0625501QXC
OCR Text ... S1 at all four corners. 7. For bottom-brazed lead packages, no organic or polymeric materials shall be molded to the bottom of the package to cover the leads. 8. Dimension Q shall be measured at the point of exit (beyond the meniscus) of t...
Description 350MHz Fixed Gain Amplifiers with Enable

File Size 105.79K  /  4 Page

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For bottom-brazed Found Datasheets File :: 77    Search Time::1.359ms    
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