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Amphenol Communications Solutions |
| Part No. |
10132450-0611GLF
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| Description |
Minitek® Pwr 3.0 HCC, Dual Row, Vertical Through Hole Header, Gold Flash plating, Black Color, 6 Positions, GW Compatible PA9T, Tray packing.
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| Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
| Part No. |
10132450-0811GLF
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| Description |
Minitek® Pwr 3.0 HCC, Dual Row, Vertical Through Hole Header, Gold Flash plating, Black Color, 8 Positions, GW Compatible PA9T, Tray packing.
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| Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
| Part No. |
10132450-0211GLF
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| Description |
Minitek® Pwr 3.0 HCC, Dual Row, Vertical Through Hole Header, Gold Flash plating, Black Color, 2 Positions, GW Compatible PA9T, Tray packing.
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| Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
| Part No. |
10132450-0421GLF
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| Description |
Minitek® Pwr 3.0 HCC, Dual Row, Vertical Through Hole Header, Tin plating, Black Color, 4 Positions, GW Compatible PA9T, Tray packing.
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| Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
| Part No. |
10132450-1211GLF
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| Description |
Minitek® Pwr 3.0 HCC, Dual Row, Vertical Through Hole Header, Gold Flash plating, Black Color, 12 Positions, GW Compatible PA9T, Tray packing.
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| Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
| Part No. |
86832-454HLF
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| Description |
BergStik® 2.54mm, Board to Board connector, Unshrouded Header, Through Hole, Double Row, 54 Positions, 2.54 mm Pitch, Vertical, 8.26 mm (0.325 in.) Mating, 2.54 mm (0.1 in.) Tail.
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| Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
| Part No. |
10132450-1821GLF
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| Description |
Minitek® Pwr 3.0 HCC, Dual Row, Vertical Through Hole Header, Tin plating, Black Color, 18 Positions, GW Compatible PA9T, Tray packing.
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| Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
| Part No. |
10132450-1411GLF
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| Description |
Minitek® Pwr 3.0 HCC, Dual Row, Vertical Through Hole Header, Gold Flash plating, Black Color, 14 Positions, GW Compatible PA9T, Tray packing.
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| Tech specs |
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Official Product Page
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Molex Electronics Ltd.
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| Part No. |
73780-3153
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| Description |
2.00mm (.079) Pitch HDM? Board-to-Board Daughtercard Receptacle, Vertical, SignalModule, 144 Circuits, Mounted Height 13.00mm (.512), Pin Length 3.50mm (.138),
2.00mm (.079") Pitch HDM垄莽 Board-to-Board Daughtercard Receptacle, Vertical, SignalModule, 144 Circuits, Mounted Height 13.00mm (.512"), Pin Length 3.50mm (.138
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| File Size |
198.98K /
3 Page |
 View
it Online |
Download Datasheet
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Amphenol Communications Solutions |
| Part No. |
10132450-0221GLF
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| Description |
Minitek® Pwr 3.0 HCC, Dual Row, Vertical Through Hole Header, Tin plating, Black Color, 2 Positions, GW Compatible PA9T, Tray packing.
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| Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
| Part No. |
86832-456HLF
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| Description |
BergStik® 2.54mm, Board to Board connector, Unshrouded Header, Through Hole, Double Row, 56 Positions, 2.54 mm Pitch, Vertical, 8.26 mm (0.325 in.) Mating, 2.54 mm (0.1 in.) Tail.
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| Tech specs |
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Official Product Page
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Bom2Buy.com
Price and Availability
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