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  87758-4250 Datasheet PDF File

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    87758-3617

Molex Electronics Ltd.
Part No. 87758-3617
Description 2.00mm (.079) Pitch Milli-Grid?/a> Header, Through Hole, Vertical, 36 Circuits, 0.76μm (30μ) Gold (Au) Selective Plating, Pocket Tray Packaging, Lead-free

File Size 170.76K  /  4 Page

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Amphenol Communications Solutions

Part No. 54121-816142500LF
Description BergStik®, Board to Board connector, Unshrouded vertical stacked header, Through Hole, Single Row, 14 Positions, 2.54mm (0.100in) Pitch.
Tech specs    

Official Product Page

HUA FENG CIRCUIT





    87758-1616

Molex Electronics Ltd.
Part No. 87758-1616
Description 2.00mm (.079) Pitch Milli-Grid Header, Through Hole, Vertical, 16 Circuits, 0.38um (15u) Gold (Au) Selective Plating

File Size 170.71K  /  4 Page

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Amphenol Communications Solutions

Part No. 54122-112042500LF
Description BergStik®, Board to Board connector, Unshrouded stacking vertical header, through hole, double Row, 4 position, 2.54mm (0.100in) pitch
Tech specs    

Official Product Page

    87758-1850

Molex Electronics Ltd.
Part No. 87758-1850
Description 2.00mm (.079) Pitch Milli-Grid Header, Through Hole, Vertical, 18 Circuits
2.00mm (.079") Pitch Milli-Grid Header, Through Hole, Vertical, 18 Circuits

File Size 135.97K  /  4 Page

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Amphenol Communications Solutions

Part No. U10A474250T
Description SlimSAS Right angle X8 30u\\ Gold plating, Latch pin length=3.0mm, 24G, T&R packing
Tech specs    

Official Product Page

    87758-1217

Molex Electronics Ltd.
Part No. 87758-1217
Description 2.00mm (.079) Pitch Milli-Grid Header, Through Hole, Vertical, 12 Circuits, 0.76μm (30μ) Gold (Au) Selective Plating, Pocket Tray Packaging, Lead-free

File Size 170.76K  /  4 Page

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Amphenol Communications Solutions

Part No. U10KH7425001T
Description SlimSAS Vertical X12 30u\\ Gold plating, Latch pin outside, Latch pin length=3.0mm, 24G, T&R packing
Tech specs    

Official Product Page

    87758-4216

Molex Electronics Ltd.
Part No. 87758-4216
Description 2.00mm (.079) Pitch Milli-Grid?/a> Header, Through Hole, Vertical, 42 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating, Pocket Tray Packaging, Lead-free

File Size 170.43K  /  4 Page

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Amphenol Communications Solutions

Part No. 77315-425-04LF
Description BergStik®, Board to Board connector, Unshrouded Header, Through Hole, Single Row, 4 Positions 2.54mm (0.100in) Pitch, Right Angle
Tech specs    

Official Product Page

    87758-4217

Molex Electronics Ltd.
Part No. 87758-4217
Description 2.00mm (.079) Pitch Milli-Grid?/a> Header, Through Hole, Vertical, 42 Circuits, 0.76μm (30μ) Gold (Au) Selective Plating, Pocket Tray Packaging, Lead-free

File Size 170.41K  /  4 Page

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Amphenol Communications Solutions

Part No. 61124-250CACLF
Description Assembly, Top Mount, D/D(136Pins), VTB, Type 123, 3.3V, 5mm s/o, Right Push Rod Eject, 9.5mm Eject Travel
Tech specs    

Official Product Page

    87758-3450

Molex Electronics Ltd.
Part No. 87758-3450
Description 2.00mm (.079) Pitch Milli-Grid Header, Through Hole, Vertical, 34 Circuits, 0.38um (15u) Gold (Au) Selective Plating

File Size 135.48K  /  4 Page

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Amphenol Communications Solutions

Part No. 54122-112142500LF
Description BergStik®, Board to Board connector, Unshrouded stacking vertical header, through hole, double Row, 14 position, 2.54mm (0.100in) pitch
Tech specs    

Official Product Page

    MOLEX INC
Part No. 87758-1250
Description 2mm MGrid VHdr .38AuLF 12Ckt

File Size 104.89K  /  2 Page

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Amphenol Communications Solutions

Part No. 54122-811242500LF
Description BergStik®, Board to Board connector, Unshrouded stacking vertical header, through hole, double Row, 24 position, 2.54mm (0.100in) pitch
Tech specs    

Official Product Page

    87758-3816

Molex Electronics Ltd.
Part No. 87758-3816
Description 2.00mm (.079) Pitch Milli-Grid?/a> Header, Through Hole, Vertical, 38 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating, Pocket Tray Packaging, Lead-free

File Size 170.43K  /  4 Page

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Amphenol Communications Solutions

Part No. 54242-504140950LF
Description BergStik®, Board to Board connector, Unshrouded vertical stacked header, Surface Mount, Double Row, 14 Positions, 2.54mm (0.100in) Pitch.
Tech specs    

Official Product Page

    87758-2217

Molex Electronics Ltd.
Part No. 87758-2217
Description 2.00mm (.079) Pitch Milli-Grid?/a> Header, Through Hole, Vertical, 22 Circuits, 0.76μm(30μ) Gold (Au) Selective Plating, Pocket Tray Packaging, Lead-free
2.00mm (.079) Pitch Milli-Grid Header, Through Hole, Vertical, 22 Circuits, 0.76μm(30μ) Gold (Au) Selective Plating, Pocket Tray Packaging, Lead-free

File Size 170.71K  /  4 Page

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Amphenol Communications Solutions

Part No. 59112-G24-25-051LF
Description Minitek® 2.00mm, Board To Board, Unshrouded Vertical Stacking Header, Through Hole, Double Row, 50 Positions.
Tech specs    

Official Product Page

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