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  73780-3245 Datasheet PDF File

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    73780-3255

Molex Electronics Ltd.
Part No. 73780-3255
Description 2.00mm (.079) Pitch HDM Board-to-Board Daughtercard Receptacle, Vertical, Signal Module, 144 Circuits
File Size 198.71K  /  3 Page

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Amphenol Communications Solutions
Part No. 10132450-0611GLF
Description Minitek® Pwr 3.0 HCC, Dual Row, Vertical Through Hole Header, Gold Flash plating, Black Color, 6 Positions, GW Compatible PA9T, Tray packing.
Tech specs 　 　

Official Product Page

HUA FENG CIRCUIT





    73780-3253

Molex Electronics Ltd.
Part No. 73780-3253
Description 2.00mm (.079) Pitch HDM? Board-to-Board Daughtercard Receptacle, Vertical, SignalModule, 144 Circuits, Mounted Height 13.00mm (.512), Pin Length 3.50mm (.138),
File Size 198.70K  /  3 Page

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Amphenol Communications Solutions
Part No. 10132450-0811GLF
Description Minitek® Pwr 3.0 HCC, Dual Row, Vertical Through Hole Header, Gold Flash plating, Black Color, 8 Positions, GW Compatible PA9T, Tray packing.
Tech specs 　 　

Official Product Page

    73780-3147

Molex Electronics Ltd.
Part No. 73780-3147
Description 2.00mm (.079) Pitch HDM Board-to-Board Daughtercard Receptacle, Vertical, Signal Module, 144 Circuits
File Size 193.90K  /  3 Page

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Amphenol Communications Solutions
Part No. 10132450-0211GLF
Description Minitek® Pwr 3.0 HCC, Dual Row, Vertical Through Hole Header, Gold Flash plating, Black Color, 2 Positions, GW Compatible PA9T, Tray packing.
Tech specs 　 　

Official Product Page

    73780-3157

Molex Electronics Ltd.
Part No. 73780-3157
Description 2.00mm (.079) Pitch HDM? Board-to-Board Daughtercard Receptacle, Vertical, SignalModule, 144 Circuits, Mounted Height 17.00mm (.669), Pin Length 3.50mm (.138),
File Size 198.71K  /  3 Page

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Amphenol Communications Solutions
Part No. 10132450-0421GLF
Description Minitek® Pwr 3.0 HCC, Dual Row, Vertical Through Hole Header, Tin plating, Black Color, 4 Positions, GW Compatible PA9T, Tray packing.
Tech specs 　 　

Official Product Page

    73780-2155

Molex Electronics Ltd.
Part No. 73780-2155
Description 2.00mm (.079) Pitch HDM Board-to-Board Daughtercard Receptacle, Vertical, Signal Module, 72 Circuits
File Size 198.70K  /  3 Page

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Amphenol Communications Solutions
Part No. 10132450-1211GLF
Description Minitek® Pwr 3.0 HCC, Dual Row, Vertical Through Hole Header, Gold Flash plating, Black Color, 12 Positions, GW Compatible PA9T, Tray packing.
Tech specs 　 　

Official Product Page

    73780-2163

Molex Electronics Ltd.
Part No. 73780-2163
Description 2.00mm (.079) Pitch HDM? Board-to-Board Daughtercard Receptacle, Vertical, SignalModule, 72 Circuits, Mounted Height 13.00mm (.511), Pin Length 4.00mm (.157),
File Size 198.70K  /  3 Page

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Amphenol Communications Solutions
Part No. 86832-454HLF
Description BergStik® 2.54mm, Board to Board connector, Unshrouded Header, Through Hole, Double Row, 54 Positions, 2.54 mm Pitch, Vertical, 8.26 mm (0.325 in.) Mating, 2.54 mm (0.1 in.) Tail.
Tech specs 　 　

Official Product Page

    73780-3146

Molex Electronics Ltd.
Part No. 73780-3146
Description 2.00mm (.079) Pitch HDM Board-to-Board Daughtercard Receptacle, Vertical, Signal Module, 144 Circuits
File Size 193.89K  /  3 Page

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Amphenol Communications Solutions
Part No. 10132450-1821GLF
Description Minitek® Pwr 3.0 HCC, Dual Row, Vertical Through Hole Header, Tin plating, Black Color, 18 Positions, GW Compatible PA9T, Tray packing.
Tech specs 　 　

Official Product Page

    73780-3154

Molex Electronics Ltd.
Part No. 73780-3154
Description 2.00mm (.079) Pitch HDM Board-to-Board Daughtercard Receptacle, Vertical, Signal Module, 144 Circuits, Mounted
File Size 193.90K  /  3 Page

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Amphenol Communications Solutions
Part No. 10132450-1411GLF
Description Minitek® Pwr 3.0 HCC, Dual Row, Vertical Through Hole Header, Gold Flash plating, Black Color, 14 Positions, GW Compatible PA9T, Tray packing.
Tech specs 　 　

Official Product Page

    73780-2165

Molex Electronics Ltd.
Part No. 73780-2165
Description 2.00mm (.079) Pitch HDM? Board-to-Board Daughtercard Receptacle, Vertical, SignalModule, 72 Circuits, Mounted Height 15.00mm (.591), Pin Length 4.00mm (.157),
File Size 209.12K  /  3 Page

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Amphenol Communications Solutions
Part No. 10132450-0221GLF
Description Minitek® Pwr 3.0 HCC, Dual Row, Vertical Through Hole Header, Tin plating, Black Color, 2 Positions, GW Compatible PA9T, Tray packing.
Tech specs 　 　

Official Product Page

    73780-2153

Molex Electronics Ltd.
Part No. 73780-2153
Description 2.00mm (.079) Pitch HDM Board-to-Board Daughtercard Receptacle, Vertical, Signal Module, 72 Circuits, Mounted Height
File Size 198.95K  /  3 Page

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Amphenol Communications Solutions
Part No. 86832-456HLF
Description BergStik® 2.54mm, Board to Board connector, Unshrouded Header, Through Hole, Double Row, 56 Positions, 2.54 mm Pitch, Vertical, 8.26 mm (0.325 in.) Mating, 2.54 mm (0.1 in.) Tail.
Tech specs 　 　

Official Product Page

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