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  latent Datasheet PDF File

For latent Found Datasheets File :: 697    Search Time::6.406ms    
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    ST Microelectronics
Part No. STV3208
OCR Text ... be en- tered in different way. latent period : the latent period between input data and corre- sponding output results is 167 clock cycles (if fdct is selected)or 163 clock cycles (if idct is selected) in single precision mode (s/d pin set...
Description 8 x 8 DISCRETE COSINE TRANSFORM

File Size 183.28K  /  17 Page

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    List of Unclassifed Manufac...
Part No. 4171900XX-3
OCR Text ...dder and reduces blur caused by latent lcd response time via fast motion compensation frame interpolation. system configuration reliability calculated mean time between f ailures - in excess of 100,000 hours. w arranty - 3 years. the...
Description Eliminates film judder and reduces blur caused by latent

File Size 2,215.04K  /  3 Page

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    ON Semi
Part No. BSP16T1_D ON0219
OCR Text ...perature gradient and result in latent failure due to mechanical stress. * Mechanical stress or shock should not be applied during cooling * Soldering a device without preheating can cause excessive thermal shock and stress which can result...
Description SOT-223 PACKAGE NPN SILICON
From old datasheet system

File Size 97.97K  /  6 Page

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    ON Semi
Part No. BSP62T1_D ON0222
OCR Text ...perature gradient and result in latent failure due to mechanical stress. * Mechanical stress or shock should not be applied during cooling * Soldering a device without preheating can cause excessive thermal shock and stress which can result...
Description MEDIUM POWER PNP SILICON
From old datasheet system

File Size 123.28K  /  6 Page

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    ICM515NB

ETC
Part No. ICM515NB
OCR Text ...le [5]Reserved [6] Reserved [7] latent change, writing a 1 means the changed latent registers now starts taking effect, when the entire operation is done, the read back value of this bit will change from 1 to 0. Timing control [0] Column co...
Description Color CMOS Image Sensor With 574x483 Pixel NTSC Composite Video Output

File Size 436.24K  /  25 Page

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    MMBF0202PLT1 MMBF0202PL ON2091

MOTOROLA[Motorola, Inc]
Part No. MMBF0202PLT1 MMBF0202PL ON2091
OCR Text ...perature gradient and result in latent failure due to mechanical stress. * Mechanical stress or shock should not be applied during cooling. * Soldering a device without preheating can cause excessive thermal shock and stress which can resul...
Description From old datasheet system
P-CHANNEL ENHANCEMENT-MODE TMOS MOSFET

File Size 190.27K  /  6 Page

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    MMBF4391LT1 MMBF4392L MMBF4392LT1 MMBF4393LT1 ON2098

MOTOROLA[Motorola, Inc]
ONSEMI[ON Semiconductor]
Part No. MMBF4391LT1 MMBF4392L MMBF4392LT1 MMBF4393LT1 ON2098
OCR Text ...perature gradient and result in latent failure due to mechanical stress. * Mechanical stress or shock should not be applied during cooling. * Soldering a device without preheating can cause excessive thermal shock and stress which can resul...
Description From old datasheet system
CASE 3188, STYLE 10 SOT3 (TO?36AB
JFET Switching Transistors

File Size 137.40K  /  6 Page

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    MMBTH10LT1

MOTOROLA[Motorola, Inc]
Part No. MMBTH10LT1
OCR Text ...perature gradient and result in latent failure due to mechanical stress. * Mechanical stress or shock should not be applied during cooling. * Soldering a device without preheating can cause excessive thermal shock and stress which can resul...
Description VHF/UHF Transistor

File Size 86.76K  /  6 Page

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    MMQA5V6T1 MMQA20VT1 ON2242

Motorola Mobility Holdings, Inc.
MOTOROLA[Motorola, Inc]
Part No. MMQA5V6T1 MMQA20VT1 ON2242
OCR Text ...ure gradient and will result in latent failure due to mechanical stress. * Mechanical stress or shock should not be applied during cooling. TYPICAL SOLDER HEATING PROFILE For any given circuit board, there will be a group of control set...
Description SC-59 QUAD TRANSIENT VOLTAGE SUPPRESSOR 5.6 VOLTS 24 W, UNIDIRECTIONAL, 4 ELEMENT, SILICON, TVS DIODE
From old datasheet system

File Size 136.87K  /  8 Page

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    MSB709RT1 MSB709-RT1 ON2370

Motorola Mobility Holdings, Inc.
Motorola, Inc.
MOTOROLA[Motorola Inc]
ONSEMI[ON Semiconductor]
Part No. MSB709RT1 MSB709-RT1 ON2370
OCR Text ...perature gradient and result in latent failure due to mechanical stress. * Mechanical stress or shock should not be applied during cooling * Soldering a device without preheating can cause excessive thermal shock and stress which can result...
Description PNP General Purpose Amplifier Transistor Surface Mount 100 mA, 25 V, PNP, Si, SMALL SIGNAL TRANSISTOR
From old datasheet system

File Size 111.84K  /  4 Page

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