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  87891-1818 Datasheet PDF File

For 87891-1818 Found Datasheets File :: 150+       Page :: | 1 | <2> | 3 | 4 | 5 | 6 | 7 | 8 | 9 | 10 | 11 | 12 | 13 | 14 | 15 |   

    87891-0206 0878910206

Molex Electronics Ltd.
Part No. 87891-0206 0878910206
Description 2.54mm (.100) Pitch KK庐 Header, Through Hole, Breakaway, Vertical, 2 Circuits, 2.54渭m (100渭) Tin (Sn) Plating, Tray Packaging, Lead-free
2.54mm (.100) Pitch KK? Header, Through Hole, Breakaway, Vertical, 2 Circuits, 2.54μm (100μ) Tin (Sn) Plating, Tray Packaging, Lead-free

File Size 759.15K  /  10 Page

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Amphenol Communications Solutions

Part No. 77311-818-18LF
Description BergStik®, Board to Board connector, Unshrouded vertical Header, Through Hole, Single Row, 18 Positions, 2.54 mm Pitch.
Tech specs    

Official Product Page

HUA FENG CIRCUIT





    87891-0601 0878910601

Molex Electronics Ltd.
Part No. 87891-0601 0878910601
Description 2.54mm (.100) Pitch KK庐 Header, Through Hole, Breakaway, Vertical, 6 Circuits, 0.025渭m (1渭) Gold (Au) Plating, Tray Packaging, Lead-free
2.54mm (.100) Pitch KK? Header, Through Hole, Breakaway, Vertical, 6 Circuits, 0.025μm (1μ) Gold (Au) Plating, Tray Packaging, Lead-free

File Size 759.15K  /  10 Page

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Amphenol Communications Solutions

Part No. 10131318-18111G0LF
Description Minitek® Pwr 4.2 HCC, Dual Row, Right Angle Through Hole Header, Gold Flash plating, Natural Color, 18 Positions, GW Compatible Nylon66, Tray Packing.
Tech specs    

Official Product Page

    87891-2817 0878912817

Molex Electronics Ltd.
Part No. 87891-2817 0878912817
Description 2.54mm (.100 Header, Through Hole, Breakaway, Vertical, 28 Circuits 2.50渭m (100渭 Tape on Reel Packaging, Lead-free
2.54mm (.100 Header, Through Hole, Breakaway, Vertical, 28 Circuits 2.50μm (100μ Tape on Reel Packaging, Lead-free

File Size 287.95K  /  5 Page

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Amphenol Communications Solutions

Part No. 75188-818-18LF
Description BergStik® 2.54mm, Board To Board Connector, Unshrouded Vertical header, Through Hole, Single Row, 18 Positions, 5.08mm (0.200in) Pitch.
Tech specs    

Official Product Page

    87891-4003 0878914003

Molex Electronics Ltd.
Part No. 87891-4003 0878914003
Description 2.54mm (.100) Pitch KK庐 Header, Through Hole, Breakaway, Vertical, 40 Circuits, 0.254渭m (10渭) Gold (Au) Selective Plating, Bag Packaging, Lead-free
2.54mm (.100) Pitch KK? Header, Through Hole, Breakaway, Vertical, 40 Circuits, 0.254μm (10μ) Gold (Au) Selective Plating, Bag Packaging, Lead-free

File Size 759.02K  /  10 Page

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Amphenol Communications Solutions

Part No. 75188-118-18LF
Description BergStik® 2.54mm, Board To Board Connector, Unshrouded Vertical header, Through Hole, Single Row, 18 Positions, 5.08mm (0.200in) Pitch.
Tech specs    

Official Product Page

    14-45-1818

Molex Electronics Ltd.
Part No. 14-45-1818
Description 2.54mm (.100) Pitch SL Insulation Displacement Connector Assembly, Male, Single Row, Version D, Back Ribs, for Wire Size 28, 3.81μm (150μ) Tin (Sn), 18 Circuits

File Size 141.70K  /  2 Page

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Amphenol Communications Solutions

Part No. 77311-818-04LF
Description BergStik®, Board to Board connector, Unshrouded vertical Header, Through Hole, Single Row, 04 Positions, 2.54 mm Pitch.
Tech specs    

Official Product Page

    K1818-MR

Fuji Electric
Part No. K1818-MR
Description Search --To 2SK1818-MR

File Size 123.50K  /  2 Page

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Amphenol Communications Solutions

Part No. 77311-818-14LF
Description BergStik®, Board to Board connector, Unshrouded vertical Header, Through Hole, Single Row, 14 Positions, 2.54 mm Pitch.
Tech specs    

Official Product Page

    Intersil, Corp.
Part No. HI-1818A
Description Low Resistance, Single 8-Channel, and Differential 4-Channel, CMOS Analog Multiplexers 低电阻,通道,和差分4通道,CMOS模拟多路复用

File Size 262.64K  /  8 Page

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Amphenol Communications Solutions

Part No. 77311-818-24LF
Description BergStik®, Board to Board connector, Unshrouded vertical Header, Through Hole, Single Row, 24 Positions, 2.54 mm Pitch.
Tech specs    

Official Product Page

    Alliance Semiconductor
Part No. P1818 P1819
Description (P1818 - P1822) Low Power Mobile VGA EMI Reduction IC

File Size 88.86K  /  8 Page

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Amphenol Communications Solutions

Part No. 77311-818-34LF
Description BergStik®, Board to Board connector, Unshrouded vertical Header, Through Hole, Single Row, 34 Positions, 2.54 mm Pitch.
Tech specs    

Official Product Page

    43045-1818

Molex Electronics Ltd.
Part No. 43045-1818
Description 3.00mm (.118) Pitch Micro-Fit 3.0 Header, Surface Mount, Dual Row, Vertical, with Solder Tab, 18 Circuits

File Size 175.78K  /  3 Page

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Amphenol Communications Solutions

Part No. 10131318-1812100LF
Description Minitek® Pwr 4.2 HCC, Dual Row, Right Angle Through Hole Header, Gold Flash plating, Black Color, 18 Positions, Non GW Compatible Nylon66, Tray Packing.
Tech specs    

Official Product Page

    Semicon Components
Part No. 1N1818
Description 10 Watt Zener Diodes

File Size 477.65K  /  3 Page

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Amphenol Communications Solutions

Part No. 89891-818HLF
Description REC VER THT 36pos
Tech specs    

Official Product Page

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