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  73780-3245 Datasheet PDF File

For 73780-3245 Found Datasheets File :: 150+       Page :: | 1 | <2> | 3 | 4 | 5 | 6 | 7 | 8 | 9 | 10 | 11 | 12 | 13 | 14 | 15 |   

    73780-2166

Molex Electronics Ltd.
Part No. 73780-2166
Description 2.00mm (.079) Pitch HDM? Board-to-Board Daughtercard Receptacle, Vertical, SignalModule, 72 Circuits, Mounted Height 16.00mm (.630), Pin Length 4.00mm (.157),

File Size 194.17K  /  3 Page

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Amphenol Communications Solutions

Part No. 10132450-0611GLF
Description Minitek® Pwr 3.0 HCC, Dual Row, Vertical Through Hole Header, Gold Flash plating, Black Color, 6 Positions, GW Compatible PA9T, Tray packing.
Tech specs    

Official Product Page

HUA FENG CIRCUIT





    73780-2256

Molex Electronics Ltd.
Part No. 73780-2256
Description 2.00mm (.079) Pitch HDM? Board-to-Board Daughtercard Receptacle, Vertical, SignalModule, 72 Circuits, Mounted Height 16.00mm (.630), Pin Length 3.50mm (.138),

File Size 198.96K  /  3 Page

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Amphenol Communications Solutions

Part No. 10132450-0811GLF
Description Minitek® Pwr 3.0 HCC, Dual Row, Vertical Through Hole Header, Gold Flash plating, Black Color, 8 Positions, GW Compatible PA9T, Tray packing.
Tech specs    

Official Product Page

    73780-2255

Molex Electronics Ltd.
Part No. 73780-2255
Description 2.00mm (.079) Pitch HDM Board-to-Board Daughtercard Receptacle, Vertical, Signal Module, 72 Circuits

File Size 198.96K  /  3 Page

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Amphenol Communications Solutions

Part No. 10132450-0211GLF
Description Minitek® Pwr 3.0 HCC, Dual Row, Vertical Through Hole Header, Gold Flash plating, Black Color, 2 Positions, GW Compatible PA9T, Tray packing.
Tech specs    

Official Product Page

    73780-2253

Molex Electronics Ltd.
Part No. 73780-2253
Description 2.00mm (.079) Pitch HDM? Board-to-Board Daughtercard Receptacle, Vertical, SignalModule, 72 Circuits, Mounted Height 13.00mm (.512), Pin Length 3.50mm (.138)

File Size 198.95K  /  3 Page

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Amphenol Communications Solutions

Part No. 10132450-0421GLF
Description Minitek® Pwr 3.0 HCC, Dual Row, Vertical Through Hole Header, Tin plating, Black Color, 4 Positions, GW Compatible PA9T, Tray packing.
Tech specs    

Official Product Page

    73780-0223

Molex Electronics Ltd.
Part No. 73780-0223
Description 2.00mm (.079) Pitch HDM? Board-to-Board Daughtercard Receptacle, Vertical, SignalModule, 72 Circuits, Mounted Height 13.00mm (.512), Pin Length 2.00mm (.079),

File Size 201.99K  /  3 Page

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Amphenol Communications Solutions

Part No. 10132450-1211GLF
Description Minitek® Pwr 3.0 HCC, Dual Row, Vertical Through Hole Header, Gold Flash plating, Black Color, 12 Positions, GW Compatible PA9T, Tray packing.
Tech specs    

Official Product Page

    73780-0233

Molex Electronics Ltd.
Part No. 73780-0233
Description 2.00mm (.079) Pitch HDM? Board-to-Board Daughtercard Receptacle, Vertical, SignalModule, 72 Circuits, Mounted Height 13.00mm (.512), Pin Length 2.50mm (.098),

File Size 202.01K  /  3 Page

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Amphenol Communications Solutions

Part No. 86832-454HLF
Description BergStik® 2.54mm, Board to Board connector, Unshrouded Header, Through Hole, Double Row, 54 Positions, 2.54 mm Pitch, Vertical, 8.26 mm (0.325 in.) Mating, 2.54 mm (0.1 in.) Tail.
Tech specs    

Official Product Page

    73780-0226

Molex Electronics Ltd.
Part No. 73780-0226
Description 2.00mm (.079) Pitch HDM? Board-to-Board Daughtercard Receptacle, Vertical, Signal Module, 72 Circuits, Mounted Height 16.00mm (.630), Pin Length 2.00mm (.079), Solder Tail

File Size 201.99K  /  3 Page

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Amphenol Communications Solutions

Part No. 10132450-1821GLF
Description Minitek® Pwr 3.0 HCC, Dual Row, Vertical Through Hole Header, Tin plating, Black Color, 18 Positions, GW Compatible PA9T, Tray packing.
Tech specs    

Official Product Page

    73780-0225

Molex Electronics Ltd.
Part No. 73780-0225
Description 2.00mm (.079) Pitch HDM? Board-to-Board Daughtercard Receptacle, Vertical, SignalModule, 72 Circuits, Mounted Height 15.00mm (.591), Pin Length 2.00mm (.079),

File Size 202.00K  /  3 Page

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Amphenol Communications Solutions

Part No. 10132450-1411GLF
Description Minitek® Pwr 3.0 HCC, Dual Row, Vertical Through Hole Header, Gold Flash plating, Black Color, 14 Positions, GW Compatible PA9T, Tray packing.
Tech specs    

Official Product Page

    73780-0243

Molex Electronics Ltd.
Part No. 73780-0243
Description 2.00mm (.079) Pitch HDM? Board-to-Board Daughtercard Receptacle, Vertical, SignalModule, 72 Circuits, Mounted Height 13.00mm (.512), Pin Length 3.00mm (.118),

File Size 202.00K  /  3 Page

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Amphenol Communications Solutions

Part No. 10132450-0221GLF
Description Minitek® Pwr 3.0 HCC, Dual Row, Vertical Through Hole Header, Tin plating, Black Color, 2 Positions, GW Compatible PA9T, Tray packing.
Tech specs    

Official Product Page

    73780-2143

Molex Electronics Ltd.
Part No. 73780-2143
Description 2.00mm (.079) Pitch HDM? Board-to-Board Daughtercard Receptacle, Vertical, Signal Module, 72 Circuits, Mounted Height 13.00mm (.512), Pin Length 2.50mm (.098), Press Fit

File Size 198.96K  /  3 Page

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Amphenol Communications Solutions

Part No. 86832-456HLF
Description BergStik® 2.54mm, Board to Board connector, Unshrouded Header, Through Hole, Double Row, 56 Positions, 2.54 mm Pitch, Vertical, 8.26 mm (0.325 in.) Mating, 2.54 mm (0.1 in.) Tail.
Tech specs    

Official Product Page

For 73780-3245 Found Datasheets File :: 150+       Page :: | 1 | <2> | 3 | 4 | 5 | 6 | 7 | 8 | 9 | 10 | 11 | 12 | 13 | 14 | 15 |   

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