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Molex Electronics Ltd.
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| Part No. |
71764-0020
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| Description |
2.54mm (.100) Pitch C-Grid? Breakaway Header, Low Profile, Dual Row, Right AngleHigh Temperature, 20 Circuits, Tin (Sn) Plating
2.54mm (.100") Pitch C-Grid庐 Breakaway Header, Low Profile, Dual Row, Right AngleHigh Temperature, 20 Circuits, Tin (Sn) Plating
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| File Size |
121.14K /
5 Page |
 View
it Online |
Download Datasheet
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Amphenol Communications Solutions |
| Part No. |
G832MB030406022HR
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| Description |
0.80mm Board-to-Board 85Ω Connector, Pitch 0.8mm, Height 11.7 mm, 40 Positions, Dual Row, BTB Vertical Receptacle SMT, Gold Flash White.
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Official Product Page
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Molex Electronics Ltd.
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| Part No. |
71764-0018
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| Description |
2.54mm (.100) Pitch C-Grid? Breakaway Header, Low Profile, Dual Row, Right Angle, High Temperature, 18 Circuits, Tin (Sn) Plating
2.54mm (.100") Pitch C-Grid庐 Breakaway Header, Low Profile, Dual Row, Right Angle, High Temperature, 18 Circuits, Tin (Sn) Plating
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| File Size |
120.83K /
5 Page |
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it Online |
Download Datasheet |
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Amphenol Communications Solutions |
| Part No. |
69190-406HLF
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| Description |
BergStik®, Board to Board connector, Unshrouded vertical header, Through Hole, Single Row, 06 Positions, 2.54 mm (0.100in) Pitch.
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Official Product Page
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Molex Electronics Ltd.
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| Part No. |
71764-0108
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| Description |
2.54mm (.100) Pitch C-Grid? Breakaway Header, Low Profile, Dual Row, Right Angle,High Temperature, 8 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating
2.54mm (.100") Pitch C-Grid庐 Breakaway Header, Low Profile, Dual Row, Right Angle,High Temperature, 8 Circuits, 0.38渭m (15渭") Gold (Au) Selective Plating
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| File Size |
121.01K /
5 Page |
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it Online |
Download Datasheet |
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Amphenol Communications Solutions |
| Part No. |
77319-804-06LF
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| Description |
BergStik®, Board to Board connector, Unshrouded right angled header, Through Hole, Double Row, 06 Positions, 2.54 mm (0.100) Pitch.
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Official Product Page
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Amphenol Communications Solutions |
| Part No. |
54776-604-06LF
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| Description |
BergStik®, Board to Board connector, Unshrouded Vertical Stacking Header, Through Hole, Double row , Double body, Triplex, 6 Positions, 2.54mm (0.100in) Pitch
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Official Product Page
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Molex Electronics Ltd.
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| Part No. |
71764-0008
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| Description |
2.54mm (.100) Pitch C-Grid? Breakaway Header, Low Profile, Dual Row, Right AngleHigh Temperature, 8 Circuits, Tin (Sn) Plating
2.54mm (.100") Pitch C-Grid庐 Breakaway Header, Low Profile, Dual Row, Right AngleHigh Temperature, 8 Circuits, Tin (Sn) Plating
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| File Size |
121.06K /
5 Page |
View
it Online |
Download Datasheet |
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Amphenol Communications Solutions |
| Part No. |
59202-S28-04-065LF
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| Description |
Minitek® 2.00mm, Board To Board, Unshrouded Vertical Header, Surface Mount, Double Row, 8 Positions.
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Official Product Page
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Molex Electronics Ltd.
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| Part No. |
71764-0004
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| Description |
2.54mm (.100) Pitch C-Grid? Breakaway Header, Low Profile, Dual Row, Right AngleHigh Temperature, 4 Circuits, Tin (Sn) Plating
2.54mm (.100") Pitch C-Grid庐 Breakaway Header, Low Profile, Dual Row, Right AngleHigh Temperature, 4 Circuits, Tin (Sn) Plating
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| File Size |
121.13K /
5 Page |
View
it Online |
Download Datasheet |
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Amphenol Communications Solutions |
| Part No. |
77317-804-06
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| Description |
BergStik®, Board to Board connector, Unshrouded Right angle Header, Through Hole, Double Row, 6 Positions ,2.54mm (0.100in) Pitch,
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Official Product Page
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Molex Electronics Ltd.
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| Part No. |
71764-0114
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| Description |
2.54mm (.100) Pitch C-Grid? Breakaway Header, Low Profile, Dual Row, Right Angle,High Temperature, 14 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating
2.54mm (.100") Pitch C-Grid庐 Breakaway Header, Low Profile, Dual Row, Right Angle,High Temperature, 14 Circuits, 0.38渭m (15渭") Gold (Au) Selective Plating
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| File Size |
121.23K /
5 Page |
View
it Online |
Download Datasheet |
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Amphenol Communications Solutions |
| Part No. |
71600-406LF
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| Description |
Quickie IDC Receptacle, Wire to Board connector -Double row - 6Positions - 2.54 mm (0.100in) Pitch
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Official Product Page
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Amphenol Communications Solutions |
| Part No. |
68000-406HLF
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| Description |
BergStik®, Board to Board connector, Unshrouded Header, Through Hole, Single Row, 6 Positions, 2.54 mm Pitch, Vertical, 5.84 mm (0.23 in.) Mating, 2.41 mm (0.095 in.) Tail
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Official Product Page
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Molex Electronics Ltd.
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| Part No. |
71764-0116
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| Description |
2.54mm (.100) Pitch C-Grid? Breakaway Header, Low Profile, Dual Row, Right AngleHigh Temperature, 16 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating
2.54mm (.100") Pitch C-Grid庐 Breakaway Header, Low Profile, Dual Row, Right AngleHigh Temperature, 16 Circuits, 0.38渭m (15渭") Gold (Au) Selective Plating
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| File Size |
121.10K /
5 Page |
View
it Online |
Download Datasheet |
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Amphenol Communications Solutions |
| Part No. |
86380-406HLF
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| Description |
86380-406HLF-B/S II HDR DR SELF-RET
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Official Product Page
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Amphenol Communications Solutions |
| Part No. |
10082201-404-06LF
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| Description |
BergStik®, Board to Board connector, Unshrouded Right Angle Header, Through Hole, Pin In Paste, Single row , 6 Positions, 2.54mm (0.100in) Pitch
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Official Product Page
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