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  71764-0212 Datasheet PDF File

For 71764-0212 Found Datasheets File :: 150+       Page :: | 1 | <2> | 3 | 4 | 5 | 6 | 7 | 8 | 9 | 10 | 11 | 12 | 13 | 14 | 15 |   

    71764-0120

Molex Electronics Ltd.
Part No. 71764-0120
Description 2.54mm (.100) Pitch C-Grid? Breakaway Header, Low Profile, Dual Row, Right AngleHigh Temperature, 20 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating
2.54mm (.100") Pitch C-Grid庐 Breakaway Header, Low Profile, Dual Row, Right AngleHigh Temperature, 20 Circuits, 0.38渭m (15渭") Gold (Au) Selective Plating

File Size 121.16K  /  5 Page

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Amphenol Communications Solutions

Part No. 20021221-00010T4LF
Description Minitek127®, Wire to Board connector, Shrouded vertical header, Surface Mount, Double Row, 10 Positions, 1.27mm (0.500in) Pitch.
Tech specs    

Official Product Page

HUA FENG CIRCUIT





    71764-0118

Molex Electronics Ltd.
Part No. 71764-0118
Description 2.54mm (.100) Pitch C-Grid? Breakaway Header, Low Profile, Dual Row, Right Angle, High Temperature, 18 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating
2.54mm (.100") Pitch C-Grid庐 Breakaway Header, Low Profile, Dual Row, Right Angle, High Temperature, 18 Circuits, 0.38渭m (15渭") Gold (Au) Selective Plating

File Size 120.86K  /  5 Page

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Amphenol Communications Solutions

Part No. 20021211-00006T8LF
Description Minitek127®, Board/Wire to Board connector, Shrouded Vertical Header, Through Hole, Double Row, 6 Positions, 1.27 mm (.050in) Pitch.
Tech specs    

Official Product Page

    71764-0116

Molex Electronics Ltd.
Part No. 71764-0116
Description 2.54mm (.100) Pitch C-Grid? Breakaway Header, Low Profile, Dual Row, Right AngleHigh Temperature, 16 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating
2.54mm (.100") Pitch C-Grid庐 Breakaway Header, Low Profile, Dual Row, Right AngleHigh Temperature, 16 Circuits, 0.38渭m (15渭") Gold (Au) Selective Plating

File Size 121.10K  /  5 Page

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Amphenol Communications Solutions

Part No. 20021212-000A0T4LF
Description Minitek127®, Board/Wire to Board connector, Shrouded Right Angled Header, Through Hole, Double Row, 100 Positions, 1.27 mm (.050in) Pitch.
Tech specs    

Official Product Page

    71764-0114

Molex Electronics Ltd.
Part No. 71764-0114
Description 2.54mm (.100) Pitch C-Grid? Breakaway Header, Low Profile, Dual Row, Right Angle,High Temperature, 14 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating
2.54mm (.100") Pitch C-Grid庐 Breakaway Header, Low Profile, Dual Row, Right Angle,High Temperature, 14 Circuits, 0.38渭m (15渭") Gold (Au) Selective Plating

File Size 121.23K  /  5 Page

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Amphenol Communications Solutions

Part No. 10131319-02121G0LF
Description Minitek® Pwr 4.2 HCC, Dual Row, Vertical Through Hole Header, Gold Flash plating, Black Color, 2 Positions, GW Compatible Nylon66, Tray Packing.
Tech specs    

Official Product Page

    71764-0108

Molex Electronics Ltd.
Part No. 71764-0108
Description 2.54mm (.100) Pitch C-Grid? Breakaway Header, Low Profile, Dual Row, Right Angle,High Temperature, 8 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating
2.54mm (.100") Pitch C-Grid庐 Breakaway Header, Low Profile, Dual Row, Right Angle,High Temperature, 8 Circuits, 0.38渭m (15渭") Gold (Au) Selective Plating

File Size 121.01K  /  5 Page

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Amphenol Communications Solutions

Part No. 10137927-0212LF
Description Minitek® Pwr 3.0, Dual Row, Vertical SMT Tails and DIP Hold Down Header, Black Color, Tin plating, 2 Positions, Non GW Compatible LCP, Tape and Reel withcap.
Tech specs    

Official Product Page

    71764-0106

Molex Electronics Ltd.
Part No. 71764-0106
Description 2.54mm (.100) Pitch C-Grid? Breakaway Header, Low Profile, Dual Row, Right AngleHigh Temperature, 6 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating
2.54mm (.100") Pitch C-Grid庐 Breakaway Header, Low Profile, Dual Row, Right AngleHigh Temperature, 6 Circuits, 0.38渭m (15渭") Gold (Au) Selective Plating

File Size 121.09K  /  5 Page

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Amphenol Communications Solutions

Part No. G832MC111202122HR
Description 0.80mm Board-to-Board 100Ω Connector, Pitch 0.8mm, Height 4.7 mm, 120 Positions, Dual Row, BTB Vertical Plug SMT, 15u\\ Gold Black.
Tech specs    

Official Product Page

    71764-0004

Molex Electronics Ltd.
Part No. 71764-0004
Description 2.54mm (.100) Pitch C-Grid? Breakaway Header, Low Profile, Dual Row, Right AngleHigh Temperature, 4 Circuits, Tin (Sn) Plating
2.54mm (.100") Pitch C-Grid庐 Breakaway Header, Low Profile, Dual Row, Right AngleHigh Temperature, 4 Circuits, Tin (Sn) Plating

File Size 121.13K  /  5 Page

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Amphenol Communications Solutions

Part No. 20021221-00008T4LF
Description Minitek127®, Wire to Board connector, Shrouded vertical header, Surface Mount, Double Row, 8 Positions, 1.27mm (0.500in) Pitch.
Tech specs    

Official Product Page

    71764-0104

Molex Electronics Ltd.
Part No. 71764-0104
Description 2.54mm (.100) Pitch C-Grid? Breakaway Header, Low Profile, Dual Row, Right Angle,High Temperature, 4 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating
2.54mm (.100") Pitch C-Grid庐 Breakaway Header, Low Profile, Dual Row, Right Angle,High Temperature, 4 Circuits, 0.38渭m (15渭") Gold (Au) Selective Plating

File Size 121.22K  /  5 Page

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Amphenol Communications Solutions

Part No. 20021211-00012T1LF
Description Minitek127®, Board/Wire to Board connector, Shrouded Vertical Header, Through Hole, Double Row, 12 Positions, 1.27 mm (.050in) Pitch.
Tech specs    

Official Product Page

    71764-0026

Molex Electronics Ltd.
Part No. 71764-0026
Description 2.54mm (.100) Pitch C-Grid? Breakaway Header, Low Profile, Dual Row, Right AngleHigh Temperature, 26 Circuits, Tin (Sn) Plating
2.54mm (.100") Pitch C-Grid庐 Breakaway Header, Low Profile, Dual Row, Right AngleHigh Temperature, 26 Circuits, Tin (Sn) Plating

File Size 121.06K  /  5 Page

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Amphenol Communications Solutions

Part No. 20021221-000A0D8LF
Description Minitek127®, Wire to Board connector, Shrouded vertical header, Surface Mount, Double Row, 100 Positions, 1.27mm (0.500in) Pitch.
Tech specs    

Official Product Page

    71764-0024

Molex Electronics Ltd.
Part No. 71764-0024
Description 2.54mm (.100) Pitch C-Grid Breakaway Header, Low Profile, Dual Row, Right Angle, High Temperature, 24 Circuits
2.54mm (.100") Pitch C-Grid Breakaway Header, Low Profile, Dual Row, Right Angle, High Temperature, 24 Circuits

File Size 120.83K  /  5 Page

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Amphenol Communications Solutions

Part No. 68021-262HLF
Description BergStik®, Board to Board connector, Unshrouded Right Angled Header, Through Hole, Double Row, 62 Positions, 2.54 mm (0.100in) Pitch.
Tech specs    

Official Product Page

For 71764-0212 Found Datasheets File :: 150+       Page :: | 1 | <2> | 3 | 4 | 5 | 6 | 7 | 8 | 9 | 10 | 11 | 12 | 13 | 14 | 15 |   

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