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  63865-3270 Datasheet PDF File

For 63865-3270 Found Datasheets File :: 150+       Page :: | 1 | <2> | 3 | 4 | 5 | 6 | 7 | 8 | 9 | 10 | 11 | 12 | 13 | 14 | 15 |   

    63832-5000 63865-6070 63865-6270 63865-6000 63832-5170 63865-6170 63865-6100 63865-6200 63832-5100

Molex Electronics Ltd.
Part No. 63832-5000 63865-6070 63865-6270 63865-6000 63832-5170 63865-6170 63865-6100 63865-6200 63832-5100
Description MX150L垄芒 Application Tooling
MX150L Application Tooling

File Size 237.28K  /  1 Page

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Amphenol Communications Solutions

Part No. 65863-865PLF
Description Quickie Header, Wire to Board Connector, Double Row, 50 Positions, 2.54 mm (0.1 in.), Vertical, Eject Latch Header 0.76 um (30 u\\.) Gold Mating Plating.
Tech specs    

Official Product Page

HUA FENG CIRCUIT





    0638657000

Molex Electronics Ltd.
Part No. 0638657000
Description FineAdjust Applicator

File Size 33.58K  /  1 Page

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Amphenol Communications Solutions

Part No. 65863-270LF
Description Quickie Header, Wire to Board Connector, Double Row, 34 Positions, 2.54 mm (0.1 in.), Vertical, Eject Latch Header 0.76 um (30 u\\.) Gold Mating Plating.
Tech specs    

Official Product Page

    0638652000

Molex Electronics Ltd.
Part No. 0638652000
Description FineAdjust Applicator

File Size 33.52K  /  1 Page

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Amphenol Communications Solutions

Part No. UE78B132700321
Description SFP 2X1 STD DBL BEND TAB
Tech specs    

Official Product Page

    MT3270

Mitel Networks Corporation
Part No. MT3270
Description Wide Dynamic Range DTMF Receiver

File Size 64.60K  /  8 Page

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Amphenol Communications Solutions

Part No. 10138327-01103ZLF
Description PCI Express® GEN 3 Card Edge, Storage and Server Connector, Vertical, Through Hole, x16, 164 Positions, 1.00mm (0.039in) Pitch
Tech specs    

Official Product Page

    TE Connectivity Ltd
Part No. 293270-6 293270-5 293270-1 293270-2 293270-4
Description REVISED PER ECR-17-008252

File Size 744.36K  /  3 Page

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Amphenol Communications Solutions

Part No. 75160-327-02LF
Description BergStik®, Board to Board connector, Unshrouded vertical header, through hole, single Row,2 position, 2.54mm pitch
Tech specs    

Official Product Page

    ATS-53270K-C2-R0

Advanced Thermal Solutions, Inc.
Part No. ATS-53270K-C2-R0
Description High Performance BGA Cooling

File Size 258.99K  /  1 Page

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Amphenol Communications Solutions

Part No. 75844-327-06LF
Description BergStik®, Board to Board connector, Unshrouded vertical header, Through Hole, Double Row, 6 Positions, 2.54mm (0.100in) Pitch.
Tech specs    

Official Product Page

    ATS-53270R-C2-R0

Advanced Thermal Solutions, Inc.
Advanced Thermal Soluti...
Part No. ATS-53270R-C2-R0
Description High Performance BGA Cooling
   High Performance BGA Cooling

File Size 258.99K  /  1 Page

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Amphenol Communications Solutions

Part No. 75168-327-02LF
Description BergStik®, Board to Board connector, Unshrouded Right Angled header, Through Hole, Single Row, 02 Positions, 2.54mm (0.100in) Pitch.
Tech specs    

Official Product Page

    ATS-53270D-C2-R0

Advanced Thermal Solutions, Inc.
Part No. ATS-53270D-C2-R0
Description High Performance BGA Cooling

File Size 259.00K  /  1 Page

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Amphenol Communications Solutions

Part No. 75160-327-07LF
Description BergStik®, Board to Board connector, Unshrouded vertical header, through hole, single Row,7 position, 2.54mm pitch
Tech specs    

Official Product Page

    Advanced Thermal Soluti...
Part No. ATS-53270B-C1-R0
Description High Performance BGA Cooling Solutions with maxiGRIP?Attachment

File Size 2,645.25K  /  1 Page

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Amphenol Communications Solutions

Part No. UE78B532700321
Description 2X5 SFP COMBO GND TABS
Tech specs    

Official Product Page

    Advanced Thermal Soluti...
Part No. ATS-53270R-C1-R0
Description    BGA Heat Sink - High Performance

File Size 242.58K  /  1 Page

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Amphenol Communications Solutions

Part No. 75844-327-08LF
Description BergStik®, Board to Board connector, Unshrouded vertical header, Through Hole, Double Row, 8 Positions, 2.54mm (0.100in) Pitch.
Tech specs    

Official Product Page

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