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  001118-4830 Datasheet PDF File

For 001118-4830 Found Datasheets File :: 150+       Page :: | 1 | <2> | 3 | 4 | 5 | 6 | 7 | 8 | 9 | 10 | 11 | 12 | 13 | 14 | 15 |   

    1118-5032 11-18-5032 0011-18-5032 001118-5032

Molex Electronics Ltd.
Part No. 1118-5032 11-18-5032 0011-18-5032 001118-5032
Description Combination Anvil

File Size 11.51K  /  1 Page

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Amphenol Communications Solutions

Part No. 68001-118HLF
Description BergStik®, Board to Board connector, Unshrouded vertical header, Through Hole, Single Row, , 18 Positions, 2.54 mm (0.100in) Pitch.
Tech specs    

Official Product Page

HUA FENG CIRCUIT





    0011-18-4211 01118-4211 001118-4211

Molex Electronics Ltd.
Part No. 0011-18-4211 01118-4211 001118-4211
Description Barrel Form Anvil

File Size 11.60K  /  1 Page

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Amphenol Communications Solutions

Part No. 10117948-3040HLF
Description mini-SAS HD Copper Cable Assemblies, Cable Assemblies, 28AWG Wire Size, 3Gb/s Data Rate, Minisas HD : 72; Minisas : 26(x2) Contacts, 8 Signal Pairs.
Tech specs    

Official Product Page

    1118-4981 001118-4981 11-18-4981 0011-18-4981

Molex Electronics Ltd.
Part No. 1118-4981 001118-4981 11-18-4981 0011-18-4981
Description Insulation Punch

File Size 14.53K  /  1 Page

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Amphenol Communications Solutions

Part No. 10114830-11108LF
Description 1.25mm Wire to Board Wafer, Right Angle, Surface Mount, 8 Positions
Tech specs    

Official Product Page

    1118-4977 11-18-4977 001118-4977

Molex Electronics Ltd.
Part No. 1118-4977 11-18-4977 001118-4977
Description Cut-off Punch
   Cut-off Punch

File Size 11.65K  /  1 Page

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Amphenol Communications Solutions

Part No. 10114830-11111LF
Description 1.25mm Wire to Board Wafer, Right Angle, Surface Mount, 11 Positions
Tech specs    

Official Product Page

    1118-4982 0011-18-4982 001118-4982

Molex Electronics Ltd.
Part No. 1118-4982 0011-18-4982 001118-4982
Description Insulation Anvil

File Size 16.14K  /  1 Page

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Amphenol Communications Solutions

Part No. 10114830-11113LF
Description 1.25mm Wire to Board Wafer, Right Angle, Surface Mount, 13 Positions
Tech specs    

Official Product Page

    0011-18-5208 001118-5208

Molex Electronics Ltd.
Part No. 0011-18-5208 001118-5208
Description Conductor Punch

File Size 11.48K  /  1 Page

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Amphenol Communications Solutions

Part No. 10114830-10113LF
Description 1.25mm Wire to Board Wafer, Right Angle, Surface Mount, 13 Positions
Tech specs    

Official Product Page

    001118-5372 0011-18-5372

Molex Electronics Ltd.
Part No. 001118-5372 0011-18-5372
Description Conductor Punch

File Size 14.32K  /  1 Page

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Amphenol Communications Solutions

Part No. 10114830-11110LF
Description 1.25mm Wire to Board Wafer, Right Angle, Surface Mount, 10 Positions
Tech specs    

Official Product Page

    0011-18-4524 001118-4524

Molex Electronics Ltd.
Part No. 0011-18-4524 001118-4524
Description Insulation Punch

File Size 11.48K  /  1 Page

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Amphenol Communications Solutions

Part No. 10114830-10112LF
Description 1.25mm Wire to Board Wafer, Right Angle, Surface Mount, 12 Positions
Tech specs    

Official Product Page

    001118-4154

Molex Electronics Ltd.
Part No. 001118-4154
Description Anvil

File Size 11.64K  /  1 Page

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Amphenol Communications Solutions

Part No. 77311-483-04LF
Description BergStik®, Board to Board connector, Unshrouded vertical Header, Through Hole, Single Row, 04 Positions, 2.54 mm Pitch.
Tech specs    

Official Product Page

    001118-2130 01118-2130

Molex Electronics Ltd.
Part No. 001118-2130 01118-2130
Description Mini-Mac Applicator

File Size 22.49K  /  1 Page

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Amphenol Communications Solutions

Part No. 10117948-3010HLF
Description mini-SAS HD Copper Cable Assemblies, Cable Assemblies, 28AWG Wire Size, 3Gb/s Data Rate, Minisas HD : 72; Minisas : 26(x2) Contacts, 8 Signal Pairs.
Tech specs    

Official Product Page

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