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For contamination Found Datasheets File :: 2038    Search Time::0.875ms    
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    RMPA1965NBSP RMPA1965

Fairchild Semiconductor, Corp.
Fairchild Semiconductor Corporation
Part No. RMPA1965NBSP RMPA1965
OCR Text ...omponent placement to ensure no contamination or damage to RF, DC and ground contact areas. * Device Cleaning: Standard board cleaning techniques should not present device problems provided that the boards are properly dried to remove solve...
Description US-PCS CDMA, CDMA2000-1X and WCDMA PowerEdge Power Amplifier Module 1850 MHz - 1910 MHz RF/MICROWAVE NARROW BAND LOW POWER AMPLIFIER

File Size 107.31K  /  9 Page

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    SC275..5.SERIES

International Rectifier
Part No. SC275..5.SERIES
OCR Text ...in dessicated nitrogen, with no contamination. Shelf life for parts stored in above condition is 2 years. If the storage is done in normal atmosphere shelf life is reduced to six months. Packaging Device # SC275xxxxx5B SC275xxxxx5R SC27...
Description SCHOTTKY DIE 275 x 275 mils

File Size 139.88K  /  5 Page

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    IRLC1304 2299

International Rectifier
Part No. IRLC1304 2299
OCR Text ...in dessicated nitrogen, with no contamination For optimum electrical results, die attach temperature should not exceed 300C Die Outline 3/23/99
Description HEXFET Power MOSFET Die in Wafer Form(晶圆形式的HEXFET 功率MOS场效应管)
From old datasheet system
HEXFET? Power MOSFET Die in Wafer Form

File Size 30.44K  /  1 Page

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    S8065

LittelFuse
Part No. S8065
OCR Text ...liable barrier against junction contamination. Variations of devices covered in this data sheet are available for custom design applications. Consult the factory for more information. Features * * * * Electrically-isolated package High ...
Description ILICON CONTROLLED RECTIFIER,800V V
From old datasheet system

File Size 207.76K  /  12 Page

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    IRFC37N50A

International Rectifier
Part No. IRFC37N50A
OCR Text ...in dessicated nitrogen, with no contamination For optimum electrical results, die attach temperature should not exceed 300C Die Outline 11/1/99
Description HEXFET? Power MOSFET Die in Wafer Form

File Size 25.20K  /  1 Page

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    Q2008R4

LittelFuse
Part No. Q2008R4
OCR Text ...liable barrier against junction contamination. Variations of devices covered in this data sheet are available for custom design applications. Consult factory for more information. Features * * * * Electrically-isolated packages Glass-pa...
Description RIAC,200V V(DRM),8A I(T)RMS,TO-220VAR
From old datasheet system

File Size 224.13K  /  10 Page

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    S1231 2589

International Rectifier
Part No. S1231 2589
OCR Text ...in dessicated nitrogen, with no contamination www.irf.com 1 S1231 Bulletin I0143J 01/01 Outline Table All dimensions are in millimeters Wafer Layout TOP VIEW N 293 Basic Cells All dimensions are in millimeters 2 ...
Description PHASE CONTROL THYRISTORS
From old datasheet system

File Size 56.41K  /  2 Page

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    S1233 2591

International Rectifier
Part No. S1233 2591
OCR Text ...in dessicated nitrogen, with no contamination www.irf.com 1 S1233 Bulletin I0142J 01/01 Outline Table All dimensions are in millimeters Wafer Layout TOP VIEW N 76 Basic Cells All dimensions are in millimiters 2 ...
Description PHASE CONTROL THYRISTORS
From old datasheet system

File Size 27.54K  /  2 Page

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    S1234 2592

International Rectifier
Part No. S1234 2592
OCR Text ...in dessicated nitrogen, with no contamination S1234 Bulletin I0140J 01/01 Outline Table All dimensions are in millimeters Wafer Layout TOP VIEW N 37 Basic Cells All dimensions are in micron All dimensions are in millimiter...
Description PHASE CONTROL THYRISTORS
From old datasheet system

File Size 57.05K  /  2 Page

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    FD060U02A5B

International Rectifier
Part No. FD060U02A5B
OCR Text ...in dessicated nitrogen, with no contamination Packaging Device # FD060xxxx5B FD060xxxx5R FD060xxxx5P FD060xxxx5F Description Inked Probed Unsawn Wafer (Wafer in Box) Probed Die in Tape & Reel Probed Die in Waffle Pack Inked Probed ...
Description Fred Die in Wafer Form

File Size 59.11K  /  3 Page

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