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  71308-5470 Datasheet PDF File

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    71308-5428 0713085428

Molex Electronics Ltd.
Part No. 71308-5428 0713085428
Description 2.54mm (.100) Pitch C-Grid Header, Surface Mount, Dual Row, Vertical, 28 Circuits, 1.50um (59u) Minimum
File Size 1,475.56K  /  8 Page

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Amphenol Communications Solutions
Part No. 79425-470HLF
Description BergStik® 2.54mm, Board to Board connector, Unshrouded Header, Through Hole, Double Row, 70 Positions, 2.54 mm Pitch, Vertical, 4.83 mm (0.19 in.) Mating, 3.05 mm (0.12 in.) Tail.
Tech specs 　 　

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HUA FENG CIRCUIT





    71308-5426 0713085426

Molex Electronics Ltd.
Part No. 71308-5426 0713085426
Description 2.54mm (.100) Pitch C-Grid? Header, Surface Mount, Dual Row, Vertical, 26 Circuits,1.50μm (59μ) Minimum Bright Tin (Sn) Over Nickel (Ni) Plating, without PCB Locator
File Size 1,475.56K  /  8 Page

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Amphenol Communications Solutions
Part No. 95547-050CAHLF
Description Assembly, Top Mount, S/D(68Pins), VTB, Type 123, 5V, 5mm s/o, Right Push Rod Eject, 8mm Card Travel
Tech specs 　 　

Official Product Page

    91577-1308 0915771308

Molex Electronics Ltd.
Part No. 91577-1308 0915771308
Description 1.27mm (.050) Pitch Picoflex PF-50 IDT Receptacle, Low Profile, Alternative Stagger, Board-In, 8 Circuits
File Size 186.11K  /  4 Page

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Amphenol Communications Solutions
Part No. 95547-050CALF
Description Assembly, Top Mount, S/D(68Pins), VTB, Type 123, 5V, 5mm s/o, Right Push Rod Eject, 8mm Card Travel
Tech specs 　 　

Official Product Page

    0713086412 71308-6412

Molex Electronics Ltd.
Part No. 0713086412 71308-6412
Description 2.54mm (.100) Pitch C-Grid? Header, Surface Mount, Dual Row, Vertical, 12 Circuits1.50μm (59μ) Minimum Bright Tin (Sn) Over Nickel (Ni) Plating, with 3.30mm (.130
File Size 1,475.56K  /  8 Page

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Amphenol Communications Solutions
Part No. 95547-040CALF
Description Assembly, Top Mount, S/D(68Pins), VTB, Type 123, 5V, 4.3mm s/o, Right Push Rod Eject, 8mm Card Travel
Tech specs 　 　

Official Product Page

    0713086436

Molex Electronics Ltd.
Part No. 0713086436
Description 2.54mm (.100) Pitch C-Grid? Header, Surface Mount, Dual Row, Vertical, 36 Circuits1.50μm (59μ) Minimum Bright Tin (Sn) Over Nickel (Ni) Plating, with 3.30mm (.130)
File Size 1,475.57K  /  8 Page

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Amphenol Communications Solutions
Part No. 95547-020CALF
Description Assembly, Top Mount, S/D(68Pins), VTB, Type 123, 5V, 2.2mm s/o, Right Push Rod Eject, 8mm Card Travel
Tech specs 　 　

Official Product Page

    0713086428 71308-6428

Molex Electronics Ltd.
Part No. 0713086428 71308-6428
Description 2.54mm (.100) Pitch C-Grid? Header, Surface Mount, Dual Row, Vertical, 28 Circuits,1.50μm (59μ) Minimum Bright Tin (Sn) Over Nickel (Ni) Plating, with 3.30mm (.130)
File Size 1,475.57K  /  8 Page

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Amphenol Communications Solutions
Part No. 68695-470HLF
Description BergStik® 2.54mm, Board To Board Connector, Unshrouded Header, Through Hole, Double Row, 70 Positions, 2.54mm Pitch, Right Angle, 5.84mm (0.23in) Mating, 2.29mm (0.09in) Tail.
Tech specs 　 　

Official Product Page

    0713086416 71308-6416

Molex Electronics Ltd.
Part No. 0713086416 71308-6416
Description 2.54mm (.100) Pitch C-Grid Header, Surface Mount, Dual Row, Vertical, 16 Circuits, 1.50um (59u) Minimum
File Size 1,475.56K  /  8 Page

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Amphenol Communications Solutions
Part No. 10157547-0011SR1LF
Description Minitek® Multipitch™,1.25mm Crimp-to-Wire Connector Platform, Wire to Board Header, 11 Position, Top Latch, Tin (preplated)
Tech specs 　 　

Official Product Page

    0713086420 71308-6420

Molex Electronics Ltd.
Part No. 0713086420 71308-6420
Description 2.54mm (.100) Pitch C-Grid? Header, Surface Mount, Dual Row, Vertical, 20 Circuits1.50μm (59μ) Minimum Bright Tin (Sn) Over Nickel (Ni) Plating, with 3.30mm (.130)
File Size 1,475.56K  /  8 Page

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Amphenol Communications Solutions
Part No. 10157547-0010SR1LF
Description Minitek® Multipitch™,1.25mm Crimp-to-Wire Connector Platform, Wire to Board Header, 10 Position, Top Latch, Tin (preplated)
Tech specs 　 　

Official Product Page

    0713086434 71308-6434

Molex Electronics Ltd.
Part No. 0713086434 71308-6434
Description 2.54mm (.100) Pitch C-Grid? Header, Surface Mount, Dual Row, Vertical, 34 Circuits1.50μm (59μ) Minimum Bright Tin (Sn) Over Nickel (Ni) Plating, with 3.30mm (.130)
File Size 1,475.56K  /  8 Page

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Amphenol Communications Solutions
Part No. 10157547-0003SR1LF
Description Minitek® Multipitch™,1.25mm Crimp-to-Wire Connector Platform, Wire to Board Header, 3 Position, Top Latch, Tin (preplated)
Tech specs 　 　

Official Product Page

    0713086426 71308-6426

Molex Electronics Ltd.
Part No. 0713086426 71308-6426
Description 2.54mm (.100) Pitch C-Grid Header, Surface Mount, Dual Row, Vertical, 26 Circuits
File Size 1,475.57K  /  8 Page

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Amphenol Communications Solutions
Part No. 10157547-0013SR1LF
Description Minitek® Multipitch™,1.25mm Crimp-to-Wire Connector Platform, Wire to Board Header, 13 Position, Top Latch, Tin (preplated)
Tech specs 　 　

Official Product Page

For 71308-5470 Found Datasheets File :: 150+       Page :: | 1 | 2 | 3 | 4 | 5 | 6 | 7 | 8 | 9 | 10 | 11 | 12 | 13 | 14 | <15> |   

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