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  90130-1144 Datasheet PDF File

For 90130-1144 Found Datasheets File :: 150+       Page :: | 1 | 2 | 3 | 4 | 5 | 6 | 7 | 8 | 9 | 10 | 11 | 12 | 13 | <14> | 15 |   

    0901303350

Molex Electronics Ltd.
Part No. 0901303350
Description 2.54mm (.100) Pitch C-Grid III Header, Dual Row, Right Angle, Shrouded, Fully Loaded, 50 Circuits, Black 0.76μm (30μ) Gold (Au) Selective Plating

File Size 224.10K  /  4 Page

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Amphenol Communications Solutions

Part No. 68690-130HLF
Description BergStik®, Board to Board connector, Unshrouded Vertical Header, Through Hole, Double Row, 30 Positions, 2.54 mm (0.100in)Pitch.
Tech specs    

Official Product Page

HUA FENG CIRCUIT





    0901303114

Molex Electronics Ltd.
Part No. 0901303114
Description 2.54mm (.100) Pitch C-Grid III Header, Dual Row, Right Angle, Shrouded, Fully Loaded, 14 Circuits, Black, 3μm (118μ) Tin (Sn) over Nickel (Ni)

File Size 168.44K  /  4 Page

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Amphenol Communications Solutions

Part No. 92090-130LF
Description Minitek® 2.00mm, Board to Board, PCB mounted Receptacle, Vertical, Surface Mount, Double Row, Top Entry, 30 Positions, 2.00mm (0.079in) Pitch..
Tech specs    

Official Product Page

    0190130032

Molex Electronics Ltd.
Part No. 0190130032
Description InsulKrimp Fully Insulated Piggyback Quick Disconnect, Tab 6.35mm (.250) by0.81mm (.032), 14-16 AWG, Blue Insulator, Tape and Reel
MOLEX Connector

File Size 97.63K  /  2 Page

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Amphenol Communications Solutions

Part No. 10065490-130TRLF
Description Minitek® 2.00mm, Board To Board, Receptacle, Vertical, Surface Mount, Double Row, 30 Positions, 2.00mm (0.079in) Pitch.
Tech specs    

Official Product Page

    0190130031

Molex Electronics Ltd.
Part No. 0190130031
Description InsulKrimp Fully Insulated Piggyback Quick Disconnect, Tab 6.35mm (.250) by0.81mm (.032), 14-16 AWG, Expanded Blue Insulator, Loose
MOLEX Connector

File Size 97.25K  /  2 Page

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Amphenol Communications Solutions

Part No. 78290-130HLF
Description BergStik® 2.54mm, Board to Board connector, Unshrouded Header, Through Hole, Single Row, 30 Positions, 2.54 mm Pitch, Vertical, 16.51 mm (0.65in) Mating, 12.7 mm (0.5in) Tail.
Tech specs    

Official Product Page

    0901303112

Molex Electronics Ltd.
Part No. 0901303112
Description 2.54mm (.100) Pitch C-Grid III Header, Dual Row, Right Angle, Shrouded, Fully Loaded, 12 Circuits, Black, 3μm (118μ) Tin (Sn) over Nickel (Ni)

File Size 168.44K  /  4 Page

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Amphenol Communications Solutions

Part No. L17H2990130
Description Dsub, Stamped Signal 3A, Dual Port Right Angle PCB Thru Hole, F=19.05mm (0.750in), 26/26 (Socket/Socket), Flash Gold, Bright Tin Shell, 4-40 Threaded Rear Insert, 4*Arrowhead Boardlock
Tech specs    

Official Product Page

    0190130029 190130029

Molex Electronics Ltd.
Part No. 0190130029 190130029
Description InsulKrimp Fully Insulated Piggyback Quick Disconnect, Tab 6.35mm (.250) by0.81mm (.032), 14-16 AWG, Blue Insulator, Tape
InsulKrimp垄芒 Fully Insulated Piggyback Quick Disconnect, Tab 6.35mm (.250") by0.81mm (.032"), 14-16 AWG, Blue Insulator, Tape
MOLEX Connector

File Size 107.35K  /  2 Page

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Amphenol Communications Solutions

Part No. 69190-130HLF
Description BergStik®, Board to Board connector, Unshrouded vertical header, Through Hole, Single Row, 30 Positions, 2.54 mm (0.100in) Pitch.
Tech specs    

Official Product Page

    0901303110

Molex Electronics Ltd.
Part No. 0901303110
Description 2.54mm (.100) Pitch C-Grid III Header, Dual Row, Right Angle, Shrouded, Fully Loaded, 10 Circuits, Black, 3μm (118μ) Tin (Sn) over Nickel (Ni)

File Size 168.44K  /  4 Page

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Amphenol Communications Solutions

Part No. 10114492-008LF
Description HPCE R/A REC 32P24S
Tech specs    

Official Product Page

    90130-1150 0901301150

Molex Electronics Ltd.
Part No. 90130-1150 0901301150
Description 2.54mm (.100) Pitch C-Grid III Header, Dual Row, Vertical, Shrouded, Fully Loaded, 50 Circuits, Black, 3μm (118μ) Tin (Sn) over Nickel (Ni)

File Size 585.88K  /  7 Page

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Amphenol Communications Solutions

Part No. 87901-144HLF
Description BergStik® 2.54mm, Board to Board connector, Unshrouded Header, Through Hole, Double Row, 44 Positions, 2.54 mm Pitch, Vertical, 20.83 mm (0.82in) Mating, 3.05 mm (0.12in) Tail.
Tech specs    

Official Product Page

    90130-1224 0901301224

Molex Electronics Ltd.
Part No. 90130-1224 0901301224
Description 2.54mm (.100) Pitch C-Grid III Header, Dual Row, Vertical, Shrouded, Fully Loaded, 24 Circuits, Black, 0.38μm (15μ) Gold (Au) Selective Plating
2.54mm (.100) Pitch C-Grid III垄芒 Header, Dual Row, Vertical, Shrouded, Fully Loaded, 24 Circuits, Black, 0.38楼矛m (15楼矛) Gold (Au) Selective Plating

File Size 586.12K  /  7 Page

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Amphenol Communications Solutions

Part No. 89361-144SLF
Description Minitek® IDC 2.00mm Pitch, Wire To Board Connector, Receptacle.
Tech specs    

Official Product Page

    0901303126-17

Molex Electronics Ltd.
Part No. 0901303126-17
Description C-Grid III Header, Dual Row, Right Angle, Shrouded, Fully Loaded, 26 Circuits, Black

File Size 24.75K  /  2 Page

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Amphenol Communications Solutions

Part No. 10128492-114400ULF
Description ExaMEZZ® 56Gbps High Speed Mezzanine Connector System, Mezzanine, Vertical, 4 pair, 19 column, 266 Positions, Press-Fit termination, 2.00mm (0.078in) Pitch.
Tech specs    

Official Product Page

For 90130-1144 Found Datasheets File :: 150+       Page :: | 1 | 2 | 3 | 4 | 5 | 6 | 7 | 8 | 9 | 10 | 11 | 12 | 13 | <14> | 15 |   

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